KR100196287B1 - Plunger up shaft of die bonding equipment - Google Patents

Plunger up shaft of die bonding equipment Download PDF

Info

Publication number
KR100196287B1
KR100196287B1 KR1019960039925A KR19960039925A KR100196287B1 KR 100196287 B1 KR100196287 B1 KR 100196287B1 KR 1019960039925 A KR1019960039925 A KR 1019960039925A KR 19960039925 A KR19960039925 A KR 19960039925A KR 100196287 B1 KR100196287 B1 KR 100196287B1
Authority
KR
South Korea
Prior art keywords
plunger
shaft
die bonding
bonding equipment
equipment
Prior art date
Application number
KR1019960039925A
Other languages
Korean (ko)
Inventor
Yoon Park
Jae-Cheon Do
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority to KR1019960039925A priority Critical patent/KR100196287B1/en
Application granted granted Critical
Publication of KR100196287B1 publication Critical patent/KR100196287B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
KR1019960039925A 1996-09-13 1996-09-13 Plunger up shaft of die bonding equipment KR100196287B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960039925A KR100196287B1 (en) 1996-09-13 1996-09-13 Plunger up shaft of die bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960039925A KR100196287B1 (en) 1996-09-13 1996-09-13 Plunger up shaft of die bonding equipment

Publications (1)

Publication Number Publication Date
KR100196287B1 true KR100196287B1 (en) 1999-06-15

Family

ID=19473788

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960039925A KR100196287B1 (en) 1996-09-13 1996-09-13 Plunger up shaft of die bonding equipment

Country Status (1)

Country Link
KR (1) KR100196287B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101104342B1 (en) * 2009-03-27 2012-01-16 서우테크놀로지 주식회사 Wafer chip eject apparatus
KR20180029852A (en) * 2016-09-12 2018-03-21 파스포드 테크놀로지 주식회사 Semiconductor manufacturing device and manufacturing method of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101104342B1 (en) * 2009-03-27 2012-01-16 서우테크놀로지 주식회사 Wafer chip eject apparatus
KR20180029852A (en) * 2016-09-12 2018-03-21 파스포드 테크놀로지 주식회사 Semiconductor manufacturing device and manufacturing method of semiconductor device
KR101970401B1 (en) 2016-09-12 2019-04-18 파스포드 테크놀로지 주식회사 Semiconductor manufacturing device and manufacturing method of semiconductor device

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Legal Events

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A201 Request for examination
E701 Decision to grant or registration of patent right
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FPAY Annual fee payment

Payment date: 20080201

Year of fee payment: 10

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