KR0158502B1 - Method of fabricating semiconductor device - Google Patents
Method of fabricating semiconductor device Download PDFInfo
- Publication number
- KR0158502B1 KR0158502B1 KR1019950055030A KR19950055030A KR0158502B1 KR 0158502 B1 KR0158502 B1 KR 0158502B1 KR 1019950055030 A KR1019950055030 A KR 1019950055030A KR 19950055030 A KR19950055030 A KR 19950055030A KR 0158502 B1 KR0158502 B1 KR 0158502B1
- Authority
- KR
- South Korea
- Prior art keywords
- engine
- transmission
- under cover
- vehicle
- piston
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823475—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type interconnection or wiring or contact manufacturing related aspects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/48—Data lines or contacts therefor
- H10B12/482—Bit lines
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Body Structure For Vehicles (AREA)
- General Details Of Gearings (AREA)
Abstract
본 발명은 엔진 가열시 냉각수의 압력을 이용하여 엔진(10)과 트랜스미션(20)에 통풍이 될 수 있게 언더 커버(30)를 자동 개폐시켜 엔진(10)과 트랜스 미션(20)에서 발생하는 소음을 차단하고, 엔진(10)과 트랜스 미션(20)의 가열을 방지하여 열해 문제를 개선할 수 있도록 한 자동차의 언더 커버 자동 개폐장치에 관한 것이다.The present invention is the noise generated in the engine 10 and the transmission 20 by automatically opening and closing the under cover 30 to be ventilated in the engine 10 and the transmission 20 by using the pressure of the coolant when the engine is heated. It is related with the automatic undercover automatic opening and closing device of the vehicle to block the heat and prevent the heating of the engine 10 and the transmission 20 to improve the problem.
Description
제1도는 언더 커버의 설치상태도.1 is an installation state of the under cover.
제2도는 본 발명의 전체 구성도2 is an overall configuration diagram of the present invention
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10 : 엔진 20 : 트랜스 미션10: engine 20: transmission
30 : 언더 커버 40 : 차체30: under cover 40: body
50 : 리턴 스프링 60 : 유압 피스톤50: return spring 60: hydraulic piston
70 : 라디에이터 80,81 : 연결호스70: radiator 80,81: connection hose
90 : 피스톤90: piston
본 발명은 자동차의 엔진과 트랜스미션의 노이즈 방지를 위해 장착한 언더 커버의 장착에 따라서 발생하는 엔진과 트랜스미션의 가열을 방지하기 위한 것으로, 더 상세하게는 자동차의 엔진과 트랜스미션에서 발생하는 열이 언더 커버에 의해서 발산하지 못해 생기는 열해 문제를 개선할 수 있도록 한 자동차의 언더 커버 자동 개폐장치에 관한 것이다.The present invention is to prevent the heating of the engine and the transmission caused by the installation of the undercover mounted to prevent noise of the engine and the transmission of the vehicle, more specifically, the heat under the cover of the engine and the transmission of the vehicle It relates to a vehicle undercover automatic opening and closing device that can solve the heat problem caused by the failure to radiate.
일반적으로 엔진 노이즈는 엔진에서 발생하는 소음의 총칭으로 흡기계통에서 발생하는 흡기 소음, 배기 파이프에서 나는 배기 소음, 엔진의 기계적인 작동에서 발생하는 기계 소음 등이 있고, 또한 트랜스 미션 노이즈는 트랜스 미션 내의 기어에서 발생하는 소리로서 기어가 맞물렸을 때 발생하는 소음이다.In general, engine noise is a general term for noise generated by an engine, and includes intake noise generated in an intake pipe, exhaust noise generated in an exhaust pipe, and mechanical noise generated by mechanical operation of an engine. This is the sound produced by gears. It is the noise produced when gears are engaged.
현재 상기 소음의 규제 법규에 관련하여 승합차와 트럭차량에 소음을 줄이기 위해 엔진과 트랜스 미션 하부에 흡음재가 부착된 언더커버를 장착하도록 되어 있다.At present, in order to reduce noise in vans and trucks in accordance with the regulation of the noise, the undercover with sound absorbing material is mounted on the engine and the transmission bottom.
그러나, 상기 언더 커버의 장착으로 소음은 현저하게 줄어 들었지만 엔진과 트랜스 미션에서 발생하는 열을 발산시키지 못해 엔진 냉각 성능과 각 부품의 열해 문제가 대두되고 있다.However, although the noise is significantly reduced by the installation of the undercover, the engine cooling performance and thermal deterioration of each component have been raised due to failure to dissipate heat generated from the engine and the transmission.
이러한 종래 자동차에 사용되는 언더 커버는 승합차와 트럭에 장착된 엔진과 트랜스미션에서 발생하는 소음을 줄이기 위해 흡음재가 장착된 언더 커버가 엔진과 트랜스 미션에 설치되어 있었다.Undercover used in such a conventional vehicle has an undercover equipped with a sound absorbing material is installed in the engine and the transmission in order to reduce the noise generated from the engine and the transmission mounted on the vans and trucks.
이와 같이 구성된 언더 커버는 주행중 엔진과 트랜스 미션의 작동에 의해 발생되는 노이즈를 현저하게 줄이지만 엔진과 트랜스 미션에서 발생하는 열을 발산하지 못해 엔진 가열과 부품의 파손 등으로 사고의 원인을 일으키는 문제점이 있다.The under cover configured as described above significantly reduces noise generated by the operation of the engine and the transmission while driving, but fails to dissipate heat generated by the engine and the transmission, causing an accident due to engine heating and damage to parts. have.
본 발명의 목적은 상기에서와 같은 종래의 결점을 해소하기 위해 안출한 것으로 엔진 가열시 냉각수의 압력을 이용하여 엔진과 트랜스 미션에 통풍이 될 수 있게 언더 커버를 자동 개폐시키는 언더 커버로 엔진과 트랜스 미션에서 발생하는 소음을 차단하고, 가열된 엔진과 트랜스 미션을 냉각시켜 엔진과 트랜스 미션의 가열에 의해 발생되는 열해 문제를 개선하는 장치를 제공하는 데 있다.An object of the present invention is to solve the above-mentioned drawbacks as described above, by using the pressure of the coolant when heating the engine under the cover to automatically open and close the under cover to be ventilated in the engine and the transmission engine and trans It is to provide a device that blocks the noise generated by the mission, and cools the heated engine and the transmission to solve the thermal problem caused by the engine and the transmission heating.
이하 첨부된 도면에 따라서 본 발명의 기술적 구성을 상세히 설명하면 다음과 같다.Hereinafter, the technical configuration of the present invention according to the accompanying drawings in detail.
본 발명은 제1도와 제2도에 도시된 바와 같이, 자동차의 엔진(10)과 트랜스 미션(20)의 노이즈 방지를 위해 장착된 언더 커버(30)에 있어서, 차체(40)와 언더 커버(30)에 연결되어 평상시 언더 커버(30)가 닫히도록 압축되어 있고, 하강된 언더 커버(30)를 복원 시키는 리턴 스프링(50)과, 차체(40)에 고정되어 엔진(10) 가열시 언더 커버(30)를 하강시켜 통풍이 될 수 있도록 열리게 하는 유압피스톤(60)과, 상기 유압피스톤(60)과 라디에이터(70) 사이에 연결호스(80)(81)로 연결되어 유압피스톤(60)을 작동시키는 피스톤(90)으로 구성된 것을 특징으로 한다.As shown in FIG. 1 and FIG. 2, the vehicle body 40 and the under cover 30 are provided in the under cover 30 mounted to prevent noise of the engine 10 and the transmission 20 of the vehicle. It is connected to 30 and is normally compressed to close the under cover 30, the return spring 50 for restoring the lower under cover 30, and fixed to the vehicle body 40, the under cover when heating the engine 10 Hydraulic piston (60) for lowering the 30 to be opened to be ventilated, and is connected between the hydraulic piston (60) and the radiator (70) by connecting hoses (80) (81) to the hydraulic piston (60) It is characterized by consisting of a piston 90 to operate.
이와 같이 구성된 본 발명은 평상시에는 엔진(10)과 트랜스 미션(20)의 노이즈를 방지하도록 언더 커버(30)가 닫혀 있고, 라디에이터(70)의 냉각수가 엔진(10)에 의해 가열되어 냉각수의 압력이 높아지면 피스톤(90)을 밀게 되고, 상기 피스톤(90)의 작용에 의해 유압 피스톤(60)이 작동하면 차체(40)와 언더커버(30)에 고정된 리턴스프링(50)의 압축력보다 유압피스톤(60)의 작용력이 커져 언더 커버(30)를 하강시킴과 동시에 통풍이 되어 열을 외부로 발산시키므로 엔진(10)과 트랜스 미션(20)을 냉각시키고, 또한 라디에이터(30)의 냉각수의 압력이 낮아지면 피스톤(90)이 원위치로 복귀되어 유압 피스톤(60)의 작용력이 리턴 스프링(50)의 복원력보다 약해져 언더 커버(30)를 닫히게 되어 엔진(10)과 트랜스 미션(20)에서 발생하는 노이즈를 방지하게 된다.In the present invention configured as described above, the under cover 30 is normally closed so as to prevent noise of the engine 10 and the transmission 20, and the coolant of the radiator 70 is heated by the engine 10 so that the pressure of the coolant is reduced. When the piston 90 is high, the piston 90 is pushed. When the hydraulic piston 60 is operated by the action of the piston 90, the hydraulic pressure is greater than the compression force of the return spring 50 fixed to the vehicle body 40 and the undercover 30. As the action force of the piston 60 increases, the under cover 30 is lowered and at the same time ventilated to dissipate heat to the outside, thereby cooling the engine 10 and the transmission 20 and further, the pressure of the coolant of the radiator 30. When the piston 90 is lowered, the piston 90 is returned to its original position, and the action force of the hydraulic piston 60 is weaker than the restoring force of the return spring 50, thereby closing the under cover 30, which is generated from the engine 10 and the transmission 20. This will prevent noise.
따라서, 평상시에는 언더 커버(30)가 닫혀 자동차의 엔진(10)과 트랜스 미션(20)의 노이즈 방지하고, 엔진 가열시에는 언더 커버(30)가 열려 통풍이 되므로 엔진(10)의 가열을 방지한다.Therefore, the under cover 30 is normally closed to prevent noise of the engine 10 and the transmission 20 of the vehicle, and when the engine is heated, the under cover 30 is opened and ventilated to prevent heating of the engine 10. do.
이상에서 설명한 바와 같이 본 발명은 엔진 가열시 냉각수의 압력을 이용하여 엔진과 트랜스 미션에 통풍이 될 수 있게 언더 커버를 자동 개폐시켜 엔진과 트랜스 미션에서 발생하는 소음을 차단하고, 엔진과 트랜스 미션의 가열을 방지하여 열해 문제가 개선된다.As described above, the present invention automatically blocks the noise generated by the engine and the transmission by automatically opening and closing the under cover so that the engine and the transmission can be ventilated by using the pressure of the coolant when the engine is heated. Prevents heating and improves heat.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950055030A KR0158502B1 (en) | 1995-12-22 | 1995-12-22 | Method of fabricating semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950055030A KR0158502B1 (en) | 1995-12-22 | 1995-12-22 | Method of fabricating semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970053036A KR970053036A (en) | 1997-07-29 |
| KR0158502B1 true KR0158502B1 (en) | 1999-02-01 |
Family
ID=19443511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950055030A KR0158502B1 (en) | 1995-12-22 | 1995-12-22 | Method of fabricating semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0158502B1 (en) |
-
1995
- 1995-12-22 KR KR1019950055030A patent/KR0158502B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR970053036A (en) | 1997-07-29 |
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