KR0136733B1 - Wire clamper - Google Patents

Wire clamper

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Publication number
KR0136733B1
KR0136733B1 KR1019940004091A KR19940004091A KR0136733B1 KR 0136733 B1 KR0136733 B1 KR 0136733B1 KR 1019940004091 A KR1019940004091 A KR 1019940004091A KR 19940004091 A KR19940004091 A KR 19940004091A KR 0136733 B1 KR0136733 B1 KR 0136733B1
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KR
South Korea
Prior art keywords
clamper
wire
piezoelectric element
clamp load
clamp
Prior art date
Application number
KR1019940004091A
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Korean (ko)
Other versions
KR940022764A (en
Inventor
고오이치 하라다
구니유키 다카하시
Original Assignee
아라이 가즈오
가부시키가이샤 신가와
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Publication of KR940022764A publication Critical patent/KR940022764A/en
Application granted granted Critical
Publication of KR0136733B1 publication Critical patent/KR0136733B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
    • H02N2/04—Constructional details
    • H02N2/043—Mechanical transmission means, e.g. for stroke amplification

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

온도변화에 의한 클램프 하중의 변동을 방지한다.Prevents clamp load fluctuations due to temperature changes.

아암부(22A, 22B)를 압전소자(5)의 전기왜곡 또는 자기왜곡 효과에 의해서 개폐시키도록 구성하여 온도변동에 의한 클램퍼편(4A, 4B)이 클램프 하중의 변화를 보정하는 온도보상부재(11)를 설치하였다.The temperature compensating member for which the arm portions 22A and 22B are opened and closed by the electric or magnetic distortion effect of the piezoelectric element 5 so that the clamper pieces 4A and 4B due to temperature fluctuations correct the change in the clamp load ( 11) was installed.

Description

와이어 클램퍼Wire clamper

제1도는 본 발명을 적용하는 와이어 클램퍼의 일예를 도시한 평면도.1 is a plan view showing an example of a wire clamper to which the present invention is applied.

제2도는 클램퍼편 부분의 확대단면도.2 is an enlarged cross-sectional view of the clamper piece.

제3도는 압전소자에 가하는 전압과 클램프 하중과의 관계도.3 is a relationship between the voltage applied to the piezoelectric element and the clamp load.

제4도는 본 발명을 적용하는 와이어 클램퍼의 다른예를 도시한 평면도.4 is a plan view showing another example of a wire clamper to which the present invention is applied.

제5도는 본 발명으로 이루어진 와이어 클램퍼의 일실시예를 도시한 평면도이다.5 is a plan view showing one embodiment of a wire clamper made of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

2 : 클램퍼 본체 4A, 4B : 클램퍼편2: Clamper main body 4A, 4B: Clamper piece

5 : 압전소자 11 : 온도보상부재5: piezoelectric element 11: temperature compensation member

22A, 22B : 아암부22A, 22B: Arm part

산업상의 이용분야Industrial use

본 발명은 와이어 본딩 장치에 있어서 와이어 클램퍼에 관한 것이다.The present invention relates to a wire clamper in a wire bonding apparatus.

종래의 기술Conventional technology

종래의 와이어 클램퍼로서는 예컨대 일본국 특공소 6l-2294호 공보에 개시된 것이 알려져 있다. 이 구조는 가동아암을 고정아암측에 스프링으로 가세하여, 가동아암을 솔레노이드로 개폐시키고 있다. 즉 솔레노이드에 통전을 함으로써 그 솔레노이드의 돌출봉으로 상기 스프링의 가세력에 저항하면서 가동아암을 밀어서 그 가동아암을 연다. 또 솔레노이드의 통전을 오프로 하면 가동아암은 스프링의 가세력을 오프하여 와이어를 클램프한다.As a conventional wire clamper, what is disclosed by Unexamined-Japanese-Patent No. 6l-2294 is known, for example. This structure adds the movable arm to the fixed arm side with a spring, and opens and closes the movable arm with a solenoid. That is, by energizing the solenoid, the movable arm is opened by pushing the movable arm while resisting the force of the spring with the protruding rod of the solenoid. When the solenoid is turned off, the movable arm turns off the spring force and clamps the wire.

발명이 해결하려고 하는 과제Challenges the invention seeks to solve

상기 종래기술은 아암부의 개폐를 솔레노이드로 행하므로 중량이 무겁고 또 응답성이 늦다는 문제점이 있었다. 또 와이어를 누르는 하중(클램프 하중)은 약 40 내지 50gr의 스프링의 가세력에 의함으로 본딩헤드를 고속이동시키면 가동아암이 휘청거리고 클램프 하중이 안정되지 않는다는 문제점이 있었다. 또 클램프 하중은 스프링의 가세력에 의함으로 클램프 하중의 변경은 스프링을 교환하여야 하고 또 소망으로 하는 클램프 하중을 용이하게 얻는 것은 곤란하며 그의 조정에 과대한 시간을 요하고 있다. 본원 출원인은 상기 종래기술의 문제점을 해결할 것을 특원평 4-87454호로써 출원하였다. 이 구성은 개폐하여 와이어를 클램프하는 한쌍의 클램퍼편이 각각 고정된 한쌍의 아암부를 가지는 와이어 본딩 장치의 와이어 클램퍼에 있어서 적어도 한쪽의 아암부의 개폐를 압전소자의 전기왜곡 또는 자기왜곡 효과에 의해 개패시키도록 구성하고 있다. 즉 압전소자에서 아암부의 개폐를 행함으로 경량화가 도모되어 또 응답성이 현저하게 향상한다. 또 압전소자의 구동력으로 아암부를 개폐시켜서 클램프 하중을 얻음으로 본딩헤드가 고속이동할 때에도 클램프부가 휘청거리는 일없이 클램프 하중이 안정된다. 또한 압전소자에 가하는 전압치에 의하여 클램프 하중이 얻어짐으로 소망으로 하는 클램프 하중치를 임의로 용이하게 설정할 수 있다.The prior art has a problem that the weight is heavy and the responsiveness is performed because the arm portion is opened and closed by a solenoid. In addition, the wire pressing load (clamp load) is caused by the force of the spring of about 40 to 50gr, and there is a problem that the movable arm is wobbly and the clamp load is not stabilized when the bonding head is moved at high speed. In addition, the clamp load is caused by the force of the spring, so that the change of the clamp load requires replacing the spring, and it is difficult to easily obtain the desired clamp load, which requires excessive time for its adjustment. The present applicant has filed as Patent Application No. 4-87454 to solve the problems of the prior art. This configuration is such that the opening and closing of at least one arm portion in the wire clamper of the wire bonding apparatus having a pair of arm portions each of which has a pair of clamper pieces for opening and closing the clamp to wires to be opened by the electric distortion or magnetostriction effect of the piezoelectric element. It consists. That is, by opening and closing the arm portion in the piezoelectric element, the weight can be reduced and the response is remarkably improved. In addition, the clamp load is stabilized without swinging the clamp portion even when the bonding head is moved at high speed by opening and closing the arm portion by the driving force of the piezoelectric element. In addition, since the clamp load is obtained by the voltage value applied to the piezoelectric element, the desired clamp load value can be easily set arbitrarily.

그런데 상기 출원중의 와이어 클램퍼에 대하여 본원 발명자는 여러가지의 시험제작 실험을 거듭한 결과 다음과 같은 문제점이 있는 것이 판명되었다. 와이어 클램퍼의 아래쪽에는 캐피러리가 있으며 캐피러리의 아래쪽에는 시험재료를 가열하면 히트블록이 존재함으로 히트블록의 열에서 와이어 클램퍼의 온도가 약 20℃ 상승한다. 와이어 클램퍼의 온도가 상승하면 클램퍼편이 닫히는 방향으로 이동하여 클램프 하중이 크게 된다. 그래서 와이어의 클램프를 여는데는 인가전압을 크게 할 필요가 있다. 이 때문에 압전소자의 허용인가전압 한계점의 곳에서 사용하게 되어 압전소자가 분극하여 버리는 위험성이 있다.By the way, the inventors of the present application repeated the various test production experiments with respect to the wire clamper of the present application, it was found that the following problems. The lower part of the wire clamper has a capillary. The lower part of the wire clamper has a heat block when the test material is heated, so that the temperature of the wire clamper rises by about 20 ° C from the heat block heat. When the temperature of the wire clamper rises, the clamper piece moves in the direction of closing and the clamp load becomes large. Therefore, it is necessary to increase the applied voltage to open the clamp of the wire. For this reason, there is a danger that the piezoelectric element may be polarized because it is used at the allowable voltage limit of the piezoelectric element.

본 발명의 목적은 온도변화에 의한 클램프 하중의 변동을 방지할 수가 있는 와이어 클램퍼를 제공할 수 있다.An object of the present invention can provide a wire clamper that can prevent the fluctuation of the clamp load due to the temperature change.

과제를 해결하기 위한 수단Means to solve the problem

상기 목적을 달성하기 위한 본 발명의 구성은 개폐하여 와이어를 클램프하는 한쌍의 클램퍼편이 각각 고정된 한쌍의 아암부를 가지는 와이어 본딩 장치의 와이어 클램퍼에 있어서 적어도 한쪽의 아암부의 개폐를 압전소자의 전기왜곡 또는 자기왜곡 효과에 의해서 개폐시키도록 구성하여 온도변동에 의한 클램퍼편의 클램프 하중의 변화를 보정하는 온도보상부재를 설치한 것을 특징으로 한다.The configuration of the present invention for achieving the above object in the wire clamper of the wire bonding device having a pair of arm portions, each of which is fixed to a pair of clamper pieces for opening and closing the wires, the opening and closing of at least one arm portion of the piezoelectric element or It is configured to open and close by the magnetic distortion effect, characterized in that the temperature compensation member for correcting the change in the clamp load of the clamper piece due to the temperature fluctuation is provided.

작 용Action

온도변동에 의한 클램퍼편의 클램프 하중의 변화를 보정하는 온도보상부재를 압전소자에 부착하면 와이어 클램퍼는 온도변화에 의한 영향을 받지 않는다.If a temperature compensation member is attached to the piezoelectric element that corrects the change in the clamp load of the clamper piece due to temperature fluctuation, the wire clamper is not affected by the temperature change.

실시예Example

이하 본 발명의 일실시예를 제1도 내지 제3도에 의해 설명한다. 제1도에 도시한 바와같이 장치에 고정된 클램퍼 지지체(1)에는 클램퍼 본체(2)가 고정되어 있다. 클램퍼 본체(2)는 클램퍼 지지체(1)에 나사(3)로 고정되는 고정부(21)와 한쌍의 클램퍼편(4A, 4B)이 각각 고정된 한쌍의 아암부(22A, 22B)를 가지고 고정부(21)와 아암부(22A, 22B)의 결합부에는 탄성변형 가능한 잘룩부(23A, 23B)가 형성되어 있다. 또 아암부(22A, 22B)의 상기 잘룩부(23A, 23B)의 내측부에도 탄성 변형 가능한 잘룩부(24A, 24B)가 형성되어 잘룩부(24A, 24B)는 연결되어서 작용부(25)로 되어 있다. 여기서 잘룩부(23A, 23B 및 24A, 24B)는 클램퍼편(4A, 4B)이 닫히는 방향으로 스프링성을 가지도록 형성되어 있다.Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 to 3. As shown in FIG. 1, the clamper main body 2 is fixed to the clamper support 1 fixed to the apparatus. The clamper main body 2 has a fixing portion 21 fixed to the clamper support 1 with a screw 3 and a pair of arm portions 22A and 22B to which the pair of clamper pieces 4A and 4B are respectively fixed. An elastically deformable cutout portion 23A, 23B is formed at the engaging portion of the government portion 21 and the arm portions 22A, 22B. In addition, the inner parts of the cutting parts 23A and 23B of the arm parts 22A and 22B are formed with elastically deformable cutting parts 24A and 24B so that the cutting parts 24A and 24B are connected to form the working part 25. have. The cutouts 23A, 23B and 24A, 24B are formed so as to have spring properties in the direction in which the clamper pieces 4A, 4B are closed.

작용부(25)에 대응한 고정부(21)에는 변형 가능한 다이어프램부(26)를 가지도록 슬릿홈(27)이 형성되어 있다. 그리고 작용부(25)와 다이어프램부(26) 사이에는 적층압전 액튜에이터(이하 압전소자라함)(5)의 양단부가 고정되어 있다. 압전소자(5)는 압전소자 제어전원(6)에 의하여 구동된다. 여기서 압전소자(5)는 그의 왜곡방향이 클램퍼편(4A, 4B)의 클램프 면방향으로 되도록 배설되어 있다. 또 고정부(21)에는 다이어프램부(26)를 가압하는 클램프 하중 조정나사(7)가 나사맞춤되어 있다. 제2도에 도시한 바와같이 상기 클램퍼편(4A)는 접착제(8)를 통하여 아암부(22A)에 고정되어 또 클램퍼편(4A)에 대응한 아암부(22A)의 부분에는 선단이 원추 또는 둥글게 형성된 클램퍼편 조정나사(9)가 나사맞춤되어 있다. 상기 클램퍼편(4B)은 아암부(22B)에 압입고정되어 있다.The slit groove 27 is formed in the fixing part 21 corresponding to the acting part 25 so as to have the deformable diaphragm part 26. Both ends of the stacked piezoelectric actuators (hereinafter referred to as piezoelectric elements) 5 are fixed between the acting portion 25 and the diaphragm portion 26. The piezoelectric element 5 is driven by the piezoelectric element control power supply 6. Here, the piezoelectric element 5 is arrange | positioned so that the distortion direction may become the clamp surface direction of clamper pieces 4A and 4B. Moreover, the clamp load adjustment screw 7 which presses the diaphragm part 26 is screwed in the fixing part 21. As shown in FIG. As shown in FIG. 2, the clamper piece 4A is fixed to the arm part 22A through the adhesive agent 8, and the tip of the clamper piece 4A corresponds to the arm part 22A corresponding to the clamper piece 4A. The rounded clamper piece adjusting screw 9 is screwed in. The clamper piece 4B is press-fitted to the arm portion 22B.

우선 제1도와 같이 조립된 와이어 클램퍼의 작용에 대하여 설명한다. 압전소자(5)에 전압을 가하지 않는 때는 클램퍼편(4A, 4B)은 어느 일정의 클램프 하중으로 도시하지 않는 와이어를 클램프한다. 그리고 압전소자(5)에 전압을 가하면 전기왜곡 또는 자기왜곡 효과에 의해 압전소자(5)는 클램퍼편(4A, 4B) 방향으로 신장하고 작용부(25)가 같은 방향(좌방향)으로 이동된다. 이것에 의해서 잘룩부(23A, 23B 및 24A, 24B)는 외측방향으로 휘어지고 클램퍼편(4A, 4B)은 열린상태로 된다. 이 클램퍼편(4A, 4B)의 이동량은 작용부(25)에서 잘룩부(23A, 23B)이 길이와 잘룩부(23A, 23B)에서 클램퍼편(4A, 4B)의 와이어를 클램프하는 면까지의 길이의 비로 압전소자(5)의 신장량이 확대된다.First, the operation of the wire clamper assembled as shown in FIG. 1 will be described. When no voltage is applied to the piezoelectric element 5, the clamper pieces 4A and 4B clamp a wire not shown with a certain clamp load. When a voltage is applied to the piezoelectric element 5, the piezoelectric element 5 extends in the direction of the clamper pieces 4A and 4B due to the electric distortion or magnetostriction effect, and the acting portion 25 is moved in the same direction (left direction). . As a result, the cutouts 23A, 23B and 24A and 24B are bent in the outward direction, and the clamper pieces 4A and 4B are in an open state. The amount of movement of the clamper pieces 4A and 4B is from the acting portion 25 to the surface where the cutout portions 23A and 23B clamp the wires of the clamper pieces 4A and 4B from the length and the cutout portions 23A and 23B. The amount of extension of the piezoelectric element 5 is enlarged by the ratio of the lengths.

상기한 현상을 다시 상세하게 기술하면 제3도에 도시한 바와같이 압전소자(5)에 가하는 전압이 0(제로)으로 클램프 하중이 W2의 상태에서 압전소자(5)에 전압을 가하면 클램프 하중은 그의 전압에 비례하여 작게 된다.Referring to the above phenomenon in detail, when the voltage applied to the piezoelectric element 5 is zero (zero) as shown in FIG. 3 and the clamp load is W2, the clamp load is It becomes small in proportion to its voltage.

그리고 전압이 E2로 되면 클램퍼편(4A, 4B)은 와이어에 접한 상태로 되어 클램프 하중은 0으로 된다. 더우기 전압을 올리면 클램퍼편(4A, 4B)은 와이어에서 떨어져서 열린 상태로 된다. 따라서 실제의 와이어 본딩에 있어서 와이어를 클램프시키는 경우에 있어서 소망으로 하는 클램프 하중(W1)은 전압(El)에 의하여 얻어진다. 그래서 미리 전압과 클램프 하중의 관계를 측정하여 두고 클램퍼편(4A, 4B)이 와이어(8)에 접한 바 즉 클램프 하중이 0으로 되는 전압치보다 전압을 일정량 내림으로서 소망하는 클램프 하중을 설정할 수 있다.When the voltage reaches E2, the clamper pieces 4A and 4B are in contact with the wire, and the clamp load is zero. Furthermore, when the voltage is increased, the clamper pieces 4A and 4B are separated from the wire and are opened. Therefore, when clamping a wire in actual wire bonding, a desired clamp load W1 is obtained by the voltage El. Therefore, the relationship between the voltage and the clamp load is measured in advance, and the desired clamp load can be set by lowering a certain amount of voltage from the clamper pieces 4A and 4B in contact with the wire 8, that is, the voltage value at which the clamp load becomes zero. .

그래서 실제의 사용상태에 있어서는 와이어 클램프시에 있어서 전압을 E1로 하여 와이어 열린 상태에 있어서 전압을 E3로서 하여 사용한다. 구체적인 일예를 도시하면 전압이 0일때 클램프하중(W2)이 약 80 내지 100gr로 되도록 또 전압(E3)이 100V 때에 클램퍼편(4A, 4B)의 와이어(8)로부터 약 50 내지 70㎛ 떨어지도록 와이어 클램퍼를 제작하여 전압(El)이 약 50 내지 60V 때 클램프 하중(W1)이 약40 내지 50gr 되도록 설정한다.Therefore, in the actual use state, the voltage is set to E1 at the time of the wire clamp and the voltage is used as E3 in the wire open state. One specific example shows that the clamp load W2 is about 80 to 100 gr when the voltage is 0 and is about 50 to 70 탆 away from the wire 8 of the clamper pieces 4A and 4B when the voltage E3 is 100V. The clamper is fabricated and set so that the clamp load W1 is about 40 to 50 gr when the voltage El is about 50 to 60V.

이와같이 압전소자(5)에서 아암부(22A, 22B)의 개폐를 행함으로 다음과 같은 효과가 얻어진다. 종래에 있어서 솔레노이드의 자중은 약 20 내지 30gr이나 본 실시예에 있어서 압전소자(5)의 자중은 약 0.5 내지 5gr이며 경량화가 도모된다. 또 솔레노이드는 응답시간이 1.5 내지 2.0ms이나 압전소자(5)는 0.05 내지 0.3ms이며 응답시간이 현저하게 향상한다. 또한 종래는 스프링의 가세력으로 클램프 하중을 얻고 있었음으로 본딩헤드가 고속이동할 때에 클램퍼편이 휘청거렸으나 본 실시예에 있어서 압전소자(5)는 구동력이 크기 때문에 아압부(22A, 22B)의 잘룩부(23A, 23B, 24A, 24B)의 강성을 높게 할 수 있으며 본딩헤드가 고속이동할 때에도 클램퍼편(4A, 4B)이 휘청거림없이 클램프 하중이 안정된다. 또 본 실시예에 있어서는 압전소자(5)에 가하는 전압치에 의하여 클램프 하중을 얻으므로 소망하는 클램프 하중치를 임의로 용이하게 설정할 수 있다.Thus, the following effects are obtained by opening and closing the arm portions 22A and 22B in the piezoelectric element 5. Conventionally, the weight of the solenoid is about 20 to 30 gr, but in the present embodiment, the weight of the piezoelectric element 5 is about 0.5 to 5 gr and the weight is reduced. The solenoid has a response time of 1.5 to 2.0 ms, but the piezoelectric element 5 has a response time of 0.05 to 0.3 ms, and the response time is remarkably improved. In addition, the clamper piece was agitated when the bonding head moved at a high speed because the clamp load was obtained by the spring force. However, in the present embodiment, the piezoelectric element 5 has a large driving force. The rigidity of (23A, 23B, 24A, 24B) can be increased, and the clamp load is stabilized without shaking the clamper pieces 4A, 4B even when the bonding head moves at high speed. In addition, in this embodiment, since the clamp load is obtained by the voltage value applied to the piezoelectric element 5, the desired clamp load value can be easily set arbitrarily.

다음에 클램프 하중을 정확히 용이하게 측정 및 설정하는 방법의 일 실시예에 대하여 설명한다. 아암부(22B)의 클램퍼편(4B) 근방에 탄성변형 가능한 잘룩부(28)을 형성하여 이 잘룩부(28)에 왜곡게이지(10)를 고정한다. 이와같이 구성을 하면 클램프 하중에 의하여 잘룩부(28)의 휘어짐량이 변화함으로 왜곡게이지(10)의 출력치에 의해 클램프 하중과의 관계를 알 수 있다. 그래서 미리 왜곡게이지(10)의 출력치와 클램프 하중과의 관계를 구하여 둠으로써 왜곡게이지(10)의 출력치에 의하여 압전소자(5)에 가하는 전압을 조정할 수가 있고 클램프 하중을 제어할 수 있다.Next, an embodiment of a method for easily and accurately measuring and setting a clamp load will be described. An elastically deformable cutout portion 28 is formed in the vicinity of the clamper piece 4B of the arm portion 22B, and the distortion gauge 10 is fixed to the cutout portion 28. In this configuration, the deflection amount of the cutout portion 28 changes depending on the clamp load, so that the relationship with the clamp load can be known by the output value of the distortion gauge 10. Therefore, by obtaining a relationship between the output value of the distortion gauge 10 and the clamp load, the voltage applied to the piezoelectric element 5 can be adjusted by the output value of the distortion gauge 10, and the clamp load can be controlled.

제4도는 본 발명의 다른 실시예를 도시하고 있다. 상기 실시예는 양쪽의 아암부(22A, 22B)의 개폐시켰으나 본 실시예는 한쪽의 아암부(22B)만을 개폐시키도록 구성하여 이루어진다. 즉 상기 실시예에 있어서 잘룩부(23A)를 없이 하여 이 부분을 강체로 하여 또 아암부(22A)와 작용부(25)를 절리하여 이루어진다. 따라서 본 실시예에 있어서 아암부(22B)만이 개폐하는 것이 된다. 이와같이 구성하여도 상기 실시예와 마찬가지의 효과를 얻는다. 그러나 본 실시예는 한쪽의 아암부(22B)만이 개폐됨으로 압전소자(5)의 용량에 의하여는 소망으로 하는 열림량을 얻지 못하는 일이 있으며 상기 실시예와 같이 양쪽의 아암부(22A, 22B)를 개폐시킨 쪽이 큰 열림량을 얻어 바람직하다.4 illustrates another embodiment of the present invention. While the above embodiment opens and closes both arm portions 22A and 22B, the present embodiment is configured to open and close only one arm portion 22B. That is, in the above-mentioned embodiment, this part is made into a rigid body without the swelling part 23A, and the arm part 22A and the working part 25 are cut off. Therefore, only the arm part 22B opens and closes in a present Example. Even if it constitutes in this way, the effect similar to the said Example is acquired. However, in this embodiment, since only one arm portion 22B is opened and closed, the desired opening amount may not be obtained by the capacity of the piezoelectric element 5, and as shown in the above embodiment, both arm portions 22A and 22B may be obtained. It is preferable to open and close the door to obtain a large amount of opening.

다음에 와이어 클램퍼가 온도상승한 경우의 온도보정수단에 대하여 설명한다. 제1도 및 제4도에 있어서 클램퍼 본체(2)의 선팽창계수를 β1β, 압전소자(5)의 선팽창계수를 β2, 압전소자(5)의 길이를 a, 온도변동을 △t로 하면, β1는 β2보다 큼으로 a(β1-β2) △t만큼 잘룩부(23A, 23B)가 압전소자(5)보다 크게 신장한다. 이것에 의해서 클램퍼편(4A, 4B)가 열리는 방향으로 변형하여 클램프 하중이 증대함으로 압전소자(5)에 있는 일정한 전압을 가하여도 클램퍼편(4A)가 클램퍼편(4B)과의 필요한 열림량을 확보할 수가 없게 되는 일이 있다.Next, a description will be given of temperature correction means when the wire clamper rises in temperature. 1 and 4, the linear expansion coefficient of the clamper main body 2 is β 1 β, the linear expansion coefficient of the piezoelectric element 5 is β 2 , the length of the piezoelectric element 5 is a, and the temperature fluctuation is Δt. If, β 1 is larger than a height greater than a 2 β (β 1 -β 2) △ t jalruk portion (23A, 23B) has the piezoelectric element 5 as. This deforms in the direction in which the clamper pieces 4A and 4B are opened, thereby increasing the clamp load, so that the clamper piece 4A is required to open the clamper piece 4B with the clamper piece 4B even when a constant voltage is applied to the piezoelectric element 5. It may become impossible to secure.

제5도는 상기한 온도상승에 의한 클램프 하중의 변동을 보정하는 보정수단을 도시하고 있다. 압전소자(5)에 온도보상부재(11)를 부착하고 압전소자(5)와 온도보상부재(11)를 작용부(25)와 다이어프램부(26) 사이에 부착한다. 지금 온도보상부재(11)의 선팽창계수를 β3길이를 b로 하면 압전소자(5)와 온도보상부재(11)와의 신장(L1)은 수 1과 같이 되고 클램퍼 본체(2)의 잘룩부(23A, 23B)의 신장(L2)은 수2와 같이 된다.5 shows correction means for correcting the variation of the clamp load due to the temperature rise described above. The temperature compensation member 11 is attached to the piezoelectric element 5, and the piezoelectric element 5 and the temperature compensation member 11 are attached between the acting portion 25 and the diaphragm portion 26. If the linear expansion coefficient of the temperature compensation member 11 is β 3 in length b, the elongation L 1 between the piezoelectric element 5 and the temperature compensation member 11 is equal to the number 1, and the cutout portion of the clamper body 2 is obtained. The elongation L 2 of each of 23A and 23B is equal to the number 2.

[수 1][1]

[수 2][Number 2]

그래서 L1=L2, 즉 (aβ2+bβ3)=(a+b)β1을 만족하도록 온도보상부재(11)의 선팽창계수 β3및 길이 b를 선택하면 와이어 클램퍼는 온도변화에 의한 영향을 받지 않는다. 구체적인 일예를 보면 클램퍼 본체(2)가 티탄늄(β1=8.6×10-6/℃), 압전소자(5)(β2=-3.9×10-6/℃)의 길이 a=9mm의 때, 온도보상부재(l1)로서 알루미늄계(β3=23.6×10-6/℃)를 사용하면 온도보상부재(11)의 길이 b=7.5mm로 하면 좋다.Therefore, if the linear expansion coefficient β 3 and the length b of the temperature compensation member 11 are satisfied to satisfy L 1 = L 2 , that is, (aβ 2 + bβ 3 ) = (a + b) β 1 , the wire clamper It is not affected. As a specific example, when the clamper main body 2 has a length a = 9 mm of titanium (β 1 = 8.6 × 10 −6 / ° C.) and the piezoelectric element 5 (β 2 = −3.9 × 10 −6 / ° C.) When the aluminum system (β 3 = 23.6 × 10 −6 / ° C.) is used as the temperature compensating member 11, the length b of the temperature compensating member 11 may be 7.5 mm.

또한 실시예는 온도보상부재(11)를 와이어프램부(26)측에 설치하였으나 작용부(25)측에 설치하여도 좋고 또 압전소자(5)의 양측에 설치하여도 좋다. 또 압전소자(5)를 2개 사용할때는 그 사이에 설치하여도 좋은 것은 말할 것도 없다.Further, in the embodiment, the temperature compensation member 11 is provided on the side of the wire frame 26, but may be provided on the side of the acting portion 25 or on both sides of the piezoelectric element 5. It goes without saying that when two piezoelectric elements 5 are used, they may be provided between them.

본 발명에 의하면 개폐하여 와이어를 클램프하는 한쌍의 클램퍼편이 각각 고정된 한쌍의 아암부를 가지는 와이어 본딩 장치의 와이어 클램퍼에 있어서 적어도 한쪽의 아암부의 개폐를 압전소자의 전기왜곡 또는 자기왜곡 효과에 의해서 개폐시키도록 구성하여 온도변동에 의한 클램퍼편의 클램프 하중의 변화를 보정하는 온도보상부재를 설치하여 이루어진 것임으로 온도변화에 의한 클램프 하중의 변동을 방지할 수가 있다.According to the present invention, in a wire clamper of a wire bonding apparatus having a pair of arm portions each of which has a pair of clamper pieces that open and close to clamp the wires, opening and closing of at least one arm portion can be opened or closed by the electric or magnetic distortion effect of the piezoelectric element. The temperature compensation member is provided to compensate for the change in the clamp load of the clamper piece due to the temperature fluctuation, thereby preventing the change in the clamp load due to the temperature change.

Claims (1)

개폐하여 와이어를 클램프하는 한쌍의 클램퍼편이 각각 고정된 한쌍의 아암부를 가지는 와이어 본딩 장치의 와이어 클램퍼에 있어서 적어도 한쪽의 아암부의 개폐를 압전소자의 전기왜곡 또는 자기왜곡 효과에 의해 개폐시키도록 구성하여 온도변동에 의한 클램퍼편의 클램프 하중의 변화를 보정하는 온도보상부재를 설치한 것을 특징으로 하는 와이어 클램퍼.In the wire clamper of the wire bonding apparatus which has a pair of arm parts to which the pair of clamper pieces which open and close clamp each wire are fixed, it is comprised so that opening and closing of at least one arm part may be opened and closed by the electric distortion or the magnetostriction effect of a piezoelectric element. A wire clamper comprising a temperature compensation member for correcting a change in clamp load of a clamper piece due to a change.
KR1019940004091A 1993-03-09 1994-03-03 Wire clamper KR0136733B1 (en)

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JP5072855A JP3005784B2 (en) 1993-03-09 1993-03-09 Wire clamper
JP93-072855 1993-03-09

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KR940022764A (en) 1994-10-21
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US5388751A (en) 1995-02-14

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