KR0136536B1 - Method of manufacturing semiconductor with master method - Google Patents

Method of manufacturing semiconductor with master method

Info

Publication number
KR0136536B1
KR0136536B1 KR94015300A KR19940015300A KR0136536B1 KR 0136536 B1 KR0136536 B1 KR 0136536B1 KR 94015300 A KR94015300 A KR 94015300A KR 19940015300 A KR19940015300 A KR 19940015300A KR 0136536 B1 KR0136536 B1 KR 0136536B1
Authority
KR
South Korea
Prior art keywords
master
manufacturing semiconductor
semiconductor
master method
manufacturing
Prior art date
Application number
KR94015300A
Other languages
Korean (ko)
Other versions
KR960002508A (en
Inventor
Sung-Hak Hong
Original Assignee
Hyundai Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Ind filed Critical Hyundai Electronics Ind
Priority to KR94015300A priority Critical patent/KR0136536B1/en
Publication of KR960002508A publication Critical patent/KR960002508A/en
Application granted granted Critical
Publication of KR0136536B1 publication Critical patent/KR0136536B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
KR94015300A 1994-06-29 1994-06-29 Method of manufacturing semiconductor with master method KR0136536B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR94015300A KR0136536B1 (en) 1994-06-29 1994-06-29 Method of manufacturing semiconductor with master method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR94015300A KR0136536B1 (en) 1994-06-29 1994-06-29 Method of manufacturing semiconductor with master method

Publications (2)

Publication Number Publication Date
KR960002508A KR960002508A (en) 1996-01-26
KR0136536B1 true KR0136536B1 (en) 1998-04-29

Family

ID=19386734

Family Applications (1)

Application Number Title Priority Date Filing Date
KR94015300A KR0136536B1 (en) 1994-06-29 1994-06-29 Method of manufacturing semiconductor with master method

Country Status (1)

Country Link
KR (1) KR0136536B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100369172B1 (en) * 2000-11-30 2003-01-24 현대자동차주식회사 A method for detecting leakage of intake system of turbo-charged engine and a system thereof

Also Published As

Publication number Publication date
KR960002508A (en) 1996-01-26

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20061211

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee