KR100191086B1 - Radiation curing composition - Google Patents

Radiation curing composition Download PDF

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KR100191086B1
KR100191086B1 KR1019940036794A KR19940036794A KR100191086B1 KR 100191086 B1 KR100191086 B1 KR 100191086B1 KR 1019940036794 A KR1019940036794 A KR 1019940036794A KR 19940036794 A KR19940036794 A KR 19940036794A KR 100191086 B1 KR100191086 B1 KR 100191086B1
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photocurable composition
formula
compound
iii
dry film
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KR960022852A (en
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이병일
지승룡
황재영
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구광시
주식회사코오롱
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C08F220/301Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and one oxygen in the alcohol moiety
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C08F220/305Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety
    • C08F220/306Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety and polyethylene oxide chain in the alcohol moiety
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C08F222/1025Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00Chemical modification by after-treatment
    • C08F8/30Introducing nitrogen atoms or nitrogen-containing groups

Abstract

본 발명은 코팅재료, 포토레지스트 등으로 유용한 광경화성 조성물에 관한 것으로서, 자외선 감도가 높고 해상도가 좋으며 밀착력이 우수하고 내약품성과 텐팅(Tenting)성이 향상된 알카리 현상성 광경화성 조성물이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photocurable composition useful as a coating material, photoresist, and the like, and is an alkali developable photocurable composition having high UV sensitivity, high resolution, good adhesion, and improved chemical resistance and tenting property.

Description

광경화성 조성물Photocurable composition

본 발명은 코팅재료, 포토레지스트 등으로 유용한 광경화성 조성물에 관한 것으로서, 더욱 상세하게는 자외선 감도가 높고 해상도가 좋으며 밀착력이 우수하고 내약품성과 텐팅(Tenting)성이 향상된 알카리 현상성 광경화성 조성물이다.The present invention relates to a photocurable composition useful as a coating material, photoresist, and the like, and more particularly, to an alkali developable photocurable composition having high UV sensitivity, high resolution, excellent adhesion, and improved chemical resistance and tenting property. .

일반적으로 광경화 조성물은 프린트 배선판, 인쇄회로기판, 금속 릴리프상 형성 등의 미세가공에 사용된다.In general, the photocurable composition is used for microfabrication of printed wiring boards, printed circuit boards, metal relief phases, and the like.

광경화 조성물을 금속표면 등에 도포나 라미네이션에 의하여 적층하고 자외선을 조사하여 노광하면 노광부는 경화되고 미노광부는 적당한 용제에 의해 제거되어 원하는 화상을 형성한다. 이러한 용제로는 크게 수용성과 비수용성으로 나뉜다. 비수용성 용제는 작업환경과 환경오염 그리고 제조단가 면에서 불리하여 수용성 용제로 현상하는 광경화 조성물이 증가 추세에 있다.When the photocurable composition is laminated by coating or lamination on a metal surface or the like, and irradiated with ultraviolet rays, the exposed portion is cured and the unexposed portion is removed by a suitable solvent to form a desired image. Such solvents are largely divided into water-soluble and water-insoluble. Water-insoluble solvents are disadvantageous in terms of working environment, environmental pollution, and manufacturing cost, and photocurable compositions that develop with water-soluble solvents are increasing.

통상적으로 광경화 조성물은 광에 의해 광중합을 하는 다관능성 단량체, 광중합이 일어나도록 광에 의해 라디칼이나 라디칼을 유도하는 광개시제, 광중합 조성물의 기계적 강도와 텐팅성 및 접착성을 부여하는 고분자 결합제, 그리고 염료와 안정제, 접착촉진제, 열중합방지제 등의 첨가제로 이루어진다.Typically, the photocurable composition is a polyfunctional monomer that photopolymerizes by light, a photoinitiator that induces radicals or radicals by light to cause photopolymerization, a polymeric binder that imparts mechanical strength, tentability and adhesion of the photopolymerization composition, and a dye And additives such as stabilizers, adhesion promoters and thermal polymerization inhibitors.

광경화성 조성물은 액상으로 사용할 수도 있고 작업성 및 오염방지를 위해 광경화 조성물로 이루어진 감광층을 광투과성 폴리에스터 필름과 보호필름 사이에 적층하여 사용하기도 한다. 사용시는 보호필름을 벗겨내고 동적층 판상에 라미네이션하여 적층하고 자외선을 조사하여 현상과정을 거쳐 화상을 형성시킨다.The photocurable composition may be used in a liquid state, or a photosensitive layer made of the photocurable composition may be laminated between the light transmissive polyester film and the protective film for workability and contamination prevention. In use, the protective film is peeled off and laminated by lamination on a dynamic layer plate and irradiated with ultraviolet rays to form an image through a development process.

광중합성 다관능성 단량체는 개시제에 의해 광중합하여 현상액에는 내성을 가져야 하고 박리액에는 제거되는 성질을 가져야 한다. 통상적으로 다관능성 단량체는 α,β-에틸렌성 불포화 결합을 적어도 1개 이상 갖는 화합물을 사용한다. 광중합 측면에서 볼 때 분자중에 2개 이상의 아크릴로일기나 메타크릴로일기를 갖는 화합물이 바람직하다. 예를 들어 글리콜디아크릴레이트 유도체(예: 에틸렌글리콜디아크릴레이트, 디에틸렌글리콜디아크릴레이트, 트리에틸렌글리콜디아크릴레이트, 폴리에틸렌글리콜디아크릴레이트, 프로필렌글리콜디아크릴레이트, 디프로필렌글리콜디아크릴레이트, 폴리프로필렌글리콜디아크릴레이트, 1,4-부탄디올디아크릴레이트, 1,5-펜탄디올디아크릴레이드, 1,6-헥산디올디아크릴레이트 등)들과 비스페놀A의 에틸렌이나 프로필렌 옥사이드 부가물(예: N,N' -메틸렌비스아크릴아미드, N,N' -벤질리덴비스아크릴아미드 등)과 3개 이상의 아크릴레이트를 갖는 화합물(예: 글리세린트리아크릴레이트, 트리메틸올프로판트리아크릴레이트, 트리메틸올에탄트리아크릴레이트, 펜타에리트리톨트리아크릴레이트, 펜타에리트리톨테트라아크릴레이트, 디펜타에리트리톨헥사아크릴레이트 등) 또는 상기 아크릴레이트에 대응하는 메타크릴레이트 화합물이 사용된다.The photopolymerizable polyfunctional monomer should be photopolymerized by the initiator to be resistant to the developer and to be removed from the stripper. Typically, the polyfunctional monomer uses a compound having at least one α, β-ethylenically unsaturated bond. From the viewpoint of photopolymerization, a compound having two or more acryloyl or methacryloyl groups in the molecule is preferable. For example, glycol diacrylate derivatives such as ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, propylene glycol diacrylate, dipropylene glycol diacrylate, Polypropylene glycol diacrylate, 1,4-butanediol diacrylate, 1,5-pentanediol diacrylate, 1,6-hexanediol diacrylate, etc., and ethylene or propylene oxide adducts of bisphenol A : N, N'-methylenebisacrylamide, N, N'-benzylidenebisacrylamide, etc.) and a compound having three or more acrylates (e.g. glycerin triacrylate, trimethylolpropane triacrylate, trimethylol ethane) Triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaarc Or the like, or a methacrylate compound corresponding to the acrylate.

광중합 개시제(광개시제)는 자외선에 의해 전자의 여기를 수반하여 자체가 라디칼을 생성시키거나 다른 화합물이 라디칼을 생성하도록 유도하여 다관능성 단량체가 중합되도록 해준다. 광개시제의 종류와 함량에 따라 조성물의 광경화 속도가 크게 좌우되는 바, 예를 들어 벤조인, 벤조인메틸에테르, 벤조인에틸에테르, 벤조인이소프로필에테르, 벤질 등과 벤조페논, 4,4' -비스(디에틸아미노)벤조페논, 클로로벤조페논, 4,4' -디메틸아미노벤조페논, 4,4' -디클로로벤조페논 등의 알킬벤조페논류, 2-에틸안트라퀴논, 2-t-부틸안트라퀴논 등의 안트라퀴논류, 그리고 4-(디알킬아미노)벤조산알킬에스터, 2,4,5-트리아릴이미다졸 이량체 및 이의 유도체 또는 로빈이량체나 로빈이량체와 로이코트리페닐메탄염료, 트리아릴메탄로이코염료 등의 염료류들과 이들의 조합으로 사용된다.Photopolymerization initiators (photoinitiators) allow the polyfunctional monomers to polymerize by ultraviolet radiation, leading to the generation of radicals by themselves with the excitation of electrons or other compounds to generate radicals. The photocuring rate of the composition is greatly influenced by the type and content of the photoinitiator. For example, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl and the like benzophenone, 4,4 '- Alkyl benzophenones such as bis (diethylamino) benzophenone, chlorobenzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 2-ethylanthraquinone and 2-t-butylanthra Anthraquinones such as quinones, 4- (dialkylamino) benzoic acid alkyl esters, 2,4,5-triarylimidazole dimers and derivatives thereof, or robin dimers, robin dimers, and leukotriphenylmethane dyes, It is used by dyes, such as a triaryl methane lyco dye, and a combination thereof.

고분자 결합제로는 유기고분자, 예를 들면 아크릴계 폴리머, 스티렌계 폴리머, 폴리아세트산비닐, 에틸렌아세트산비닐, 폴리염화비닐, 염화비닐-아세트산비닐 공중합체, 염소화촐리에틸렌, 염소화 폴리프로필렌, 염화비닐리덴계 폴리머, 폴리에스터, 폴리아미드, 폴리우레탄, 폴리비닐아세탈, 알키드수지, 페놀수지, 에폭시수지, 아세트산셀룰로오즈, 질산화면, 스티렌-부티렌 공중합체, 스티렌-아크릴로니트릴 공중합체, 염화고무, 말레인산 무수물의 비닐공중합체, 방향족 술폰마이드포름알데하이드수지 등이 사용된다.Examples of the polymer binder include organic polymers such as acrylic polymers, styrene polymers, polyvinyl acetate, ethylene vinyl acetate, polyvinyl chloride, vinyl chloride-vinyl acetate copolymers, chlorinated polyethylene, chlorinated polypropylene, and vinylidene chloride polymers. , Polyester, polyamide, polyurethane, polyvinyl acetal, alkyd resin, phenol resin, epoxy resin, cellulose acetate, nitrate screen, styrene-butylene copolymer, styrene-acrylonitrile copolymer, rubber chloride, maleic anhydride Vinyl copolymers, aromatic sulfonamide formaldehyde resins, and the like.

기타 첨가제로는 염료, 안정제, 접착촉진제 및 열중합방지제 등이 있다. 염료에는 루이코 계통의 염료가 주로 사용되며 메틸바이올렛, 말라카이드 그린, 크리스탈바이올렛 등이 있다. 그 외는 목적에 따라 선택하여 첨가해준다.Other additives include dyes, stabilizers, adhesion promoters and thermal polymerization inhibitors. For dyes, leuco-based dyes are mainly used and include methyl violet, malachide green, and crystal violet. Others are selected and added according to the purpose.

광경화성 조성물로부터 제조된 알카리 현상성 드라이 필름 포토레지스트는 드라이 필름 포토레지스트로부터 보호 필름층을 취외하여 동판에 라미네이션하여 포토 마스크 필름 등을 사용해서 자외선 노광을 행한 후 임의의 농도와 온도의 알카리 수용액을 이용하여 미노광 부위를 제거하여 포토 레지스트상을 형성한다. 알카리 수용액을 이용하여 미노광 부위를 제거하여 포토 레지스트상을 형성시키는 과정을 현상이라 부른다. 현상시 미노광 부위의 감광층이 30±5℃ 온도범위의 0.5∼1.5 중량% 탄산나트륨 또는 탄산칼륨 수용액에 용해되어 화상을 형성하게 된다.Alkaline developable dry film photoresist prepared from the photocurable composition is obtained by removing the protective film layer from the dry film photoresist and laminating it on a copper plate to perform ultraviolet exposure using a photo mask film or the like, and then applying an alkaline aqueous solution having an arbitrary concentration and temperature. Unexposed portions are removed to form a photoresist image. The process of forming the photoresist image by removing the unexposed portions using an alkaline aqueous solution is called development. At the time of development, the photosensitive layer of the unexposed portion is dissolved in 0.5-1.5 wt% sodium carbonate or potassium carbonate aqueous solution in the temperature range of 30 ± 5 ° C. to form an image.

인쇄회로기판을 제작하는 공법은 도금공법과 에칭공법이 있다. 도금공법에서는 도금액 및 여러가지 첨가제 약품에 대하여 기판상에 도금이 행해지는 동안 드라이 필름 레지스트가 침식을 받아 벗겨지지 않도록 내도금성을 지녀야 하고 텐팅공법에서는 드라이 필름 레지스트 막 자체의 탄성이 요구되어진다. 드라이 필름 레지스트는 기판의 상하면에 전도성을 부여하는 임의의 크기의 구멍을 에칭액으로부터 보호하기 위하여 구멍을 덮고 있는 레지스트로서 작용한다. 30±5℃의 온도에서 0.5∼1.5 중량%의 탄산나트륨 또는 탄산칼륨 수용액으로 분사 방식에 의해 현상되는 현상 조건과, 50±5℃ 온도범위의 FeCl2 ,FeCl3 ,CuCl2 ,CuCl3및 과황산 암모니아 등의 에칭액이 분사되는 에칭 조건에 대하여 기판상의 구멍을 막고 있는 드라이 필름의 외부 응력에 대한 탄성이 부족할 경우 파괴되어 버리는 문제점이 발생한다.There are two methods for manufacturing a printed circuit board, a plating method and an etching method. In the plating method, the plating solution and various additive chemicals must be plated to prevent the dry film resist from being eroded and peeled off during plating on the substrate. In the tenting method, the elasticity of the dry film resist film itself is required. The dry film resist acts as a resist covering the pores to protect the pores of any size that impart conductivity to the upper and lower surfaces of the substrate from the etchant. Development conditions developed by spraying with an aqueous solution of 0.5 to 1.5% by weight of sodium carbonate or potassium carbonate at a temperature of 30 ± 5 ° C., and FeCl 2, FeCl 3, CuCl 2, CuCl 3 and persulfate in the temperature range of 50 ± 5 ° C. If the elasticity against the external stress of the dry film blocking the hole on the substrate with respect to the etching conditions in which the etching solution such as ammonia is injected, there is a problem that is broken.

기존의 알카리 현상형 감광성 필름은 상기 전술한 구성성분들의 광경화성 조성물로 구성시 현상속도가 충분하지 않고, 텐팅성이 부족하며 내약품성이 떨어지는 단점이 있다.Existing alkali-developing photosensitive film has a disadvantage in that the development speed is not sufficient when it is composed of the photocurable composition of the above-described components, lacking in tentability and inferior in chemical resistance.

본 발명은 종래기술에서 감도와 텐팅성이 특히 떨어지는데 착안하여 공중합 단량체 자체가 높은 텐팅성을 갖는 화합물로 설계하였고, 이 화합물 내에 감광성 기를 도입함으로써 외부에서 넣어주는 개시제의 함량을 줄여도 충분한 감도와 해상력을 가짐을 알았다.In the present invention, the sensitivity and tentability are particularly low in the prior art, and the copolymerization monomer itself is designed as a compound having a high tentability, and by introducing a photosensitive group into the compound, sufficient sensitivity and resolution can be achieved even by reducing the content of an initiator to be put externally. I knew it was.

본 발명의 광경화성 조성물 중 광중합성 다관능성 단량체에 하기의 구조식(Ⅰ), (Ⅱ) 및 (Ⅲ)으로 표시되는 화합물을 광경화 조성물 전체에 대해 10∼40 중량% 함유시 좋은 물성을 갖는 광경화성 조성물이 얻어짐을 발견하였다.In the photocurable composition of the present invention, the photopolymerizable polyfunctional monomer contains a compound represented by the following structural formulas (I), (II) and (III) with 10 to 40% by weight of the entire photocurable composition. It was found that a chemical composition was obtained.

상기 식(Ⅰ)에서 R은(여기서 R1 또는임) 또는(여기서, R2및 R3는 각각 H, CH3, 또는 C2H5이고, m 및 n은 각각 0~3임)In formula (I), R is Where R 1 is or Im) or Wherein R 2 and R 3 are each H, CH 3 , or C 2 H 5 , and m and n are each 0-3

상기 식(Ⅱ)에서 R4, R5는 각각 H 또는 CH3이고, ℓ은 6~20이다.In Formula (II), R 4 , R 5 are each H or CH 3 , and L is 6-20.

상기 식(Ⅲ)에서 R6, R7는 각각 H 또는 CH3이고, x+y=10~30이다.In formula (III), R 6 , R 7 are each H or CH 3 , and x + y = 10-30.

상기 구조식(Ⅰ)의 R부분이 감광성기를 갖고 있음으로 인해 광경화성 조성물의 감도가 향상되고 해상도가 좋아지고, 구조식(Ⅰ) 자체의 강직성으로 인해 텐팅성 및 내약품성이 우수해진다. 본 발명에서 구조식(Ⅰ) 화합물의 R부분이 감광성기를 갖기 않는 알킬 구조라도 구조의 강직성으로 인해 광경화 조성물의 텐팅성 및 내약품성은 일반 감광성 조성물에 비해 상당히 우수하다.Since the R portion of the structural formula (I) has a photosensitive group, the sensitivity of the photocurable composition is improved, the resolution is improved, and the rigidity and chemical resistance are excellent due to the rigidity of the structural formula (I) itself. In the present invention, even if the R portion of the compound of formula (I) does not have a photosensitive group, the tenting and chemical resistance of the photocurable composition are considerably superior to those of the general photosensitive composition due to the rigidity of the structure.

구조식(Ⅰ)의 화합물을 구조식(Ⅱ) 및 (Ⅲ)의 화합물인 알킬디아크릴에이트와 조합하여 사용시 광중합 개시제와 염료의 양을 줄일 수 있어 자외선이 깊은 곳까지 침투가 가능하여 해상력이 우수해지고 깨끗한 화상을 얻을 수 있게 된다.When the compound of formula (I) is used in combination with alkyl diacrylates, which are the compounds of formulas (II) and (III), the amount of photopolymerization initiator and dye can be reduced, allowing penetration into deeper UV rays, resulting in excellent resolution and clean The image can be obtained.

구조식(Ⅱ)와 (Ⅲ)은 광중합 후 레지스트의 탄성을 부여해주어 상기 화합물(Ⅰ)의 강직성으로 인해 레지스트가 브리틀(Brittle)해지는 것을 방지하여 텐팅성이 발현되도록 도와준다. 따라서 이들 첨가량은 적정 함량이 존재한다.Structural formulas (II) and (III) impart elasticity of the resist after photopolymerization, thereby preventing the resist from brittle due to the rigidity of the compound (I), thereby helping to develop the tentability. Therefore, these addition amounts exist in an appropriate amount.

본 조성물에서, 화합물(Ⅰ)은 다관능성 단량체 대비 5∼40 중량%, 화합물(Ⅱ)와 화합물(Ⅲ)의 합은 60∼95 중량%가 적당하다. 화합물(Ⅰ)의 첨가량이 너무 적으면 효과가 적고, 첨가량이 너무 많으면 브리틀(Brittle)해져 깨지기 쉬워 원하는 텐팅성을 얻을 수 없다.In this composition, 5-40 weight% of compound (I) with respect to a polyfunctional monomer, and 60-95 weight% of the sum total of compound (II) and compound (III) are suitable. If the amount of the compound (I) is too small, the effect is small. If the amount of the compound (I) is too large, brittle becomes brittle and the desired tentability cannot be obtained.

이하, 실시예를 통하여 본 발명을 더욱 구체적으로 설명하겠는 바, 실시예로 인하여 본 발명이 한정되는 것은 아니다. 실시예에서 물성측정 방법은 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited by Examples. Physical property measurement method in the Example is as follows.

측정조건Measuring conditions

☆ 라미네이션 : 광경화성 조성물로부터 제작되어진 드라이 필름 포토 레지스트의 경석(Pumice)연마 처리되어진 1.6㎜ 두께의 동박 적층판의 한쪽면에 라미네이트 롤온도 120℃, 롤압력 3.0㎏/㎠, 롤속도 1.5 분/m의 조건으로 다이나켐(Dynachem) 360을 이용하여 라미네이션하였다.Lamination: Laminate roll temperature 120 ℃, roll pressure 3.0kg / ㎠, roll speed 1.5min / m on one side of 1.6mm thick copper foil laminate plate of pumice polishing of dry film photoresist made from photocurable composition Lamination was carried out using Dynachem 360 under the condition of.

☆ 현상성 : 동박 적층판에 라미네이션한 드라이 필름 포토 레지스트를 20분 방치한 후 30℃의 온도, 1.0 중량%의 탄산나트륨 수용액의 스프레이 분사 방식의 현상조건으로 현상을 실시하였다. 이 때 동박 적층판상의 미노광 부위의 드라이 필름 포토 레지스트가 현상액에 완전히 씻겨지기까지 소요된 시간을 초시계를 이용하여 측정하였다. 상기의 조건으로 현상한 후 50℃의 열풍 오븐에서 10분간 건조하여 200 배율의 광학 현미경으로 드라이 필름의 표면상태를 관찰하였다.☆ Developability: After leaving the dry film photoresist laminated on the copper foil laminated board for 20 minutes, it developed by developing conditions of the spray injection system of the temperature of 30 degreeC, and 1.0 weight% sodium carbonate aqueous solution. At this time, the time required until the dry film photoresist of the unexposed part on a copper foil laminated board was fully wash | cleaned by the developing solution was measured using the stopwatch. After developing under the above conditions, the resultant was dried for 10 minutes in a hot air oven at 50 ° C., and the surface state of the dry film was observed with an optical microscope at 200 magnification.

☆ 감도 : 동박 적층판에 라미네이션한 드라이필름 포토 레지스트를 21단 스스토우퍼 타블레이트 네가티브형 포토마스트로 콜라이트(Collight)사의 모델 930SA를 이용하여 20mJ와 40mJ의 노광량으로 자외선을 조사한 후 20분 방치하였다. 그 후 30℃의 온도에서 60초간 1.0 중량%의 탄산나트륨 수용액의 스프에리 분사방식의 현상조건으로 현상을 실시하고, 50℃의 열풍에서 20분간 건조한 후 광이 투과된 단수를 읽었다.☆ Sensitivity: The dry film photoresist laminated on the copper foil laminate was subjected to UV irradiation at 20mJ and 40mJ exposure dose using a model 930SA manufactured by Collight, a 21-stage stopper tablet negative photomask, and left for 20 minutes. . Thereafter, the development was carried out under the development conditions of a spraying method of 1.0 wt% sodium carbonate aqueous solution for 30 seconds at a temperature of 30 ° C., and dried for 20 minutes in a hot air of 50 ° C., and then read the number of passes through the light.

☆ 텐팅성 : 지름이 5㎜인 구멍이 20개가 있는 1.6㎜ 두께의 동박 적층판을 상의 조건과 동일한 조건으로 현상까지 행하여 동일한 조건으로 건조한 후, 지름이 3㎜인 철봉을 이용한 구멍 압축파괴를 인스트론으로 20개 구멍 모두 행하였다. 이 때 일정한 힘과 속도로 구멍압축시, 각각의 드라이 필름 막이 파괴되어질 때 걸리는 평균 응력을 기록하였다. 인스트론 측정조건은 23℃의 실내 온도, 50%의 실내 습도하에서 1㎏의 로스쎌 및 50㎜/분의 크로스헤드 속도로 행하였다.☆ Tensability: 1.6mm thick copper foil laminate with 20 holes of 5mm diameter was developed under the same conditions as above conditions and dried under the same conditions, followed by compression of hole compression using an iron rod of 3mm diameter. All 20 holes were made. At this time, the average stress that occurs when each dry film film breaks during hole compression at a constant force and speed was recorded. Instron measurement conditions were carried out at a room temperature of 23 ° C., 50% room humidity at a loss of 1 kg and a crosshead speed of 50 mm / min.

[실시예]EXAMPLE

고분자 결합제는 고분자 결합제 대비 중량%로 아크릴산 10, 메타크릴산 15, 메틸메타크릴레이트 60, 2-에틸헥실아크릴레이트 15를 조합하여 제조한 아크릴 공중합체를 사용하였다. 그러나 이는 본 발명의 이해를 돕기 위한 방법일 뿐 본 발명이 이에 한정하는 것은 아니다. 본 발명에서는 상기 아크릴 단량체외에 본 발명의 목적을 벗어나지 않는 범위에서 메틸아크릴레이트, 스티렌, 2-페녹시메킬아크릴레이트, 2-페녹시에틸아크릴레이트, 말레익산, 말레익산무수물, 비닐아세테이트 등의 조함으로 제조된 아크릴 공중합체를 사용하여도 좋다.The polymer binder was an acrylic copolymer prepared by combining acrylic acid 10, methacrylic acid 15, methyl methacrylate 60, and 2-ethylhexyl acrylate 15 in weight% relative to the polymer binder. However, this is only a method for helping understanding of the present invention, but the present invention is not limited thereto. In the present invention, in addition to the above acrylic monomers, in the range without departing from the object of the present invention, methyl acrylate, styrene, 2-phenoxy methyl acrylate, 2-phenoxy ethyl acrylate, maleic acid, maleic anhydride, vinyl acetate You may use the acrylic copolymer manufactured by this.

광경화 조성물의 전체 조성을 표 1에 나타내었다. 광개시제와 첨가제는 본 발명의 목적을 벗어나지 않는 범위에서 자유로이 첨가할 수 있다.The overall composition of the photocurable composition is shown in Table 1. Photoinitiators and additives may be added freely without departing from the object of the present invention.

광중합성 단량체는 상기의 구조식(Ⅰ),(Ⅱ) 및 (Ⅲ)으로 나타내어지는 다관능성 단량체를 동시에 포함한다.The photopolymerizable monomer simultaneously contains the polyfunctional monomer represented by the above structural formulas (I), (II) and (III).

[실시예 1∼7]EXAMPLES 1-7

상기 표1의 조성에서 광중합성 다관능성 단량체의 함량을 전체 광경화성 조성물의 30 중량%가 되는 범위에서 표 2의 구조와 비율로 첨가하여 광경화성 조성물을 만들고 이를 폴리에스터위에 40㎛로 도포하고 보호필름으로 적층하여 드라이 필름 포토레지스트를 제조하였다. 제조된 드라이 필름 포토레지스트를 동박 적층판에 라미네이션하여 감도와 현상시간, 그리고 텐팅성을 평가하였다. 표 3에 평가한 결과를 나타내었다.In the composition of Table 1, the content of the photopolymerizable multifunctional monomer is added to the structure and ratio of Table 2 in a range of 30% by weight of the total photocurable composition to make a photocurable composition, which is applied to the polyester at 40 μm and protected. Lamination to a film to prepare a dry film photoresist. The prepared dry film photoresist was laminated on a copper foil laminate to evaluate sensitivity, development time, and tentability. Table 3 shows the results of the evaluation.

[비교예 1∼3]Comparative Examples 1-3

상기 실시예와 같은 방법으로 제조하되 투입되는 광중합성 다관능성 단량체의 함량과 구조는 표 2에 나타나있다. 이로부터 제조된 광경화성 조성물을 실시예와 같은 방법으로 드라이 필름 포토레지스트를 제조하여 물성을 측정하였다.The content and structure of the photopolymerizable polyfunctional monomer prepared in the same manner as in Example, but added, are shown in Table 2. The photocurable composition prepared therefrom was prepared in a dry film photoresist in the same manner as in Example to measure physical properties.

Claims (1)

광중합성 다관능성 단량체, 광중합 개시제, 고분자 결합제 및 첨가제를 함유하는 통상적인 광경화성 조성물에 있어서, 상기 다관능성 단량체의 함량이 전체 조성물 기준으로 10∼40 중량%이고, 상기 다관능성 단량체는 하기 구조식(Ⅰ), (Ⅱ) 및 (Ⅲ)의 화합물로 구성되며, 상기 다관능성 단량체 중에 구조식(Ⅰ)의 화합물의 함량이 무게비로 5∼40%이고, 하기 구조식(Ⅱ)의 화합물과 구조식(Ⅲ)의 화합물의 합량(Ⅱ+Ⅲ)이 무게비로 60∼95%인 것을 특징으로 하는 광경화성 조성물:In a conventional photocurable composition containing a photopolymerizable polyfunctional monomer, a photopolymerization initiator, a polymer binder, and an additive, the content of the multifunctional monomer is 10 to 40 wt% based on the total composition, and the polyfunctional monomer is represented by the following structural formula ( Comprising compounds of I), (II) and (III), the content of the compound of formula (I) in the polyfunctional monomer is 5 to 40% by weight, and the compound of formula (II) and formula (III) The total amount (II + III) of the compound of 60-95% by weight of the photocurable composition, characterized in that: 상기 식(Ⅰ)에서 R은(여기서 R1 또는임) 또는(여기서, R2및 R3는 각각 H, CH3, 또는 C2H5이고, m 및 n은 각각 0~3임)], In formula (I), R is Where R 1 is or Im) or (Wherein R 2 and R 3 are each H, CH 3 , or C 2 H 5 , m and n are each 0 to 3), [상기 식(Ⅱ)에서 R4, R5는 각각 H 또는 CH3이고, ℓ은 6~20임][In Formula (II), R 4 , R 5 are each H or CH 3 , and L is 6-20. [상기 식(Ⅲ)에서 R6, R7는 각각 H 또는 CH3이고, x+y=10~30임].[In the formula (Ⅲ) R 6, R 7 are each H or CH 3, x + y = 10 ~ 30 Im.
KR1019940036794A 1994-12-26 1994-12-26 Radiation curing composition KR100191086B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980049928A (en) * 1996-12-20 1998-09-15 구광시 Photocurable Resin Composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980049928A (en) * 1996-12-20 1998-09-15 구광시 Photocurable Resin Composition

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