KR0132556B1 - Method for preventing the corrosion of metallic wirings - Google Patents
Method for preventing the corrosion of metallic wiringsInfo
- Publication number
- KR0132556B1 KR0132556B1 KR92021548A KR920021548A KR0132556B1 KR 0132556 B1 KR0132556 B1 KR 0132556B1 KR 92021548 A KR92021548 A KR 92021548A KR 920021548 A KR920021548 A KR 920021548A KR 0132556 B1 KR0132556 B1 KR 0132556B1
- Authority
- KR
- South Korea
- Prior art keywords
- corrosion
- preventing
- metallic wirings
- wirings
- metallic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/131—Reactive ion etching rie
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30165291 | 1991-11-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR0132556B1 true KR0132556B1 (en) | 1998-04-16 |
Family
ID=17899517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR92021548A KR0132556B1 (en) | 1991-11-18 | 1992-11-17 | Method for preventing the corrosion of metallic wirings |
Country Status (2)
Country | Link |
---|---|
US (1) | US5312776A (ko) |
KR (1) | KR0132556B1 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR970009612B1 (ko) * | 1993-01-25 | 1997-06-14 | 마쯔시다 덴기 산교 가부시끼가이샤 | 반도체장치의 제조방법 |
US5538921A (en) * | 1994-12-22 | 1996-07-23 | At&T Corp. | Integrated circuit fabrication |
US6057240A (en) * | 1998-04-06 | 2000-05-02 | Chartered Semiconductor Manufacturing, Ltd. | Aqueous surfactant solution method for stripping metal plasma etch deposited oxidized metal impregnated polymer residue layers from patterned metal layers |
DE10003539A1 (de) * | 2000-01-27 | 2001-08-02 | Philips Corp Intellectual Pty | Halbleiterbauelement mit Metallschicht |
US6410968B1 (en) * | 2000-08-31 | 2002-06-25 | Micron Technology, Inc. | Semiconductor device with barrier layer |
US6576964B1 (en) | 2000-08-31 | 2003-06-10 | Micron Technology, Inc. | Dielectric layer for a semiconductor device having less current leakage and increased capacitance |
US6521544B1 (en) * | 2000-08-31 | 2003-02-18 | Micron Technology, Inc. | Method of forming an ultra thin dielectric film |
JP2012124351A (ja) * | 2010-12-09 | 2012-06-28 | Toshiba Corp | 集積回路装置の製造方法 |
CN105448645A (zh) * | 2014-07-07 | 2016-03-30 | 中芯国际集成电路制造(上海)有限公司 | 焊垫的处理方法 |
US11031244B2 (en) * | 2018-08-14 | 2021-06-08 | Lam Research Corporation | Modification of SNO2 surface for EUV lithography |
CN110690121A (zh) * | 2019-10-11 | 2020-01-14 | 武汉新芯集成电路制造有限公司 | 焊盘的保护方法及半导体器件的制造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4097889A (en) * | 1976-11-01 | 1978-06-27 | Rca Corporation | Combination glass/low temperature deposited Siw Nx Hy O.sub.z |
US4585571A (en) * | 1985-03-15 | 1986-04-29 | Michael A. Bloom | Deicing compositions |
JPS61222136A (ja) * | 1985-03-28 | 1986-10-02 | Toshiba Corp | 高分子絶縁超薄膜 |
US4988423A (en) * | 1987-06-19 | 1991-01-29 | Matsushita Electric Industrial Co., Ltd. | Method for fabricating interconnection structure |
GB2216902A (en) * | 1988-04-05 | 1989-10-18 | Atomic Energy Authority Uk | Protective coatings for alloys |
JP2712401B2 (ja) * | 1988-10-22 | 1998-02-10 | 日本電気株式会社 | 半導体装置の製造方法 |
US5196372A (en) * | 1989-09-09 | 1993-03-23 | Canon Kabushiki Kaisha | Process for forming metal deposited film containing aluminum as main component by use of alkyl hydride |
US5202291A (en) * | 1990-09-26 | 1993-04-13 | Intel Corporation | High CF4 flow-reactive ion etch for aluminum patterning |
-
1992
- 1992-11-16 US US07/977,022 patent/US5312776A/en not_active Expired - Fee Related
- 1992-11-17 KR KR92021548A patent/KR0132556B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US5312776A (en) | 1994-05-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB9116684D0 (en) | Corrosion inhibitors | |
SG59951A1 (en) | Corrosion inhibition composition | |
EP0311361A3 (en) | Corrosion inhibition | |
GB2272000B (en) | A method of inhibiting corrosion | |
GB2222583B (en) | Oil field corrosion inhibition | |
PL314620A1 (en) | Corrosion preventing system | |
ZA925051B (en) | Corrosion inhibitors | |
GB8907281D0 (en) | Electrically-nonconducting system for the connection of metal tubular elements | |
GR3024221T3 (en) | Method and installation for forming the body of a metallic can | |
EP0354871A3 (en) | Corrosion inhibition | |
EP0547875A3 (en) | Elastomer-lined metal pipe | |
EP0606813A3 (en) | Process for multilayer metal conductors without corrosion. | |
KR0132556B1 (en) | Method for preventing the corrosion of metallic wirings | |
GB9201165D0 (en) | Corrosion inhibiting compositions | |
ZA918864B (en) | Corrosion inhibition | |
GB2206589B (en) | Corrosion inhibiting coating | |
GB8710195D0 (en) | Corrosion inhibition | |
GB9021984D0 (en) | Corrosion inhibition | |
GB9224778D0 (en) | Corrosion monitor | |
ZA843025B (en) | Protecting metals from corrosion | |
GB9321917D0 (en) | Corrosion inhibitors | |
GB9016223D0 (en) | Corrosion inhibition | |
GB9204411D0 (en) | Corrosion/scale inhibition | |
GB9207876D0 (en) | Corrosion reduction process | |
BG96440A (en) | Method for the furification of 8-phycoerythrin |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20041124 Year of fee payment: 8 |
|
LAPS | Lapse due to unpaid annual fee |