KR100225835B1 - Semiconductor memory device and its fbricating method - Google Patents

Abstract

The present invention relates to a method of manufacturing a semiconductor memory device, and to solve the conventional problem that the capacitance of the capacitor decreases as the memory density increases, and a short circuit occurs between the memory node and the gate electrode and between the bit line and the gate electrode. .

In order to solve the above problems, the present invention provides a position in which at least one of the memory node contact hole and the bit line contact hole is higher than the gate electrode so as to contact the first contact hole opened in the first interlayer insulating film formed on the gate electrode and the conductive layer. And a second contact hole opened in a second interlayer insulating film formed on an upper layer of the conductive layer embedded in the first contact hole.

According to the present invention, it is possible to secure sufficient capacitor capacity despite the reduction of the area occupied by the memory cell, and to prevent short circuit between the storage node and the gate electrode, between the bit line and the gate electrode, and between the memory node and the bit line. It is possible to provide a method of manufacturing a compact and highly reliable semiconductor memory device.

Description

Manufacturing method of semiconductor memory device

1A to 1D show DRAMs in a stacked memory cell structure according to a first embodiment of the present invention.

2A to 9D are views showing the manufacturing process in the manufacturing method for manufacturing the DRAM of the stacked memory cell structure shown in FIG.

10A to 10D show a DRAM according to a second embodiment of the invention.

11A to 11D show a DRAM according to a third embodiment of the present invention.

12A to 17D show manufacturing processes in a manufacturing method for manufacturing a DRAM having a stacked memory cell structure according to a fourth embodiment of the present invention.

18A to 18D show a DRAM according to a fifth embodiment of the present invention.

19A to 19C show a DRAM according to a sixth embodiment of the present invention.

20A to 30B illustrate a manufacturing process of a manufacturing method for manufacturing a DRAM having a stacked memory cell structure according to a sixth embodiment of the present invention.

31A and 31B show a DRAM according to a seventh embodiment of the present invention.

32A to 38B show a manufacturing process in the manufacturing method for manufacturing a DRAM according to the seventh embodiment of the present invention.

39A to 39D show DRAMs in a stacked memory cell structure according to an eighth embodiment of the present invention.

40A to 40C show DRAMs in a stacked memory cell structure according to a ninth embodiment of the present invention.

41A and 41B show a DRAM of a stacked memory cell structure according to the tenth embodiment of the present invention.

42A and 42B show a DRAM of a stacked memory cell structure according to an eleventh embodiment of the present invention.

43A and 43B show a DRAM of the stacked memory cell structure according to the twelfth embodiment of the present invention.

44A to 44D show DRAMs in a stacked memory cell structure according to a thirteenth embodiment of the present invention.

45A to 45C are diagrams for explaining a DRAM manufacturing process according to the thirteenth embodiment of the present invention.

46A to 54D show manufacturing processes in the manufacturing method for manufacturing DRAM of the stacked memory cell structure according to the fourteenth embodiment of the present invention.

FIG. 55 is a diagram showing a DRAM of a conventional stacked memory cell structure.

* Explanation of symbols for main parts of the drawings

1: silicon substrate (p type) 2: device isolation insulating film

3: p-type diffusion layer (channel stopper) 4a, 4b: n-type diffusion layer (source / drain region)

5 gate insulating film 6 gate electrode

7 insulating film 8 sidewall insulating film

9: silicon oxide film 10: silicon nitride film

11 polycrystalline silicon film 12 silicon oxide film

13 interlayer insulating film 14 first memory node contact hole

15: first bit line contact hole 16: polysilicon layer

17 silicon oxide film 18 interlayer insulating film

19: second memory node contact hole 20: memory node electrode

21 capacitor capacitor 22 plate electrode

23: interlayer insulating film 24: second contact hole

25 bit line 26 silicon oxide film

28: epitaxial growth layer 29: silicon nitride film

[Industrial use]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor memory device, and more particularly, to a method of forming a contact in a MOSFET or a DRAM.

Conventional Technology and Its Problems

In recent years, with the progress of semiconductor technology, in particular, microfabrication technology, high integration and large capacity of MOS-type DRAMs are rapidly progressing. This high integration reduces the area of the capacitor that accumulates data (charge), resulting in a misread of the memory contents or a soft error that causes the memory contents to be destroyed by? Rays or the like.

In order to solve this problem and to achieve high integration and high capacity, the area of the MOS capacitor is substantially reduced by stacking the MOS capacitor on the memory cell and electrically connecting one electrode of the capacitor to one electrode of the switching transistor formed on the semiconductor substrate. A stacked memory cell structure has been proposed to enlarge and increase the capacitance of a MOS capacitor.

55A to 55C of the stacked memory cell are shown. In more detail, one memory cell region is formed by separating the p-type silicon substrate 101 by the element isolation insulating film 102, and source / drain regions 104a formed of an n-type diffusion layer in the memory cell region. The MOSFET as a switching transistor is formed by forming the gate electrode 106 between the 104b and the source / drain regions 104a and 104b via the gate insulating film 105. In addition, a first capacitor electrode 110 is formed on the MOSFET. In this case, the first capacitor electrode 110 has a memory node contact hole provided in the insulating film 107.

t hole; An insulating film 107 is formed on the gate electrode 106 of the MOSFET and the gate electrode (word line) of the adjacent MOSFET so as to contact the source region 104a of the MOSFET via 108. The capacitor insulating film 111 and the second capacitor electrode 112 are sequentially stacked on the first capacitor electrode 110 to form a capacitor.

This stacked memory cell is formed as follows.

That is, the stacked memory cell includes a gate insulating film 105 formed between the source and drain regions 104a and 104b of the n-type diffusion layer in the p-type silicon substrate 101 and the source and drain regions 104a and 104b. By forming the gate electrode 106 as a medium, a MOSFET as a switching transistor is formed.

Subsequently, after forming the silicon oxide film as the insulating film 107 on the entire surface of the silicon substrate 101, the memory node contact hole 108 for contacting the source region 104a is formed, and the dope is doped with high concentration. A pattern of the first capacitor electrode 110 formed of the polysilicon layer is formed.

The capacitor insulating film 111 and the second polysilicon layer 112 made of a silicon oxide film are sequentially deposited on the first capacitor electrode 110.

Thereafter, ions such as phosphorous are ion-implanted into the polysilicon layer 112 and heat-treated at about 900 ° C. for 120 minutes to form a polysilicon layer doped at a high concentration to have a desired conductivity.

The second capacitor electrode 11 is then patterned by patterning the heavily doped polysilicon layer.

2) and the first capacitor electrode 110 obtain a MOS capacitor in which the capacitor insulating film 111 is sandwiched.

Finally, an interlayer insulating film 107 'is formed on the polysilicon layer thus formed, and bit line contact holes 113 are formed therein, and molybdenum polysides or the like are formed in the bit line contact holes 113. A bit line is formed, and an interlayer insulating film 107 is formed to obtain a memory cell composed of a MOSFET and a MOS capacitor.

In such a configuration, since the storage node electrode can be extended to the upper portion of the element isolation region, and the step of the storage node electrode can be used, the capacity of the capacitor is increased by the planar (pla).

nar) can be several times to ten times higher than the capacitor capacity of the structure.

However, even in such a DRAM having a stacked memory cell structure, the distance between the memory node contact hole and the gate electrode as the device becomes smaller due to higher integration (fig. 55 (a

) And the distance between the bit line contact hole and the gate electrode (node l2 in FIG. 55 (b)) also inevitably shorten. This is likely to cause a short circuit between the storage node and the gate electrode and between the bit line and the gate electrode, which lowers the reliability.

In addition, with such miniaturization, it is difficult to secure sufficient capacitor capacity.

For example, even if the storage node electrode can be enlarged to the top of the element isolation region, the area of the planar portion of the storage node electrode is very small. In addition, if the thickness of the memory node electrode is increased in order to use the side portion, the step becomes large. Accordingly, if the bit line contact hole is to be formed in the upper layer of the capacitor, the distance between the silicon substrate and the over-etching time is long. There is a risk of deterioration of reliability.

In addition, as the size becomes smaller, the distance between the conductive layers formed in the contact hole is also significantly shortened, and there is a problem that both are likely to cause a short circuit through the interlayer insulating film 107 between these conductive layers. The interlayer insulating film is etched at the time of forming the contact hole and the film deteriorates, which causes a large short circuit.

[Purpose of invention]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is possible to ensure a sufficient capacitor capacity in spite of a reduction in the area occupied by a memory cell, and to ensure that a sufficient amount of capacitor capacity can be ensured, It is an object of the present invention to provide a method for manufacturing a small and reliable memory cell structure which can prevent a short circuit between lines.

[Configuration and Action of the Invention]

In the first aspect of the present invention, at least one of the memory node contact hole and the bit line contact hole forms a first interlayer insulating film on the gate electrode, and then forms a first contact hole, which is electrically conductive in the first contact hole. A second contact hole is formed so as to embed the material and further form a second interlayer insulating film on the upper layer, and selectively etch a part of the second interlayer insulating film to expose the conductive material.

In the present invention, the memory node contact hole and the bit line contact hole are formed in the first contact hole opened in the first interlayer insulating film of the upper layer of the gate electrode in the same process, and the conductive layer embedded in the first contact hole to a position higher than the gate electrode. The second interlayer insulating film formed on the upper layer of the conductive layer is formed in contact with each other so as to be in contact with each other.

More preferably, the capacitor is formed above the bit line.

Preferably, the conductive layer embedded in the memory node contact hole is formed to extend to the element isolation region, and the second contact hole for contacting the conductive layer is opened in the element isolation region.

Further, the second contact hole, which preferably constitutes the memory node contact hole of two adjacent MOSFETs connected to the same bit line, is configured to open on the opposite side to the bit line.

Preferably, the conductive layer embedded in the bit line contact hole is formed to extend to the element isolation region, and the second contact hole for contacting the conductive layer is configured to open in the element isolation region.

More preferably, the conductive layer is formed to extend on the gate electrode.

In the manufacturing method of the present invention, a MOSFET is formed in a semiconductor substrate, a first interlayer insulating film is formed over the gate electrode of the MOSFET, and the substrate surface is brought into contact with at least one of the source and drain drain regions of the MOSFET. The first contact hole is exposed to form a first contact hole, and a conductive layer is embedded in the first contact hole to reach a position higher than the gate electrode. Furthermore, a second interlayer insulating film is formed on the upper layer, and a part of the second interlayer insulating film is removed. The conductive layer is selectively removed to expose the conductive layer to form second contact holes, and the first and second contact holes form one of the memory node contact holes and the bit line contact holes.

Preferably, in the step of forming the first contact hole, the step of etching the first interlayer insulating film so as to increase the opening area of the first contact hole in the upper portion of the gate electrode.

Preferably, after the conductive layer embedding step, the first interlayer insulating film is buried before the formation of the second interlayer insulating film, and is etched below the upper surface of the conductive layer, and then a new interlayer insulating film is formed again.

Further, preferably, after the first interlayer insulating film etching step, the surface of the buried conductive layer is oxidized to form an insulating layer in the formation of the second interlayer insulating film.

According to the above-described configuration, when the memory node contact hole and / or the bit line contact hole are formed, it is only necessary to expose the electrically conductive material at a position higher than the gate electrode in advance, instead of the silicon substrate. It can be shortened.

When the height of the electrically conductive material and the height of the gate electrode are set to appropriate values according to the etching rate of the interlayer insulating film, the gate electrode and the second electrode are formed even when the second contact hole is shifted from the electrically conductive material. The short circuit between the contact holes can be completely prevented.

In addition, the amount of overetching can be reduced as compared with the case of directly forming contact holes in the silicon substrate, thereby preventing the problem that the silicon substrate is etched and the reliability of the cell is lowered.

Moreover, since the contact area can be increased by forming the conductive material so as to extend from above, the contact resistance can be reduced, and it is possible to realize a memory cell with better performance.

In the case of such a structure, if the conductive material is formed so as to extend above the gate electrode and overlap the gate electrode, the conductive material becomes an etching stopper at the time of forming the two contact holes to form a gap between the second contact hole and the gate electrode. Short circuit can be completely prevented.

Further, when the first contact hole is formed, polycrystalline silicon is deposited in advance as an etch stopper, and after the formation of the first contact hole, a method of oxidizing the polysilicon film to form an insulating film is carried out between the first contact hole and the gate electrode. Short circuits can be completely avoided.

Moreover, since etching for exposing the silicon substrate is necessary only for the polysilicon film insulating film, damage to the substrate can be minimized.

In addition, by forming the capacitor above the bit line, the storage node electrode can be easily processed, the capacitor area can be increased, and the plate electrode need not be patterned in the cell array, thereby improving reliability. In addition, when the storage node electrodes are laminated, sufficient capacitor capacity can be ensured.

In addition, the area of the planar portion of the capacitor can be increased by forming the conductive layer embedded in the memory node contact hole so as to extend to the element isolation region.

Furthermore, by making the second contact hole for contacting the conductive layer open on the element isolation region, the buried conductive layer serves as a leading bad pad. However, since the embedding pad by the buried conductive layer can be formed by embedding the conductive layer in the first contact hole formed in a self alignment manner with respect to the gate electrode in advance, there is no need to have a matching margin. The occupied area can be made smaller than in the conventional pad formed by patterning a polysilicon layer or the like. Further, even when the second memory node contact hole or the second bit line contact hole causes a misalignment with the pad, there is no possibility of shorting the gate electrode. Therefore, it is not necessary to form a large pad with a matching margin. Therefore, it is also possible to simultaneously form pads on both sides of the gate electrode. In general, since the pad is formed to overlap the gate electrode in consideration of the misalignment margin, it is impossible to pattern the pad on both sides of the gate electrode when the gate electrode is patterned to the minimum processing dimension. However, according to the present invention, since it is not necessary to take a matching margin, it is possible to simultaneously form pads on both sides of the gate electrode as described above.

Further, in the structure in which the second contact hole is opened larger than the electrically conductive material embedded in at least one direction, the contact can be made even from the side of the embedded conductive material, compared with the case where only the upper surface is in contact. The contact area can be large, and the contact resistance can be reduced.

Further, the second contact holes constituting the memory node contact holes of two adjacent MOSFETs in contact with the same bit line are arranged so as to be opened on the opposite side with respect to the bit line, whereby both memory node electrodes can be made larger, and the capacitor The capacity can be increased.

EXAMPLE

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1A to 1D are plan views showing two bits adjacent to each other in the bit line direction of a DRAM having a stacked memory cell structure, and lines AA 'and BB' shown in FIG. And sectional view along the line CC ′.

In this DRAM, the upper and sidewalls of the gate electrode 6 of the MOSFET are covered by the insulating films 7, 8, and the bit line contact holes and the storage node contact holes are in contact with the source and drain regions 4a and 4b. In addition, it is formed so as to be in contact with the polysilicon layer 16 as a buried layer formed to be buried to a position higher than the gate electrode 6, and is formed in a state very close to the gate electrode. It is similar to DRAM of a stacked memory cell structure.

More specifically, the n-type diffusion layers 4a and 4b as source and drain regions in the active region separated by the insulating film 2 for element isolation formed in the p-type silicon substrate 1 having a resistivity of about 5 Ω · cm. ) And a gate electrode 6 formed between the source and drain regions via a gate insulating film 5 to form a MOSFET. Thus formed MOSFET

The polysilicon layer 16 as a buried layer is formed so as to contact the n-type diffusion layers 4a and 4b through the contact holes formed in the interlayer insulating film 23 formed on the polysilicon layer 1.

The memory node electrode 20 is formed so as to contact 6), and the capacitor is formed by interposing the capacitor insulating film 21 between the upper plate electrode 22 and the capacitor electrode. And interlayer insulating film

The bit line 25 is formed through the bit line contact hole formed in 23.

The gate electrodes 6 are continuously arranged in one direction of the memory cell array to form a word line.

Next, the manufacturing method of this DRAM is demonstrated, referring drawings.

2 to 9 are views showing manufacturing processes according to a DRAM manufacturing method, in which (a) to (c) are plan views showing two bits adjacent to each other in the bit line direction of the DRAM; Fig. 2 is a cross sectional view of a DRAM along the lines A-A 'and B-B' in Figs.

First, as shown in Figs. 2A to 2C, the element isolation insulating film 2 is formed on the surface of the p-type silicon substrate 1 having a specific resistance of about 5? Cm by the LOCOS method. ) And a p-type diffusion layer 3 for punch-through stopper, and then formed by a thermal oxidation method, a gate insulating film 5 made of a silicon oxide film having a film thickness of about 10 nm, and then the gate insulating film 5 A polysilicon film, a metal film, or a silicide film as a material of the gate electrode 6 is deposited on the entire surface, and an insulating film 7 such as a silicon oxide film is deposited on the upper layer by CVD (Chemical Vapor Deposition). It deposits about nm and patterns the gate electrode 6 and the insulating film 7 formed on the gate electrode 6 simultaneously using photolithography technique and anisotropic etching technique.

Thereafter, As ions are implanted into the silicon substrate using the gate electrode 6 as a mask to form source and drain regions 4a and 4b made of n-type diffusion layers, thereby forming a MOSFET as a switching transistor. The depth of the diffusion layer is, for example, about 150 nm. Subsequently, an insulating film made of a silicon oxide layer having a thickness of about 100 nm or less is deposited on the entire surface by CVD, and the entire surface is etched by the reactive ion etching method to self-align the sidewall insulating film on the side of the gate electrode 6. 8)

Next, as shown in FIGS. 3A to 3C, the silicon oxide film 9 having a thickness of about 20 nm is formed on the upper layer of the substrate thus obtained by thermal oxidation, and then the entire surface of the substrate is formed. The silicon oxide film 13 as an interlayer insulating film is deposited by CVD.

Subsequently, as shown in FIGS. 4A to 4C, the interlayer insulating film 13 is patterned by photolithography and reactive ion etching to form the first memory node contact hole 14 and the first memory. The bit line contact holes 15 are formed at the same time. At this time, it is also possible to form a wide contact hole only in the upper portion by patterning the resist using the photolithography method and then performing isotropic etching and further performing anisotropic etching. In addition, after the resist is patterned using the photolithography method, anisotropic etching is performed, the contact hole is opened, and then isotropic etching is further performed to widen the upper portion to form a wide contact hole only in the upper portion.

Subsequently, as shown in FIGS. 5A to 5C, the film thickness of the polysilicon film 16 doped at a high concentration, for example, on the front surface is 1/1 of the short sides of the contact holes 14 and 15. By depositing at least 2 (here, at least 1/2 of the short side is to completely fill the contact holes), and then etching the entire surface of the silicon substrate until the surface of the interlayer insulating film 13 is exposed. The polysilicon film 16 is left only in the contact hole. In this case, the doping of this polysilicon film deposits a thin polysilicon film of about 500 microseconds, and ion implants, for example, ion implantation, and again deposits the polysilicon film so that it becomes at least 1/2 of the short side of the contact hole, and the As ion After ion implantation, it is also possible to deposit a silicon oxide film by CVD and to perform a heat treatment.

Moreover, in this step, the method of embedding the polysilicon film on the entire surface and then etching again is used. For example, a method of selectively growing the polysilicon film or the single crystal silicon film only in the contact hole may be employed.

Thereafter, as shown in Figs. 6A to 6C, a silicon oxide film 17 having a thickness of about 200 GPa is formed on the surface of the substrate by, for example, thermal oxidation, and then, by CVD. A silicon oxide film 18 having a film thickness of about 500 GPa is deposited on the silicon oxide film 17 so that only the surface of the polysilicon film 16 corresponding to the storage node contact portion is exposed by photolithography and reactive ion etching. 18) optionally removed.

After forming the memory node contact hole 19 in this manner, a polysilicon film is deposited on the entire surface of the substrate, doped, and then patterned by photolithography and reactive ion etching to form the memory node electrode 20. do. Then, a silicon nitride film having a thickness of 10 nm was deposited on the upper layer of the substrate by CVD, and then oxidized in a vapor atmosphere at about 800 ° C. for about 30 minutes to form a silicon oxide film, thereby forming a two-layer film of silicon nitride film and silicon oxide film. A capacitor insulating film 21 is formed. Furthermore, a polysilicon film is deposited on the capacitor insulating film 21, doped, and then patterned by photolithography and reactive ion etching to form the plate electrode 22. Subsequently, the capacitor insulating film of an unnecessary portion is removed using this plate electrode 22 as a mask. Then, an interlayer insulating film 23 made of a silicon oxide film is deposited on the plate electrode 22, and the surface is planarized by heat treatment (see FIGS. 7A to 7C).

Thereafter, as shown in FIGS. 8A to 8D, the interlayer insulating film is exposed so that only the surface of the polysilicon film 16 corresponding to the bit line contact portion is exposed by photolithography and reactive ion etching. (23), the silicon oxide films 17 and 18 are selectively removed to form the bit line contact holes 24. As shown in FIG.

As shown in Figs. 9A to 9D, a polysilicon film is deposited on the entire surface of the substrate, doped, and then patterned by photolithography and reactive ion etching. 25). Here, the bit line 25 is formed of a single layer polycrystalline silicon film, but may have a laminated structure of a polycrystalline silicon layer and a silicide layer.

Thereafter, a silicon oxide film 26 as a protective film is formed to complete a DRAM as shown in FIGS. 1A to 1D.

According to this manufacturing method, the memory node contact hole and the bit line contact hole may be formed to be in contact with the polysilicon film buried up to a position higher than the gate electrode in advance, so that the etching time required for forming the contact hole can be shortened. .

Therefore, even when forming a contact hole having a high aspect ratio like the bit line contact hole in this embodiment, the substrate can be avoided from being excessively etched by overetching, so that a highly reliable memory cell can be obtained.

In addition, short circuits with the gate electrodes due to misalignment in the photolithography technique can be avoided, and the margin of the pattern in consideration of misalignment can be eliminated, thereby miniaturizing the memory cell.

Example 2

Next, as a second embodiment of the present invention, a cell structure of a DRAM having high effect of preventing a short circuit from a gate electrode due to misalignment of contacts will be described.

As shown in FIGS. 10A to 10D, the DRAM has a shape in which the contact area is wider than that of the gate electrode 6. According to this structure, the contact area can be increased and the contact resistance can be reduced.

In realizing such a structure, after patterning the memory node contact hole and the bit line contact hole, isotropic etching is performed while leaving the resist to remove the upper edge 27 of the pattern, and then the contact hole by reactive ion etching. To open. For example, single crystal silicon or polycrystalline silicon is selectively grown only in this contact portion, and furthermore, the silicon oxide film 18 is deposited thereon, and then contact holes are formed in the same manner as in the first embodiment.

Example 3

As shown in Figs. 11A to 11D, after forming the memory node contact hole and the bit line contact hole, the single crystal silicon or polycrystalline silicon layer 28 is selectively formed only in this contact hole. The growth thickness may be made larger than the depth of the contact hole.

In either case of FIGS. 10 and 11, the contact hole is widened at a position higher than the gate electrode, and the structure has a high margin against registration misalignment. Therefore, it is not necessary to take a margin for the pattern, and it is possible to realize a fine memory cell structure.

Example 4

In the above embodiment, when the memory node contact hole and the bit line contact hole are simultaneously formed, the interlayer insulating film is planarized, and then the contact hole is formed by photolithography and reactive ion etching. By way of example, an example for realizing a finer memory cell will be described with reference to FIGS. 12 to 17 as a fourth embodiment of the present invention.

First, the formation of the gate electrode 6 and the process of leaving the sidewall insulating film 8 self-aligned on the side surface of the gate electrode 6 are performed in the same manner as in the first embodiment. Thereafter, a silicon oxide film 9 having a film thickness of 200 kPa, a silicon nitride film 10 having a film thickness of 20 nm, and a polycrystalline silicon film 11 having a film thickness of 50 nm are sequentially deposited by thermal oxidation, and further, phosphorus oil is deposited thereon. An interlayer insulating film 13 such as a li is formed. At this time, the interlayer insulating film 13 may be flattened by heat treatment as shown in Figs. 12A to 12C, and no processing may be performed.

Then, as shown in Figs. 13A to 13C, the substrate thus obtained is patterned by photolithography and reactive ion etching to obtain a pattern of the interlayer insulating film 13, thereby obtaining the first memory. The node contact hole 14 and the first bit line contact hole are simultaneously formed. At this time, by selecting etching conditions such that the etching rate of the polysilicon film 11 is sufficiently smaller than the etching rate of the interlayer insulating film 13, the polysilicon film 11 acts as an etching stopper. As a result, even when the distance between the first memory node contact hole 14 and the gate electrode 6 or the distance between the first bit line contact hole 15 and the gate electrode 6 is very small, Short circuits between the gate electrodes 6 or between the bit lines and the gate electrodes 6 can be avoided.

Next, as shown in FIGS. 14A to 14C, the first memory node contact hole 14 and the first bit line contact hole 15 areotropically etched or chemically dry etched (CDE). The polysilicon film 11 of the portion corresponding to the () is removed to expose the underlying silicon nitride film 10.

Subsequently, as shown in Figs. 15A to 15C, the silicon oxide film 11 is oxidized by oxidizing at least the sidewall of the memory node contact hole and the sidewall of the bit line contact hole. 12). Here, the entire polysilicon film 11 may be the silicon oxide film 12. As described above, by oxidizing a portion of the remaining polysilicon film exposed to at least the sidewall of the contact hole, a problem such as a short circuit between the storage node electrodes through the remaining polysilicon film 11 or a short circuit between the memory node electrode and the bit line is caused. Can be prevented.

Then, as shown in FIGS. 16A to 16C, the silicon nitride film corresponding to the first memory node contact hole 14 and the first bit line contact hole 15 by anisotropic etching ( 10) and the thin silicon oxide film 9 below it, thereby exposing the surface of the silicon substrate. At this time, since the sidewall and the top of the gate electrode are covered with a thick insulating film, there is no fear that the etching will reach the gate electrode.

In this manner, after the first memory node contact hole 14 and the first bit line contact hole 15 are formed, the polysilicon film is deposited in the same manner as described above, and then etched again to be embedded in the contact hole, Alternatively, a single crystal silicon film or a polycrystalline silicon film is selectively grown.

The following steps are completed in the same manner as in the first embodiment, as shown in Figs. 17A to 17D, to complete the memory cells.

According to this method, since the polysilicon film which becomes an etching stopper is formed at the time of forming a 1st memory node contact hole and a 1st bit line contact hole, there is no need to make a space in consideration of a misalignment with a gate electrode, and to make a memory It is possible to miniaturize the cell and to improve the reliability.

In particular, this effect can be made higher by allowing the memory node contact hole and the bit line contact hole to be previously placed higher than the gate electrode by embedding or selective growth, as in the present embodiment. have. That is, in the case where the contact holes having a high aspect ratio, such as the bit line contact holes in the memory cell according to the present embodiment, are formed to reach the surface of the substrate by one etching, a very long etching time is required, so that the polysilicon layer There exists a possibility that it may not work enough as this etching stopper. On the other hand, even when the etching time is very long, if the film thickness of the polysilicon film is made thick enough to fully function as an etching stopper, it will not sufficiently oxidize in a subsequent oxidation step, resulting in a short circuit.

Therefore, after the insulating film is formed around the gate electrode, the interlayer insulating film is etched using the polysilicon film as a stopper layer to form a shallow contact hole once and then oxidized to obtain a highly reliable memory cell without fear of short circuit. It becomes possible.

In addition, since the contact hole is positioned above the gate electrode in advance, there is no short-circuit with the gate electrode even if a misalignment occurs during the formation of the second contact hole. Therefore, there is no need to consider the misalignment. It can be sufficiently secured, making it an optimal structure for miniaturization and improvement of reliability.

Example 5

Incidentally, in the fourth embodiment, when the memory node contact hole and the bit line contact hole are formed at the same time, the remaining polycrystalline silicon film is oxidized to prevent occurrence of a short circuit between the contact holes. As shown in Figs. (a) to 18 (c), after removing the polysilicon film corresponding to the contact hole by the CDE method, the silicon nitride film is deposited on the entire surface and reactive ion etching is performed to expose the substrate surface. The process of leaving the silicon nitride film 29 on the side of the contact hole is also possible.

At this time, the silicon nitride film may be oxidized as needed prior to deposition.

According to this method, even if the polysilicon film is not completely oxidized, there is no fear of short circuit. In addition, since the oxidation process of the polysilicon film can be omitted, the problem of the transistor being weak in the short channel effect can be solved because the junction depth of the transistor is deepened in the thermal process for oxidation. Therefore, further refinement of the cell can be achieved.

In addition, even if the interlayer insulating film is formed of phosphorus glass, phosphorus diffuses through the polycrystalline silicon film embedded in the contact hole to the silicon substrate, thereby degrading the performance of the transistor or lowering the breakdown voltage between the contact holes.

Example 6

In the above embodiment, the formation of the bit line is performed after the formation of the capacitor. However, the capacitor may be formed after the formation of the bit line. When the capacitor is formed on the bit line in this manner, the bit line is covered with the plate electrode and sealed, so that even if the cell is miniaturized, the occurrence of malfunction due to interference between adjacent bit lines can be prevented.

As a sixth embodiment, a DRAM in which a capacitor is formed on a bit line will be described.

19A is a plan view showing two bits adjacent in the bit line direction of a DRAM of a stacked memory cell structure according to a sixth embodiment of the present invention, and FIGS. 19B and 19C are shown in FIGS. Are cross-sectional views taken along line AA ′ and line BB ′ of FIG. 19A, respectively.

The DRAM is formed so that a capacitor is formed on the bit line 25 and the polysilicon layer 16 as a layer buried in the memory node contact hole protrudes upward from the element isolation region. The memory node electrode 20 ) Is the main difference from the first embodiment in that it is formed to be in contact on the element isolation region. As in the first embodiment, the upper and sidewalls of the gate electrode 6 of the MOSFET are covered by the insulating films 7, 8, and the bit line contact holes and the memory node contact holes are in contact with the polysilicon layer 16. In addition, it is formed so as to be in contact with the polysilicon layer 16 as a buried layer formed so as to be embedded up to a position higher than the gate electrode, and is formed in a state very close to the gate electrode. The other parts are the same as those of the DRAM of the conventional stacked memory cell structure.

That is, the n-type diffusion layers 4a and 4b constituting the source / drain regions are formed in the active region separated by the element isolation insulating film 2 formed in the p-type silicon substrate 1 having a resistivity of about 5Ω · cm. The MOSFET is formed by the gate electrode 6 formed through the gate insulating film 5 between the source and drain regions, and n is formed through contact holes formed in the interlayer insulating film 23 formed on the MOSFET. The polysilicon layer 16 as a buried layer is formed to contact the diffusion layers 4a and 4b, and the bit line 25 is formed to contact the polysilicon layer 16. As shown in FIG. The memory node electrode 20 is formed through the memory node contact hole formed in the interlayer insulating film 23 to form a capacitor by interposing the capacitor insulating film 21 between the upper electrode and the plate electrode 22. have. The gate electrodes 6 are successively arranged in one direction of the memory array to form word lines.

Next, the manufacturing method of this DRAM is demonstrated, referring drawings.

20 to 30 show a manufacturing process of the DRAM manufacturing method, in which (a) and (b) correspond to two bits adjacent to each other in the bit line direction of the DRAM. It is sectional drawing along the AA 'line and BB' line of (a).

First, as shown in FIGS. 20A and 20B, the element isolation insulating film 2 and the punch-through are applied to the surface of a p-type silicon substrate having a specific resistance of about 5 Ω · cm by a conventional LOCOS method. After the p-type diffusion layer 3 for blocking is formed, a gate insulating film 5 made of a silicon oxide film having a thickness of about 10 nm is formed by thermal oxidation. Furthermore, a polysilicon film, a metal film, or a silicide film as a material of the gate electrode 6 is deposited on the entire surface, and an insulating film 7 such as a silicon oxide film is deposited by a CVD method on a film thickness of about 100 to 300 nm. The insulating film 7 on the gate electrode 6 is simultaneously patterned using lithography and anisotropic etching techniques.

After post-oxidation at 850 DEG C, for example, the source electrode drain regions 4a and 4b made of n-type diffusion layers are formed by ion implantation of As ions using the gate electrode 6 as a mask to form a MOSFET as a switching transistor. Form. The depth of the diffusion layer is, for example, about 150 nm. Subsequently, an insulating film made of a silicon nitride film having a film thickness of about 100 nm or less is deposited on the entire surface by CVD, and the entire surface is etched by the reactive ion etching method to self-align the sidewall insulating film (a sidewall of the gate electrode 6). 8)

Thereafter, as shown in Figs. 21A and 21B, a silicon oxide film 9 having a film thickness of 200 kPa, a silicon nitride film 10 having a film thickness of 20 nm, and a film thickness 50 are formed by a thermal oxidation method. A polycrystalline silicon film 11 of nm is deposited to further form an interlayer insulating film 13 such as phosphorus glass. At this time, the interlayer insulating film 13 may be flattened by heat treatment or may not be subjected to any treatment.

Next, as shown in Figs. 22A and 22B, the interlayer insulating film 13 is patterned by photolithography and reactive ion etching to form the first memory node contact holes 14 and first. One bit line contact hole 15 is simultaneously formed. In this case, the first memory node contact hole 14 is shown in FIG. 22 (

As shown in b), it is formed up to the device isolation region 2. At this time, by selecting etching conditions such that the etching rate of the polysilicon film 11 is sufficiently smaller than the etching rate of the interlayer insulating film 13, the polysilicon film 11 acts as an etching stopper. Accordingly, even when the distance between the memory node contact hole 14 and the gate electrode 6 or the distance between the bit line contact hole 15 and the gate electrode 6 is very short, the memory node electrode and the gate electrode 6 ), Or there is no fear of occurrence of a short circuit between the bit line and the gate electrode 6.

Thereafter, as shown in FIGS. 23A and 23B, the first memory node contact hole 14 and the first bit line contact hole 15 are formed by isotropic etching or chemical dry etching (CDE). The polysilicon film 11 in the portion corresponding to the silicon nitride film 11 is removed to expose the underlying silicon nitride film 10.

Subsequently, as shown in FIGS. 24A and 24B, the polysilicon film 11 is oxidized from at least a portion exposed to the sidewall of the memory node contact hole and the sidewall of the bit line contact hole. The film 12 is used. Here, although the entire polysilicon film 11 is made into the silicon oxide film 12, only the polysilicon film exposed to at least the sidewalls of the memory node contact holes and the sidewalls of the bit line contact holes becomes the silicon oxide film 12. You may also Thus, by oxidizing a portion of the remaining polysilicon film exposed to at least the sidewall of the contact hole, a short circuit between the storage node electrodes through the remaining polysilicon film 11, or a short circuit between the memory node electrode and the bit line, Problems can be prevented. At this time, when phosphorus glass or the like is used for the interlayer insulating film 13, the interlayer insulating film can be planarized at the same time.

Thereafter, as shown in FIGS. 25A and 25B, the silicon nitride film 10 of the first memory node contact hole 14 and the first bit line contact hole 15 is subjected to anisotropic etching. And by removing the thin silicon oxide film 9 thereunder, the silicon substrate surface is exposed. At this time, since the sidewall and the upper portion of the gate electrode are covered with a thick insulating film, there is no fear that the etching may reach the gate electrode.

Thereafter, as shown in FIGS. 26A and 26B, the film thickness of the polysilicon film 16 doped at a high concentration, for example, on the entire surface of the substrate is 1 at the short sides of the contact holes 14 and 15. By depositing more than / 2 (here, depositing more than 1/2 of the short side to completely fill the connection hole), and then etching the entire surface of the substrate until the surface of the interlayer insulating film 13 is exposed. The polysilicon film 16 is left only in the contact hole. Here, the doping of the polysilicon film deposits a thin polysilicon film of about 500 microseconds, and then ion implants, for example, ion, and further deposits the polysilicon film so as to be at least 1/2 of the short side of the contact hole. After ion implantation, the silicon oxide film may be deposited by CVD to perform a heat treatment.

Moreover, in this step, the method of embedding the polysilicon film on the entire surface and then etching again is used. For example, a method of selectively growing the polysilicon film or the single crystal silicon film only in the contact hole may be employed.

Thereafter, as shown in Figs. 27A and 27B, a silicon oxide film 17 of about 200 Å is formed on the surface of the substrate by, for example, thermal oxidation, and then the film is deposited thereon by CVD. A silicon oxide film 18 having a thickness of 500 Å is deposited, and the silicon oxide films 17 and 18 are selectively removed by photolithography and reactive ion etching to form second bit line contact holes 24.

As shown in Figs. 28A and 28B, a polysilicon film is deposited on the entire surface of the substrate, doped, and then patterned by photolithography and reactive ion etching. 25). Here, the bit line 25 is formed of a single layer polycrystalline silicon film, but the bit line may be a laminated structure of a polysilicon film and a silicide layer.

Next, as shown in Figs. 29A and 29B, an interlayer insulating film 23 made of a silicon oxide film is deposited, and the surface is planarized by heat treatment, followed by photolithography and reactivity. The second memory node contact hole is selectively removed by removing the interlayer insulating film 23 and the silicon oxide films 17 and 18 so that only the surface of the polysilicon film 16 in the portion corresponding to the memory node contact hole is exposed by ion etching. (19) is formed. In this case, since the buried layer 16 extends to the device isolation region 2, the memory node contact hole may be formed on the device isolation region 2.

After the memory node contact holes are formed in this manner, a polysilicon film is deposited on the entire surface of the substrate, doped, and patterned by photolithography and reactive ion etching to form the memory node electrode 20. After depositing a silicon nitride film with a thickness of 10 nm on the upper layer by CVD, the silicon oxide film was formed by oxidizing for about 30 minutes in a vapor atmosphere at about 900 ° C. to form a capacitor insulating film composed of a two-layer film of silicon nitride film and silicon oxide film. (21) is formed (see FIGS. 30 (a) and 30 (b)).

Then, a polysilicon film is deposited on the capacitor insulating film 21 and doped to form a plate electrode 22. Further, an interlayer insulating film 26 made of a silicon oxide film is deposited on the plate electrode 22, and the surface is planarized by heat treatment, so that the memory as shown in Figs. 19A to 19C. Complete the cell.

In the above structure, since the capacitor is formed above the bit line, the storage node electrode can be easily processed as described above, so that the area of the capacitor can be increased, and the plate electrode must be patterned in the cell array. Since there is no, the reliability can be improved.

In addition, when the storage node electrodes have a stacked structure, the capacitance of the capacitor can be further increased.

Furthermore, since the conductive layer embedded in the memory node contact hole is formed to extend to the element isolation region, the area of the planar portion of the capacitor can be increased.

Further, by forming the second contact hole for contacting the conductive layer so as to open on the element isolation region, a DRAM having a large capacitor capacity can be obtained without increasing the element occupancy area. In other words, the buried conductive layer serving as the leading pad can be formed by embedding the conductive layer in the first contact hole formed in advance with respect to the gate electrode. In addition, the pad occupying area can be reduced compared to the pad according to the prior art in which a polysilicon layer or the like is patterned and formed without the need for matching margin. Therefore, even when a misalignment occurs between the pad and the second memory node contact hole or the second bit line contact hole, there is no fear that the pad will short-circuit with the gate electrode, so it is not necessary to provide a large pad with a margin. .

Example 7

In the sixth embodiment, a polysilicon film is used as an etch stopper of the interlayer insulating film at the time of forming the first contact holes 14 and 15, and a method of oxidizing the polysilicon film after contact hole formation is used. In the wide case, it may be used for forming the first contact hole without using such a special method.

As a seventh embodiment, an example in which the process of forming the first contact hole without using this etching stopper is simplified will be described.

31A and 31B show two bits adjacent to each other in the bit line direction of the DRAM of the stacked memory cell structure according to the seventh embodiment of the present invention (Fig. 19A). Of) Sectional view along line AA 'and line BB'.

The structure of this DRAM is almost the same as that of the sixth embodiment shown in FIG. Next, a method for manufacturing a DRAM will be described with reference to the accompanying drawings.

32 to 38 are diagrams illustrating a manufacturing process of this DRAM, in which (a) and (b) each show two bits adjacent to each other in the bit line direction of the DRAM. Sectional view along the AA 'and BB' lines.

First, as in the sixth embodiment, as shown in FIGS. 32A and 32B, an element isolation insulating film (PB) is formed on the surface of the p-type silicon substrate 1 having a specific resistance of about 5 占 Ωcm. 2) and the p-type diffusion layer 3 for the punch-through stopper, and then the source / drain regions 4a and 4b formed of the gate insulating film 5, the gate electrode and the n-type diffusion layer are formed on the upper layer, and the switching transistor. In addition to forming a MOSFET, the sidewall insulating film 8 is left in self-alignment with the side of the gate electrode 6.

Thereafter, as shown in Figs. 33A and 33B, an interlayer insulating film 13 made of phosphorous or the like is deposited. At this time, the interlayer insulating film 13 may be planarized by heat treatment or may not be subjected to any treatment. Then, the interlayer insulating film 13 is patterned by photolithography and reactive ion etching to simultaneously form the first memory node contact hole 14 and the first bit line contact hole 15. At this time, the first memory node contact hole 14 is open to the top of the device isolation region (2) as shown in Figure 33 (b). Here, in the sixth embodiment, a stopper layer of polycrystalline silicon exists, but in this example, since there is no stopper layer, the etching time required to form the first contact hole is set to an appropriate value, and the insulating film in the element isolation region is It is necessary to avoid overetching.

Thereafter, as in the sixth embodiment, as shown in FIGS. 34A and 34B, the film thickness of the polysilicon film 16 doped at high concentration, for example, is formed on the front surface thereof. Is deposited to be at least half of the short side of the back side (here, being deposited to be at least half of the short side to completely fill the contact hole), and then the entire surface is exposed when the surface of the interlayer insulating film 13 is exposed. By etching until the polysilicon film 16 is left only in the contact hole. Here, the doping of the polysilicon film is performed by depositing a thin polycrystalline silicon film of about 500 kV, ion implanting As ion, and further depositing the polysilicon film so as to be at least 1/2 of the short side of the contact hole. After ion implantation, it is also possible to deposit a silicon oxide film by CVD and to perform a heat treatment.

Moreover, in this step, the method of embedding the polysilicon film on the entire surface and then etching again is used. For example, a method of selectively growing the polysilicon film or the single crystal silicon film only in the contact hole may be employed.

Thereafter, as shown in FIG. 35, a silicon oxide film 17 having a thickness of about 200 kW is formed on the surface by, for example, thermal oxidation, and then a silicon oxide film 18 having a film thickness of 500 kW is deposited thereon by CVD. , Silicon oxide films 17,1 by photolithography and reactive ion etching

8) is selectively removed to form a second bit line contact hole 24.

As shown in FIG. 36, a polysilicon film is deposited on the entire surface, doped, and then patterned by photolithography and reactive ion etching to form bit lines 25. As shown in FIG.

Thereafter, as shown in FIGS. 37A and 37B, an interlayer insulating film 23 made of a silicon oxide film is deposited, and the surface is planarized by heat treatment, followed by a photolithography method and reactive ions. Polycrystalline silicon film of the portion corresponding to the memory node contact hole by etching

(16) The second memory node contact hole 19 is formed by selectively removing the interlayer insulating film 23 and the silicon oxide films 17 and 18 so that only the surface is exposed. Also in this case, since the buried layer 16 extends to the device isolation region 2, the memory node contact hole can be formed on the device isolation region 2.

After forming the memory node contact holes in this manner, as shown in Figs. 38 (a) and 38 (b), polysilicon is deposited on the entire surface and doped, followed by photolithography and reactive ion etching. The memory node electrode 20 is formed by patterning. Then, a silicon nitride film having a thickness of 10 nm was deposited on the upper layer by CVD, and then oxidized for about 30 minutes in a vapor atmosphere at about 900 ° C. to form a silicon oxide film, thereby forming a two-layer film of a silicon nitride film and a silicon oxide film. The capacitor insulating film 21 is formed.

Then, a polysilicon film is deposited on the capacitor insulating film 21 and doped to form a plate electrode 22. Further, an interlayer insulating film 26 made of a silicon oxide film is deposited on the plate electrode 22, and the surface is planarized by heat treatment, so that the memory as shown in Figs. 31 (a) and 31 (b) is shown. Complete the cell.

In this method, since the first contact hole is formed without using the etching stopper, the process is simplified.

Example 8

In the sixth embodiment, the buried layer 16 of the memory node contact hole portion is formed to protrude upward from the element isolation region 2, but as shown in Figs. 39 (a) to 39 (d), Instead of the contact hole, the buried layer of the bit line contact hole portion may be formed so as to project upward from the element isolation region 2, and the bit lines may be shifted by 1/2 pitch from the element region (Fig. 39 (b)). 39 (d) are cross-sectional views taken along line AA ′ and CC ′ of FIG. 39 (a), respectively.

In this embodiment as well, the device can be miniaturized.

Example 9

In the structure of the eighth embodiment, the first contact hole may be formed without using the etching stopper. As a ninth embodiment, this example is shown in Figs. 40 (a) to 40 (c). In the structure of this embodiment, the silicon nitride film 1 covering the periphery of the side wall insulating film 8 or the like in the completed state

It differs from the structure of the eighth embodiment in that there is no 0).

Example 10

In the structure of the ninth embodiment, a resist having openings in the shape of the first memory node contact hole 14 and the bit line contact hole 15, as shown in FIGS. 41 (a) and 41 (b). After the pattern is formed, first isotropic etching is performed to remove the upper edge of the pattern. Then, the contact hole is opened by anisotropic etching, and the upper edge of the contact hole is expanded to form a first contact hole (14,1).

5) The polysilicon film 16 may be embedded.

As a result, since the first storage node contact hole and the first bit line contact hole are expanded at a position higher than that of the gate electrode, even when the second storage node contact hole and the second bit line contact hole are misaligned, the gate is misaligned. There is no fear of short circuiting with the electrode. In addition, since the contact area can be large, it is possible to reduce the contact resistance.

Example 11

In the structure of the tenth embodiment, when the upper edge of the polysilicon film 16 embedded in the first contact holes 14 and 15 is expanded, the contact hole is shaped like the upper edge. The shape of the first contact holes 14 and 15 has a vertical cross section as in the prior art, and the polycrystalline silicon film or the single crystal silicon film is grown by the selective CVD method, and the thickness is also achieved by making the thickness thicker than the depth of the contact hole. It is possible.

42A and 42B show examples in which the polysilicon film 16 is grown by selective CVD and the upper edge is expanded by making the thickness larger than the depth of the contact hole. Shown in

Also in this embodiment, the formation of the second memory node contact hole and the second bit line contact hole is facilitated as in the tenth embodiment.

Example 12

As shown in Figs. 43A and 43B, the second bit line contact hole 24 is opened larger than the first bit line contact hole 15, and the bit line 25 is opened. The contact surface can be made also in contact with the side surface of the polysilicon film 16 embedded in the first bit line contact hole 15, so that the contact area can be increased to reduce the contact resistance.

In this embodiment, the polysilicon film 16 is embedded to a position sufficiently higher than the gate electrode in the first bit line contact hole, and the gate is overetched even when the second bit line contact hole 24 is formed. Since a short circuit with the electrode is not caused, a reliable memory cell can be realized.

Example 13

Next, as a thirteenth embodiment of the present invention, as shown in FIGS. 44A to 44D, a first memory node contact hole and a first bit line contact hole are formed, and a polysilicon film ( 16) is embedded in the contact hole, and then the surface of the first interlayer insulating film 13 damaged by the etching process or the like is removed, and a new insulating film is formed again to prevent short-circuit between the polysilicon films 16 and to withstand pressure. The method which aimed at improving the present invention will be described.

In the same manner as in the first embodiment, the interlayer insulating film 13 is patterned to simultaneously form the first memory node contact hole 14 and the first bit line contact hole 15, but at this time, a resist is formed by photolithography. After patterning, an isotropic etching step is performed, and further anisotropic etching is performed to form a wide contact hole only in the upper portion. Then, the polysilicon film 16 doped with phosphorus at a high concentration is embedded in the first contact holes 14 and 15, and then the surface of the interlayer insulating film 13 is etched using an ammonium fluoride (NH ₄ F) solution. Exposing the elongated portion of the polysilicon film 16, and performing heat treatment to form the silicon oxide film 17 on the sidewalls of the elongated portion of the polysilicon film 16. Then, the film thickness was 500 kV by CVD. The silicon oxide film 18 is deposited (see FIGS. 45 (a) to 45 (c)).

The subsequent process is formed in the same manner as in the first embodiment. According to this manufacturing method, the surface of the damaged interlayer insulating film 13 is removed once, and then the surface of the film 13 is covered with a new silicon oxide film 18, and the polysilicon film 16 is stretched. Since the silicon oxide film 17 is also formed on the sidewall of the portion, the breakdown voltage of the memory cell is further improved.

Example 14

In the above embodiment, when the memory node contact hole and the bit line contact hole are simultaneously formed, the interlayer insulating film is planarized, and then the contact hole is opened by the photolithography method and the reactive ion etching. An example for realizing a memory cell is described with reference to FIGS. 46 to 53 as the fourteenth embodiment.

First, the formation of the gate electrode 6 and the process of leaving the sidewall insulating film 8 self-aligned on the side thereof are performed in the same manner as in the first embodiment described above, and thereafter, the silicon oxide film 9 having a film thickness of 200 占 by a thermal oxidation method is obtained. ), A silicon nitride film 10 having a film thickness of 20 nm and a polycrystalline silicon film 11 having a film thickness of 50 nm are deposited, and an interlayer insulating film 13 such as phosphorus glass is further formed thereon. At this time, the interlayer insulating film 13 may be flattened by heat treatment as shown in Figs. 46A to 46C, and no processing may be performed.

Next, as shown in Figs. 47A to 47C, the interlayer insulating film 13 is patterned by photolithography and reactive ion etching to form a pattern of the film 13, and the first pattern is formed. The memory node contact hole 14 and the first bit line contact hole 15 are formed at the same time. At this time, by selecting etching conditions such that the etching rate of the polysilicon film 11 is sufficiently smaller than the etching rate of the interlayer insulating film 13, the polycrystalline silicon film 11 acts as an etching stopper. Therefore, even when the distance between the memory node contact hole 14 and the gate electrode 6 or the distance between the bit line contact hole 15 and the gate electrode 6 is very short, the memory node electrode and the gate electrode 6 There is no possibility that a short circuit occurs between or between the bit line and the gate electrode 6.

Subsequently, as shown in FIGS. 48A to 48C, the first memory node contact hole 14 and the first bit line contact hole may be formed by isotropic dry etching or chemical dry etching (CDE). The polysilicon film 11 of the portion corresponding to 15) is removed to expose the underlying silicon nitride film 10.

49A and 49C, the polysilicon film 11 exposed to at least the sidewall of the memory node contact hole and the sidewall of the bit line contact hole is oxidized to form a silicon oxide film ( 12). Here, the entire polysilicon film 11 may be the silicon oxide film 12. As described above, by oxidizing a portion of the remaining polysilicon film exposed to at least the sidewall of the contact hole, a problem such as a short circuit between the storage node electrodes through the remaining polysilicon film 11 or a short circuit between the memory node electrode and the bit line is caused. Can be prevented.

Thereafter, as shown in Figs. 50A to 50C, the silicon nitride film 10 and the underlying portions of the memory node contact holes 14 and the bit line contact holes 15 are formed by anisotropic etching. The surface of the silicon substrate is exposed by removing the thin silicon oxide film 9. At this time, since the sidewall and the top of the gate electrode are covered with a thick insulating film, there is no fear that the etching will reach the gate electrode.

After the memory node contact hole 14 and the bit line contact hole 15 are formed in this manner, the polysilicon film as shown in Figs. 51 (a) to 51 (c) is performed in the same manner as in the above-described steps. After deposition, it is embedded in the contact hole portion by etch-back, or the single crystal silicon film is selectively grown.

After that, or as shown in FIGS. 52A to 52C, the interlayer insulating film 13 and the silicon oxide film 12 are etched away using an ammonium fluoride (NH ₄ F) solution. At this time, since the silicon nitride film 10 acts as an etching stopper, the etching time may be lengthened. In this case, the etching time may be set short so as to remove only at least part of the silicon oxide film. In particular, since the silicon oxide film 12 is a thermal oxide film, the film quality may be good and remain.

Furthermore, as shown in Figs. 53A to 53C, thermal oxidation is performed if necessary to form the silicon oxide film 17 on the top and sidewalls of the polysilicon film 16. The silicon oxide film 18 having a film thickness of 500 kPa is deposited on the film by the CVD method.

Thereafter, the memory cells as shown in Figs. 54A to 54C are completed in the same manner as in the first embodiment.

According to this manufacturing method, when the first memory node and the bit line contact hole are formed, a polysilicon film serving as an etching stopper is formed, so that there is no need to allow a margin in consideration of misalignment with the gate electrode. This makes it possible to refine the microstructure and improve reliability.

According to this manufacturing method, the surface of the damaged interlayer insulating film 13 is once removed and covered with a new silicon oxide film 18, and the silicon oxide is also formed on the sidewalls of the elongated portion of the polysilicon film 16. Since the film 17 is formed, even if the distance between the buried layers is further reduced, the internal pressure can be maintained satisfactorily.

Furthermore, in the above embodiment, a DRAM having a stacked memory cell structure has been described, but the manufacturing method of the present invention is not limited to a DRAM having a stacked memory cell structure, and a step of forming contact holes having a high aspect ratio. It is also an effective method when forming another apparatus including a.

[Effects of the Invention]

As described above, according to the semiconductor memory device of the present invention, at least one of the memory node contact hole or the bit line contact hole forms the first contact hole after the first interlayer insulating film is formed on the gate electrode, Embedding the conductive layer to a position higher than the gate electrode, and further, forming an interlayer insulating film on the upper layer, etching a part of the interlayer insulating film to expose the conductive layer, and forming a second contact hole for the conductive layer. Therefore, it becomes possible to aim at miniaturization and improvement of reliability.

In addition, when the capacitor is formed above the bit line, the storage node electrode can be easily processed, the capacitor area can be increased, and the plate electrode need not be patterned in the cell array, thereby improving reliability.

In addition, since at least the surface of the damaged first interlayer insulating film, which causes short circuits between buried layers, is removed and replaced with a high quality second interlayer insulating film, there is no fear of a short circuit, thereby obtaining a reliable semiconductor memory device. It becomes possible.

Claims (11)

Forming a MOSFET having a gate electrode and a source / drain region of a second conductive impurity formed on a surface of the first conductive semiconductor substrate, forming a first interlayer insulating film over the gate electrode; Forming a first contact hole exposing the surface of the substrate so as to be in contact with at least one of the source and drain regions of the substrate; and embedding a conductive layer so as to reach a position higher than the gate electrode in the first contact hole; Forming a second interlayer insulating film over the conductive layer; selectively removing a portion of the second interlayer insulating film to form a second contact hole exposing the conductive layer; the first and second contact holes Forming a storage node electrode connected to one of the source and drain regions of the MOSFET through a process; forming a capacitor insulating film on an upper layer of the storage node electrode; Forming a plate electrode on an upper layer of the capacitor insulating film, forming a third interlayer insulating film on the upper layer of the plate electrode, forming a third contact hole as a bit line contact hole in the third interlayer insulating film, and And forming a bitness connected to the other of the source / drain regions of the MOSFET through a bit line contact hole. The method of claim 1, wherein the step of forming the first contact hole comprises etching the first interlayer insulating film so that the opening area of the first contact hole is larger than the gate electrode. A method of manufacturing a semiconductor memory device. The method of claim 2, further comprising etching the first interlayer insulating film below the upper surface of the buried conductive layer after embedding the conductive layer and before forming the second interlayer insulating film. Method of manufacturing a semiconductor memory device. The method of claim 2, further comprising etching the first interlayer insulating film below the upper surface of the buried conductive layer after embedding the conductive layer and before forming the second interlayer insulating film. Method of manufacturing a semiconductor memory device. Forming a MOSFET having a gate electrode and a source / drain region of a second conductive impurity formed on a surface of the first conductive semiconductor substrate, forming a first interlayer insulating film over the gate electrode; Forming a first contact hole exposing the surface of the substrate so as to be in contact with at least one of the source and drain regions of the substrate; and embedding a conductive layer so as to reach a position higher than the gate electrode in the first contact hole; Forming a second interlayer insulating film over the conductive layer; selectively removing a portion of the second interlayer insulating film to form a second contact hole exposing the conductive layer; Forming a bit line connected to one of the source and drain regions of the MOSFET through a second contact hole, and forming a third interlayer insulating film over the bit line. Forming a third contact hole as a memory node contact hole in the third interlayer insulating film, forming a memory node electrode connected to the other of the source and drain regions of the MOSFET through the memory node contact hole, and storing the memory. Forming a capacitor insulating film on the upper layer of the node electrode, and forming a plate electrode on the upper layer of the capacitor insulating film. 6. The process of claim 5, wherein the step of forming the first contact hole includes a step of etching the first interlayer insulating film so that the opening area of the first contact hole is larger than the gate electrode. A method of manufacturing a semiconductor memory device. The method of claim 6, further comprising etching the first interlayer insulating film below the upper surface of the buried conductive layer after embedding the conductive layer and before forming the second interlayer insulating film. Method of manufacturing a semiconductor memory device. The semiconductor memory device according to claim 7, further comprising a thermal oxidation step of oxidizing the surface of the buried conductive layer after etching the first interlayer insulating film and before forming the second interlayer insulating film. Way. The method of claim 5, further comprising the step of etching the first interlayer insulating film below the upper surface of the buried conductive layer after embedding the conductive layer and before forming the second interlayer insulating film. Method of manufacturing a semiconductor memory device. The semiconductor memory device according to claim 9, further comprising a thermal oxidation step of oxidizing the surface of the buried conductive layer after etching the first interlayer insulating film and before forming the second interlayer insulating film. Way. 6. The method of manufacturing a semiconductor memory device according to claim 5, wherein the step of embedding the conductive layer includes a step of forming the conductive layer thicker than the depth of the first contact hole.

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