KR100241698B1 - Heat exhaust apparatus of semiconductor manufacture - Google Patents

Abstract

The present invention relates to a heat exhaust device of a semiconductor manufacturing equipment that minimizes the influence of equipment and wafers due to heat by forcibly exhausting heat to the outside of a work room by installing exhaust ducts assembled into blocks at the lower end of the semiconductor manufacturing equipment.

The present invention provides a semiconductor manufacturing equipment having a heat generating portion inside the main body and the lower part of the main body is opened, is installed along the lower end of the main body to maintain the airtight between the bottom surface and the lower end, and as a hollow hollow form An exhaust duct having a suction port communicating with the inside of the main body at a side thereof, and a pumping motor for forcibly evacuating heat inside the main body by connecting a hose to the exhaust duct.

Therefore, it prevents overheating of manufacturing equipment, prevents stoppage or breakdown of manufacturing equipment, maintains working environment of proper temperature, minimizes the influence of work room and worker by heating part, and can be installed and disassembled whenever necessary. It is free and compatible, economical, and has the effect of preventing dust, noise and vibration generated from the pumping motor from affecting the interior of the workshop.

Description

Heat exhaust device of semiconductor manufacturing equipment

The present invention relates to a heat exhaust device of a semiconductor manufacturing equipment, and more particularly, by installing an exhaust duct assembled in a block at the lower end of the semiconductor manufacturing equipment to enable universal use by forcibly exhausting heat to the outside of the work room due to heat equipment and wafers The heat exhaust device of the semiconductor manufacturing equipment to minimize the impact of the.

Heat is a type of energy that transfers energy in three or single ways: radiation, convection, and conduction. The general direction of heat transfer is from a relatively high energy density to a lower object.

Among them, convective heat transfer is not as fast as heat transfer and the distance of heat transfer is generally not as wide, but radiant heat transfer is relatively easy to block radiant rays, while convective heat transfer is relatively difficult to completely seal the heat transfer medium. Therefore, it was a great difficulty to block the heat transfer in the convection form, especially in various workplaces that handle high heat generating parts.

In general, semiconductor manufacturing processes use thermal energy to promote chemical reactions such as diffusion, etching, and chemical vapor deposition, to adjust the degree of wafer processing, and to generate such thermal energy, various facilities have a high temperature heating part.

Since the heat generating part that supplies thermal energy during wafer processing is mostly performed in the process chamber, the heat generating part is rarely directly exposed to the outside, but indirectly, heat is transferred to the air which is indirectly in contact with the heat by casing of the heat generating part. Even if the equipment with high power consumption or equipment with low power consumption, such as electronic equipment such as a control unit, inspection equipment, and light emitting equipment, is used for a long time in an enclosed space, the equipment is overheated, and sometimes a heating part is formed to form a high temperature of several hundred degrees. .

The heat generation of the semiconductor manufacturing equipment increases the room temperature of the work room in the form of convection. Therefore, in the semiconductor processing line, a ventilation device and a ventilation device are provided in the work room in consideration of such heat generation of the semiconductor manufacturing equipment. Therefore, the heat generated from the heat-generating part of each semiconductor manufacturing equipment is convection in the form of convection and natural exhaust from the manufacturing equipment to the work area, and if the exhaust air of the manufacturing equipment with natural exhaust increases the average temperature of the work room, the ventilation and ventilation of the work room becomes more The exhausted air was discharged out of the room to keep the room at a constant temperature.

The semiconductor manufacturing equipment to which the natural exhaust method is applied usually has a pedestal for the worker to stand or sit on, and a main body of which the bottom surface of the manufacturing equipment is opened so that the upper and both sides are blocked to protect the equipment and facilitate ventilation. Consists of Usually, the heat generating unit is located at the top of the pedestal where the process is performed.

A natural exhaust type heat exhaust state of a general semiconductor manufacturing equipment is shown in FIG. 1.

As shown in FIG. 1, the semiconductor manufacturing equipment forms a heat supply unit or a heat generation unit 12 which is inherently overheated by heat generation of the device itself, which inevitably dissipates heat to the outside by heat transfer, and the upper and both sides of the semiconductor manufacturing equipment are protected. And it is composed of the main body 10 of the lower bottom structure is open to facilitate ventilation.

Referring to the conventional natural exhaust type heat exhaust process, the air surrounding the heat generating unit 12 receives heat energy from the heat generating unit 12 and the temperature rises, and the temperature rises and the lightened air rises to other spaces around. Will move. When the hot air is filled inside the main body of the semiconductor manufacturing equipment 10 by the circulation of the air, the hot air is discharged through the lower gap that is opened while being mixed with external air outside the relatively low temperature equipment.

This natural exhaust type heat exhaust method is particularly sensitive to temperature as the temperature of the manufacturing equipment is locally stacked and the temperature rises in the manufacturing equipment while the surrounding air in contact with the heating part forms a high temperature and is filled inside the equipment. It may cause the whole stop or breakdown. In addition, not only the processing defect of the wafer itself caused by the high temperature working environment but also the worker in charge of overheating manufacturing equipment outside the working temperature becomes difficult to work due to heat, which reduces the working efficiency of the worker and increases the defective rate. There was this.

Conventional conventional approach to solve this problem of the natural exhaust method is manufactured by installing a fan 14 that drills the exhaust port 16 in the ceiling of the upper side of the manufacturing equipment and rotates in the exhaust port 16 as shown in FIG. It was to install a forced exhaust type heat exhaust system that forcibly sucks high-temperature air generated from the heat generating portion 12 of the equipment and discharges it to the work room outside the manufacturing equipment.

The forced exhaust type heat exhaust device of the manufacturing equipment is equipped with a rotating fan before the hot air whose temperature rises due to the heat generation unit affects the wafer or the manufacturing equipment being processed and forcibly heats the heated air inside the main body of the manufacturing equipment. Inhalation and exhaust could prevent local overheating of manufacturing equipment to some extent.

However, because the superheated air inside the manufacturing equipment is discharged only to the outside of the manufacturing equipment, the exhaust air remains inside the work room and affects other workers who are in close proximity to the superheated manufacturing equipment until it is exhausted out of the work room by ventilators and ventilators installed in the work room. And causing overheating of other adjacent manufacturing equipment, and thus, temperature-sensitive manufacturing equipment was frequently stopped or broken. Moreover, the forced exhaust type heat exhaust system is additionally manufactured by the manufacturer of each manufacturing equipment so that it is not compatible with other manufacturing equipment and is expensive, and it is often impossible to install it if necessary to install it after purchase of the manufacturing equipment. . In addition, even when the manufacturing equipment is not overheated, it always runs, causing unnecessary power consumption. Therefore, it was difficult to install easily in consideration of the characteristics of the work to be changed, the environment of the workroom, economics, and the like.

In addition, since the exhaust port and the fan installed on the ceiling of the main body are difficult to manage and the fan and the motor driving the fan are installed in the main body of the manufacturing equipment, various noises and vibrations are transmitted to the manufacturing equipment without filtration, and dust generated by the motor and the fan is generated. There was a problem of contaminating the workroom and the manufacturing equipment and thus increase the defect of the wafer.

The present invention is to solve the conventional problems as described above, the purpose is to prevent overheating of the manufacturing equipment due to the heating unit to prevent the stop or failure of the manufacturing equipment and to improve the work efficiency by maintaining the working environment of the appropriate temperature The present invention provides a heat exhaust device for semiconductor manufacturing equipment.

Another object of the present invention is to provide a heat exhaust device of a semiconductor manufacturing equipment that minimizes the influence of the work room and the operator by the heat generating portion by forcibly exhausting the hot air by the heat generating portion of the manufacturing equipment to the outside of the work room.

Still another object of the present invention is to provide a heat exhaust device of a semiconductor manufacturing equipment that can be installed and disassembled at any time even after purchase of the manufacturing equipment, and is compatible with other equipment without additional manufacturing of the manufacturing equipment. .

Still another object of the present invention is to provide a heat exhaust device for semiconductor manufacturing equipment which operates only when necessary and reduces power consumption, thereby improving economic efficiency.

Another object of the present invention is located in the lower end of the manufacturing equipment is easy to install, disassemble, and move, easy to manage and the pumping motor is installed outside the work room dust, noise and vibration generated from the pumping motor affects the work room interior The present invention provides a heat exhaust device for semiconductor manufacturing equipment.

1 is a perspective view showing a natural exhaust heat exhaust state of the conventional semiconductor manufacturing equipment.

2 is a perspective view showing a forced exhaust type heat exhaust device of a conventional semiconductor manufacturing equipment.

Figure 3 is a perspective view of a semiconductor manufacturing equipment showing the installation state of the heat exhaust apparatus according to the present invention.

Figure 4 is an exploded perspective view showing a coupling state of the exhaust duct in the heat exhaust device of the present invention.

5 is a cross-sectional view taken along the line A-A of FIG.

6 is an exploded perspective view showing another coupling state of the exhaust duct in the heat exhaust device of the present invention.

※ Explanation of codes for main parts of drawing

10: main body 12: heat generating portion

14: Fan 16: Air Vent

20: exhaust duct 20a: corner block

20b: middle block 20c: end block

21: suction port 22: fixed bar

23: lid 24: hanger

25: hose 26: pumping motor

27: control unit 28: power supply unit

29: temperature sensor 30: locking projection

32: engaging groove 40: fixed top plate

42: fixing plate 44: fixing screw

46: through hole

The purpose of the semiconductor manufacturing equipment having a heat generating portion inside the main body and the lower part of the main body is open, is installed along the lower end of the main body to maintain the airtight between the bottom surface and the lower end and as a hollow hollow form Achieved by the heat exhaust device of the semiconductor manufacturing equipment, characterized in that the exhaust duct formed with a suction port communicating with the inside of the main body on the side and a pumping motor for forcibly exhausting the heat inside the main body by connecting a hose to the exhaust duct Can be.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a perspective view showing a state in which a heat exhaust device according to a preferred embodiment of the present invention is installed in a semiconductor manufacturing equipment.

Referring to Figure 3 in the conventional semiconductor manufacturing equipment heat exhaust apparatus of the present invention has a groove to maintain the airtight with the main body 10 along the lower end of the main body 10, the lower portion of the inlet 21 Hose that serves as a passage for the air discharged connected to the exhaust bar duct 20 and the fixed bar 22 and the hanger 24 and the exhaust duct 20 are assembled to the blocks pierced ( 25) and the power supply to the fan 14 and the pumping motor 26 to maintain the rotational force to the fan 14 and the rotating fan 14 to forcibly suck air through the hose 25 and to discharge to the outside of the working room It is provided with a power supply unit 28 for supplying.

In addition, the control unit 27 for controlling the power supply unit 28 to operate the pumping motor 26 only when the temperature measured by the temperature sensor 29 and the temperature sensor 29 provided in the manufacturing equipment is more than the appropriate temperature. do.

Referring to the operation of the heat exhaust device according to the present invention, the heat generating unit 12 is formed inside the main body 10 so that the air contacting the heat generating unit 12 is mixed with the surrounding air by convection when heated by receiving heat energy. Heat energy is propagated. When the temperature inside the heat generating unit 12 and the manufacturing equipment rises due to the propagated thermal energy, the temperature sensor 29 detects this, sends a temperature signal to the control unit 27, receives the temperature signal, and the control unit 27 supplies the power supply unit 28. ) To operate the pumping motor 26. Therefore, before the heated air is stagnated in the main body 10, the main body 10 exits out of the main body 10 through the inlets of the exhaust duct 20 in which the vacuum pressure is formed.

The air is sucked through the hose 25 connected to the pumping motor 26 along the hollow exhaust duct 20 in the hollow state, and the fan 14 installed to rotate by receiving rotational force from the pumping motor 26 rotates while being rotated. The pressure difference is induced inside and outside the wing to maintain the vacuum pressure in the exhaust duct 20 and the hose 25.

The exhaust duct 20 may have a shape surrounding all of the lower part of the main body 10, and is preferably a ″ ″ shape in consideration of a worker's convenience. In addition, the exhaust duct 20 of a straight or other shape may be used depending on the type of manufacturing equipment.

4 is an exploded perspective view showing a state in which the exhaust duct 20 is separated into each block. Referring to FIG. 4, the edge block 20a, the intermediate block 20b, and each of the blocks that contact the main body 10 are formed with stepped grooves in contact surfaces with the main body 10 to maintain airtightness and maintain the main body 10. Support it. In addition, the corner block 20a, the intermediate block 20b, and the shape of the connection portion connecting the respective blocks are provided with a locking protrusion 30 and a locking groove 32 to be engaged with each other to maintain airtightness and exhaust duct 20 In order to attach the fixing bar 22 supporting the blocks and maintaining the fixed shape on the outer side of the) and attaching the fixing bar 22 to the outer side of the exhaust duct 20, the hanger 24 is provided for each block. To form a fixed bar 22 to be fitted to the rack (24).

As another means for attaching the fixing bar 22 to the outer surface of the exhaust duct 20, a through hole may be drilled through the outer surface of the block and the fixing bar, and a fixing screw may be inserted and fastened.

The connection portion of the hose 25 and the exhaust duct 20 is located on the outer surface on the corner block 20a, and the hose 25 is preferably a corrugated pipe freely bent.

5 is a cross-sectional view showing a state in which each exhaust duct 20 is coupled by cutting the exhaust duct 20 of FIG. In the AA line cross-sectional view of the exhaust duct 20 as shown, two intermediate blocks 20b in the corner block 20a and one end block 20c in the intermediate block 20b are formed in the connecting portion of each block. It is engaged with the machine 30 and the locking groove (32).

In addition, the inlet block 21 is formed at two corners 20a at right angles to each other, and at the middle block 20b and the end block 20c, respectively, one inlet port 21 is formed to suck air in the main body 10. .

Various inlets 21 may also be formed, such as forming polygonal inlets or multiple inlets in each block.

In consideration of the economical production of the exhaust duct 20, the end block 20c has the same shape and shape as the middle block 20b and is sealed with a lid 23 to which the locking protrusion 30 is attached.

However, for a more complete seal, it is also preferable to manufacture the end block 20c having the lid 23 removed and the one end face sealed.

The heat exhaust device of such manufacturing equipment can be assembled by adjusting the number of the intermediate block 20b according to the size of the main body 10 in any type of equipment having an open bottom. Consider the dimensions.

Instead of connecting the two blocks using the locking projections 30 and the locking grooves 32, as shown in FIG. 6, the fixing bar 22 and the hook 24 are removed and fixed to the contacts of the two blocks connected to each other. It is also possible to form the upper plate 40 and the fixed lower plate 42 to drill the through hole 46 in the fixed upper plate 40 and the fixed lower plate 42 and fasten the fixing screw 44 to fix it.

In order to minimize vibration of the main body 10 and to facilitate the sealing, an elastic member such as rubber or resin is preferably applied or O-ring separately on the contact area between the block and the main body 10. The material of the block is the weight of the manufacturing equipment. Metal or high-strength FRP material is desirable to withstand it.

As described above, according to the semiconductor manufacturing equipment heat exhaust device according to the present invention, to prevent overheating of the manufacturing equipment to prevent the stop or failure of the manufacturing equipment, maintain the working environment of the appropriate temperature to improve the work efficiency and high temperature by the heat generating unit By forcibly exhausting the air to the outside of the work room can minimize the influence of the work room and the operator by the heat generating unit.

In addition, no additional production is required for manufacturing equipment, so it can be installed and disassembled at any time even after the purchase of manufacturing equipment. It operates only at the time of operation, reducing power consumption, and it is economical and has the effect that dust, noise and vibration generated from the pumping motor do not affect the inside of the workshop.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (12)

In the semiconductor manufacturing equipment of the form having a heat generating part inside the main body and the lower part of the main body, An exhaust duct installed along the lower end of the main body to maintain airtightness between the bottom surface and the lower end, and having an inlet formed in a hollow hollow to communicate with the inside of the main body; And A pumping motor for connecting a hose to the exhaust duct to forcibly exhaust heat inside the main body; Heat exhaust device of a semiconductor manufacturing equipment, characterized in that consisting of. The method of claim 1, The exhaust duct is a heat exhaust device of the semi-fabricated manufacturing equipment, characterized in that the production is separated into a block of a predetermined size and are connected to each other by a connecting means. The method of claim 2, The connecting means is a heat exhaust device of the semiconductor manufacturing equipment, characterized in that made by engaging with the engaging projection and the engaging groove formed on the mutually opposite surfaces of the block. The method of claim 2, The connecting means is a heat exhaust device of the semiconductor manufacturing equipment, characterized in that for forming a fixed upper plate and a fixed lower plate having a through hole on the surface opposite to the block and fastened with a fixing screw. The method according to claim 3 or 4, Forming a hanger on the outer surface of each block and the heat exhaust apparatus of the semiconductor manufacturing equipment, characterized in that the blocks are connected to each other by passing through the fixed bar. The method of claim 5, The connecting means is a heat exhaust device of the semiconductor manufacturing equipment, characterized in that the fastening by inserting a fixing screw through a through hole in the outer surface and the fixing bar of the block. The method of claim 2, And a lid formed on the block located at the end of the exhaust duct to maintain the closure of the exhaust duct. The method of claim 1, The exhaust duct of the semiconductor manufacturing equipment, characterized in that the material of the exhaust duct. The method of claim 1, Heat exhaust device of the semiconductor manufacturing equipment, characterized in that the material of the exhaust duct is FRP. The method of claim 1, And an elastic material is applied to the contact portion between the exhaust duct and the main body. The method of claim 10, The heat exhaust device of the semiconductor manufacturing equipment, characterized in that the elastic material is rubber. The method of claim 1, And a temperature sensor in the heat generating unit so that the power supply unit of the pumping motor is controlled by the control unit according to the temperature of the heat generating unit.

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