KR0170667B1 - Board holding apparatus for surface mounting device and controlling method thereof - Google Patents

Abstract

BACKGROUND OF THE INVENTION In a surface mounter for assembling electronic components on a circuit board, a substrate supporting apparatus is provided in which height adjusting means is provided so as to perform efficient work on circuit boards having various thicknesses.

When working with substrates of different thicknesses, if pneumatic cylinders are used for the substrate support device, manually adjust the nut or insert the adjusting block, or the cost of the equipment if the servo motor is used. There was a problem that this was high.

To solve this problem, the housing, the fixed gear, the pneumatic cylinder driving the fixed gear, the adjusting gear, the rack gear engaged with the adjusting gear, the spring supporting the rack gear, the cylinder rod for height adjustment, the pneumatic driving the cylinder rod A separate adjusting device including a cylinder or the like was provided.

Substrate support devices having such adjustment devices can be used in surface mounters for mounting components on circuit boards of various thicknesses.

Description

Substrate supporting device of surface mounter and its adjusting method

1 is a front view showing the configuration of a conventional substrate supporting apparatus using a pneumatic cylinder.

2 is a front view showing the configuration of a conventional substrate supporting apparatus using a servo motor.

3 is a front view showing the configuration of the substrate supporting apparatus according to the present invention, and

4 is a partial front view showing the part mounting by the head of the surface mounter, and B is a partial front view showing the state in which the head of the surface mounter is moved to the top of the cylinder rod for height adjustment. .

* Explanation of symbols for main parts of the drawings

1: substrate 2: head

2-1: Adjustment member 4: Assembly electronic parts

4: support plate 4-1: roller support plate

5 substrate support pin 6 fixing plate

7: first pneumatic cylinder 8: housing

9: axis 10: cam

11: roller 12: stopper

13: 2nd pneumatic cylinder 14: fixed gear

15: adjusting gear 16: spring

17 rack gear means 18 a third pneumatic cylinder

18-1: Cylinder Rod 19: Shaft

101: adjusting block 102: nut

103: pneumatic cylinder 104: substrate support pin

201: servo motor controller 202: servo motor

203: Ball Screw 204: Ball Screw Nut

205: servo motor pulley 206: ball screw pulley

207 support body 208 belt

209: support plate

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for supporting the bottom surface of a circuit board used when mounting an electronic component for surface mounting on an electronic circuit board, and a method of controlling the same. More particularly, the present invention relates to a component mounting surface of an electronic circuit board continuously supplied. Control means capable of assembling components on the mounting surface of the circuit board by reciprocating the support plate provided with the substrate support pin up and down so as to support the bottom surface with the substrate support pin, and correspondingly when the thickness of the electronic circuit board changes. An automatic substrate support apparatus of a surface mounter configured to be adapted by the present invention and a method of adjusting the same.

In the case of using an automatic surface mounter, height adjustment of the substrate support device is an essential task in which circuit components are accurately mounted on a printed circuit board. Since the head for the assembly of the parts of the automatic surface mounter is performed by the input data, the height of the substrate must be accurately determined in addition to the planar positioning. If the circuit board is placed too low in the height determination, either incomplete component mounting or component mounting will not occur. In addition, if the circuit board is positioned too high, an excessive force may be applied to the circuit board, thereby damaging the circuit board and the components. However, since the work by the surface mounter is not performed only for a circuit board having a constant thickness, when the work on a circuit board having a different thickness is required, the support height of the substrate must be adjusted accordingly. Of course, such height adjustment can be made by a method of changing the working height of the surface mounter itself and a method of changing the support height of the substrate supporting apparatus. However, the former method is not simple as it may have other side effects of the adjustment. For example, when selecting a method of changing the working height of the mounting head, not only the height value inputted for the components to be mounted should be changed in accordance with the thickness change amount, but the work position of the mounting machine may be changed. It can also cause a change in force on the poetry. Although a method of moving the entire surface mounter vertically may be conceivable, it may result in a decrease in the stability of the surface mounter due to the addition of the adjusting element and a decrease in the reliability of the surface mounter due to the weighting of the error elements. The latter method is a preferred method because the height adjustment is essential for the substrate supporting apparatus.

Conventional surface mounter substrate support devices are generally fabricated to be applied to and used in circuit boards of any particular substrate thickness range. For example, in the case of a mounting machine in which work is performed by a component mounting program and a control program for a specific circuit board, even if a specific working condition is slightly changed, the function cannot be performed again. In particular, when using a series of systemized equipment, all of the equipment is designed to operate in an organic relationship, so even if some equipment is changed, the defect of the product may increase rapidly. Similarly, if a device that can be operated for a specific range of substrate thicknesses, including tolerance values, needs to be worked on a circuit board outside of that range, then the work associated with it, including modifications to the device itself or changes to the program, etc. The condition must be changed. Otherwise, excessive force may be applied to the substrate, resulting in damage to the substrate or incomplete mounting of the component.

In principle, it is important to change the working conditions in consideration of the convenience of operation of the operator or the equipment manager. Conditional changes, such as cumbersome calculations that require a worker, or work by someone other than the worker, can lead to very inefficient situations in actual work. Therefore, it is most preferable that the adjustment can be made automatically.

In order to cope with such a situation, it is possible to design a mechanical device that basically accepts a wide range of conditions, but in many cases it is not preferable because it increases proportionally by error. For example, in the case of increasing the length of the ball screw, which is suitable for fine adjustment in the substrate support device of the surface mounter, and increasing the reciprocating distance of the support plate, that is, the stroke distance, The size can be said to increase in proportion to the size of the stroke. In a relatively coarse circuit board component mounting, this error does not affect the circuit characteristics or the performance of the board very much, but it can be very serious in a circuit circuit board requiring precision. Therefore, such an increase in error is not desirable because it causes many defects or degrades the quality of the automated surface mounter.

However, when it is necessary to process circuit boards having various thicknesses, the purchase of multiple equipments for this purpose causes an excessive cost, so that the board can be easily and precisely adapted to the thickness change of the board to cope with this. A support device is needed.

A method for responding to a thickness change of a circuit board in the conventional substrate supporting apparatus will be described with reference to FIGS. 1 and 2. In FIG. 1, a pneumatic cylinder was used, and in FIG. 2, a servo motor was used. The motor or pneumatic cylinder used at this time is installed to support the substrate.

When the servo motor 202 is used, the pulley 206 installed at the end of the ball screw 203 and the fleece 205 at the end of the motor 202 are connected to the belt 208 so that the motor ( The rotational movement of the 202 is changed to the rotational movement of the ball screw 203, the ball screw nut 204 inserted into the ball screw 203 is moved up and down in accordance with the rotational direction of the ball screw 203. The ball screw nut 204 is fixed to the support plate 209 provided with the board support pin so that the board support pin supports the board according to the movement of the ball screw nut 204. Accordingly, by controlling the rotation amount of the servo motor 202 according to the thickness of the circuit board, the rotation amount of the ball screw 203 is changed to use a method corresponding to a circuit board having an arbitrary thickness within a certain range. Doing.

In the case of using the pneumatic cylinder 103, the substrate support pin moved in the vertical position of the reciprocating motion, that is, a certain distance range, by tightening the nut 102 installed at the end of the pneumatic cylinder 103 or inserting the adjusting block 101. The manual correspondence system which adjusts the position of the both ends of the movable range of 104 is used.

However, in the case of using the thermostat motor 202, for example, related components such as the servo motor 202, the ball screw 203, the pulleys 205 and 206, the support 207, and the like. In order to automatically respond to changes in the thickness of the substrate, a cost is increased because a controller 201 for controlling the speed and torque of the servo motor is required. In addition, in the case of using the pneumatic cylinder 103, when the substrate is changed, it is necessary to adjust the height by tightening the nut 102 or replacing the adjusting block 101, which requires manual work and a problem of lowering precision. There is.

In order to solve this problem, it is an object of the present invention to provide a substrate support apparatus for a surface mounter and a method for adjusting the surface mounter having an adjustment means capable of efficiently adapting to a change in substrate thickness using a low cost pneumatic cylinder.

The substrate supporting apparatus of the surface mounter of the present invention includes a fixing plate serving as a reference of the substrate supporting apparatus, a substrate supporting pin for supporting the substrate, a supporting plate on which the substrate supporting pin is installed, and for limiting a distance between the fixing wave and the supporting plate. A stopper installed between the two plates, a first pneumatic cylinder fixed to the fixed plate to provide a driving force for the up and down reciprocating motion of the support plate, and adjusting means for adjusting the rising height of the substrate support pin; The means is connected to the first pneumatic cylinder and is driven by the housing, the shaft rotatably installed in the housing in the front-rear direction, the adjusting gear fixed to the shaft, the same as the adjusting gear for adjusting the height of the support plate. Cam installed on the shaft and fixed to rotate with the adjustment gear, coupled to the gear And a second pneumatic pressure installed in the housing to be connected to the fixing gear so as to be detachable, the fixing gear installed on one side of the adjusting gear, and a driving force for coupling or separating the fixing gear with the adjusting gear. Cylinder, rack gear means having a rack gear meshed with the other side of the adjustment gear and installed to be able to move up and down, springs installed on the same axis as the rack gear means to support the rack gear means upwards, rack gear means The third pneumatic cylinder, one end of which is fixed, and fixedly connected to the upper end of the third pneumatic cylinder can protrude a predetermined length upward through the opening of the support plate, the height is increased by the adjustment member of the surface mounter head. It is characterized in that it comprises a cylinder rod to be adjusted.

The height adjustment method of the substrate support device of the surface mounter of the present invention is to reverse the second pneumatic cylinder to separate the fixed gear from the adjustment gear to switch the adjustment means and the support device to the initial state, the third pneumatic cylinder Projecting the cylinder rod over the support plate to the initial height by moving the upper surface of the cylinder rod by moving the head of the surface mounter and moving the upper portion of the cylinder rod by inputting a predetermined plate thickness value. Step of pushing downward, and when the cylinder rod moves downward, the cylinder, the rack gear means, the adjusting gear and the cam move temporarily to determine the height of the substrate support plate, and then operate the second pneumatic cylinder to adjust the fixing gear. Engaging the gears to fix the height of the support plate.

Such a configuration and method provide an economical and efficient substrate supporting apparatus and an adjustment method thereof that can automatically cope with the adjustment means when the thickness of the circuit board is changed.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a front view showing the configuration of the substrate support apparatus of the surface mounter of the present invention, Figure 4 is a partial front view showing a part mounting by the head of the surface mounter, B is a surface mounter Partial front view showing the head moved to the top of the cylinder rod for height adjustment. A substrate support pin 5 for supporting the substrate 1 from below is provided on the support plate 4, and the substrate 1 is pressed against the pressure to press the electronic component 3 to which the head 2 of the surface mounter is assembled. ). The roller 11 is provided below the support plate 4. The first pneumatic cylinder 7, which provides the driving force for the up and down reciprocating motion of the support plate 4, is fixedly installed on the fixed plate 6, and the housing 8 is interlocked above the first pneumatic cylinder 7. The housing 8 is provided with a shaft 9 and the shaft 9 is fixed with a cam 10. The cam 10 is spaced apart from the roller 11 at a lower portion of the roller 11 below the support plate 4 by a distance so that when the first pneumatic cylinder 7 is operated upward, the roller 11 ) Is in contact with

On the other hand, the cam 10 and the adjustment gear 15 is fixed to the same axis to rotate together at the time of rotation, one side of the adjustment gear 15 is installed so that the fixing gear 14 is coupled to and separated therefrom have. The adjusting gear 15 is not rotated in engagement with the fixing gear 14 and is rotatable in a non-engagement state. The second pneumatic cylinder 13 for operating the fixing gear 14 is installed on one side of the housing 8, and the fixing gear 14 is fixed to the shaft of the second pneumatic cylinder 13. . The other side of the adjusting gear 15 is provided with a rack gear means 17 having a rack gear engaged with it. The rack gear means 17 has an arm formed at right angles to the rack gear portion, which is movably inserted into the shaft on which the spring 16 with the hole is formed. The end of the arm of the rack gear means 17 is also fixed to the top of the third pneumatic cylinder 18. The shaft of the spring 16 is fixedly installed in the housing 8, and the cylinder rod 18-1, which can protrude from the inside of the third pneumatic cylinder 18, can continue to extend through the hole formed in the support plate 4. The cylinder rod 18-1 protrudes to a predetermined length during the operation of the third pneumatic cylinder 18. This cylinder rod 18-1 is used in setting the height of the support plate 4 together with the adjusting member 2-1 of the head 2 of the surface mounter, and is inserted and positioned again into the cylinder after the height setting. A stopper 12 connected in a piston manner is provided between the support plate 4 and the fixed plate 6 so as not to approach both of them below a predetermined distance.

The operation of the substrate supporting apparatus having the configuration as described above and the operation of the adjusting means which can automatically respond to the change in the substrate thickness will be described in detail below.

In the substrate supporting apparatus, first, the first controllable pneumatic cylinder 7 is operated, and the housing 8 installed so as to cooperate with the upper side of the first pneumatic cylinder 7 is raised, and thus the housing 8 The cam 10 installed on the fixed shaft 9 is raised to come into contact with the roller 11 below the support plate 4 spaced apart from each other. Of course, the housing 8 is raised by the first pneumatic cylinder 7, the cam 10 continues to rise, and the roller 11 and the supporting plate 4 connected thereto are raised. As such, the height of the substrate support pin 5 can basically be adjusted according to the elevation of the housing 8 and the support plate 4.

The height of the substrate supporting pins 5 is determined, the circuit board 1 is supported at the proper position, and the component mounting is completed on the circuit board 1, and the first pneumatic cylinder 7 is retracted so that the housing 8 If this descends, the support plate 4 also descends until it stops by the stopper 12. At this time, when the first pneumatic cylinder 7 is retracted, the cam 10 in the housing 8 and the roller 11 of the support plate 4 are separated from each other. During the basic ascending and descending of the support plate 4 as described above, the second pneumatic cylinder 13 is advanced according to the control so that the fixing gear 14 meshes with the adjusting gear 15 and the adjusting gear 15. The cam 10 does not rotate.

The adjusting means for automatically responding to the thickness change of the circuit board will now be described. When the thickness of the board is changed, the height of the board support plate and the support pin should be adjusted first according to the thickness change of the circuit board before starting the component mounting work. In the present invention, such height adjustment is performed using the component mounting head 2 capable of precise control. The thickness value of the substrate is used as a data value for adjusting the height of the cylinder rod 18-1 by moving the head 2 of the surface mounter and is given as a known value. In FIG. 3, the portion indicated by the dotted line area A corresponds to the adjusting means. With the first pneumatic cylinder 7 retracted and the cam 10 spaced apart from the roller 11, the second pneumatic cylinder 13 retracts so that the fixing gear 14 is moved from the adjusting gear 15. When separated, the support plate 4 is raised to the initial state by the force of the spring 16. This state is a state ready for height adjustment of the support plate 4.

When the third pneumatic cylinder 18 is operated and the cylinder rod 18-1 protrudes to a predetermined length and the upper end reaches a predetermined height, the head 2 of the surface mounter is mounted on the cylinder rod 18-. After moving to the point where the upper end of 1) is located, input the thickness value of the circuit board, and the adjusting member 2-1 pushes the upper end of the cylinder rod 18-1 downward according to the substrate thickness value to increase the height. Will be adjusted. In this manner, when the upper end of the cylinder rod 18-1 is pushed downward, the third pneumatic cylinder 18 is also moved downward. However, since the rack gear means 17 is coupled to the upper portion of the third pneumatic cylinder 18 as described above, when the third pneumatic cylinder 18 moves, the rack gear means 17 also moves downward. The adjusting gear 15 and the cam 10 rotate. Of course, such rotation and height determination of the cam 10 is made corresponding to the thickness of the substrate.

Since the head 2 and the adjustment member 2-1 of the surface mounter are pushed downward by the surface mounter and lowered to match the thickness of the circuit board 1, the lower end of the adjustment member 2-1 is the circuit board. The position is determined according to the thickness of (1).

Therefore, the height of the upper end of the cylinder rod 18-1 and the height of the rack gear means 17 are also correspondingly determined. When the height of the rack gear means 17 is determined, the rack gear rotates the adjusting gear 15 and thus the cam 10 rotates. Similarly, the height of the roller 11 and the support plate 4 by the cam 10 is also determined corresponding to the thickness of the circuit board 1. Then, the second pneumatic cylinder 13 is operated so that the fixing gear 14 meshes with the adjusting gear 15 so that the adjusting gear 15 and the cam 10 do not rotate. Accordingly, the height adjustment of the substrate supporting apparatus according to the thickness change of the substrate is completed, and the component mounting work on the circuit board having the changed thickness can be performed. In the above-described embodiment, the adjustment of the height of the cylinder rod (18-1) by using a separate adjustment member (2-1) to the head (2) by using it, but using the head (2) of the surface mounter directly The height of the cylinder rod 18-1 can also be adjusted. In this case, it is necessary to match the shape of the front-end | tip part of the head 2 or the cylinder rod 18-1 suitably mutually.

As such, the height adjustment of the support plate 4 and the substrate support pin 5 installed thereon as the thickness of the circuit board 1 is changed can be automatically made by the adjusting means. Once, the height of the substrate support pin 5 is determined and determined according to the thickness of the circuit board 1 and is repeatedly supplied of the circuit board 1 of the same thickness, and the adjusting means no longer operate. However, the first pneumatic cylinder (7) is operated, the lifting and lowering operation of the support plate 4 is made according to the repeated operation.

The method of controlling the substrate support apparatus of the surface mounter operated as described above is summarized as follows.

The adjusting method includes the step of reversing the second pneumatic cylinder 13 to separate the fixing gear 14 from the adjusting gear 15 to switch the adjusting means and the substrate supporting apparatus to the initial state, and the third pneumatic cylinder 18. Projecting the cylinder rod 18-1 to the initial height over the support plate, moving the head 2 of the surface mounter to move above the cylinder rod 18-1, thereby providing a predetermined substrate thickness value. Pushing the upper end of the cylinder rod 18-1 downward with the adjustment member 2-1 attached to the head 2 by an input, and when the cylinder rod 19-1 moves downward, After the pneumatic cylinder 18, the rack gear means 17, the adjusting gear 15 and the cam 10 are moved temporarily to determine the height of the substrate support plate 4, the second pneumatic cylinder 13 is operated and fixed. Engaging the gear 14 with the adjusting gear 15 to fix the height of the support plate 4.

Most of these steps can be done automatically, but the operator performs the adjustment by selecting the adjustment work and inputting the substrate thickness value.

As described above, when there is a change in the thickness of the circuit board, an economical substrate supporting apparatus and an adjustment method thereof that can automatically adjust the support position of the substrate through input of the substrate thickness value may be provided. In addition, since the substrate assembly work is efficiently performed and the cost burden is reduced, the production cost of the substrate itself can be reduced.

Claims (4)

A support plate provided with a base plate of the substrate support device, a substrate support pin for supporting the substrate, and a substrate support pin. A stopper installed between the two plates to limit the distance between the fixed plate and the support plate, a first pneumatic cylinder fixed to the fixed plate to provide a driving force for vertically reciprocating movement of the support plate, and a substrate support pin A substrate support apparatus for a surface mounter, comprising adjustment means for adjusting the elevation height. According to claim 1, wherein the adjusting means is connected to the first pneumatic cylinder is driven by the housing, the shaft installed in the front and rear direction rotatably in the housing, the adjustment gear fixed to the shaft, the height of the support plate A cam installed on the same shaft as the adjustment gear for adjustment so as to rotate together with the adjustment gear, a fixed gear installed on one side of the adjustment gear so as to be coupled to and detached from the gear, the fixed gear A second pneumatic cylinder installed in the housing and connected to the fixed gear so as to provide a driving force for coupling or disconnecting the adjusting gear to the fixed gear, and having a rack gear engaged to the other side of the adjusting gear and allowing vertical movement. Rack gear means to be installed, the number of rack gear to support the rack gear means upward And a spring installed on the same shaft, a third pneumatic cylinder having one end of the rack gear means fixed thereto, and fixedly connected to an upper end of the third pneumatic cylinder so that a predetermined length may protrude upward through the opening of the support plate. And a cylinder rod whose height is adjusted by an adjustment member of the surface mounter head. 3. The substrate mounting apparatus of claim 2, wherein the cylinder rod is directly controlled by the head of the surface mounter. Retracting the second pneumatic cylinder to separate the fixing gear from the adjusting gear to return the adjusting means and the substrate supporting device to an initial state, and operating the third pneumatic cylinder to project the cylinder rod over the support plate to an initial height. Moving the head of the surface mounter to move upward of the cylinder rod, pushing the upper end of the cylinder rod downward with the adjustment member attached to the head by inputting a predetermined substrate thickness value, and the cylinder rod moving downward; When the third pneumatic cylinder, the rack gear means, the adjustment gear and the cam moves temporarily to determine the height of the substrate support plate, the second pneumatic cylinder is operated to engage the fixing gear with the adjustment gear to fix the height of the support plate. Method of adjusting the substrate support device of the surface mounter comprising the step.