KR0123386Y1 - Semiconductor device socket - Google Patents
Semiconductor device socket Download PDFInfo
- Publication number
- KR0123386Y1 KR0123386Y1 KR2019940027683U KR19940027683U KR0123386Y1 KR 0123386 Y1 KR0123386 Y1 KR 0123386Y1 KR 2019940027683 U KR2019940027683 U KR 2019940027683U KR 19940027683 U KR19940027683 U KR 19940027683U KR 0123386 Y1 KR0123386 Y1 KR 0123386Y1
- Authority
- KR
- South Korea
- Prior art keywords
- cover
- socket
- semiconductor device
- mount
- mount cover
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
본 고안은 소켓의 부러짐을 방지하도록 한 반도체 디바이스 핸들러 소켓에 마운트 커버를 부착한 것으로, 소켓몸체(11)의 상부에 형성된 덮개(12)의 상면에 마운트커버(14)를 덮개(12)의 상면 모서리 부분에 형성된 결합홈(13)에 마운트커버(14)의 저면에 돌출된 결합돌기(15)가 끼워져 견고하게 결합시킨다. 한편, 소켓몸체(11)에 디바이스를 삽입하고, 마운트커버(14)가 결합된 덮개(12)를 닫은 다음 핸들아암을 이동시켜 마운트커버(14)를 누러 디바이스를 고정시키므로서 소켓(10의 훼손을 방지하며, Z축의 이동거리가 짧아 작업시간을 절약할 수 있다.The present invention attaches the mount cover to the semiconductor device handler socket to prevent the socket from being broken. The mount cover 14 is attached to the upper surface of the cover 12 formed on the upper portion of the socket body 11. A coupling protrusion 15 protruding from the bottom surface of the mount cover 14 is fitted into the coupling groove 13 formed at the corner portion to be firmly coupled. On the other hand, the device is inserted into the socket body 11, the cover 12 to which the mount cover 14 is coupled is closed, and then the handle arm is moved to press the mount cover 14 to fix the device, thereby damaging the socket 10. And short moving distance of Z axis can save working time.
Description
제1도는 종래의 소켓 사용상태 사시도.1 is a perspective view of a conventional socket use state.
제2도는 종래의 소켓 측면도.2 is a side view of a conventional socket.
제3도는 종래의 소켓 평면도.3 is a plan view of a conventional socket.
제4도는 본 고안의 소켓 측면도.4 is a side view of the socket of the present invention.
제5도는 본 고안의 소켓 평면도.5 is a plan view of the socket of the present invention.
제6도는 본 고안의 반도체 디바이스 소켓 분리상태 측면도.Figure 6 is a side view of the semiconductor device socket disconnected state of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10 : 소켓 11 : 소켓몸체10: socket 11: socket body
12 : 덮개 13 : 결합홈12: cover 13: coupling groove
14 : 마운트커버 15 : 결합돌기14: mount cover 15: engaging projection
본 고안은 반도체 디바이스 소켓에 관한 것으로, 특히 반도체 디바이스 QFP 타입의 소자 핸들러 소켓의 부러짐을 방지하도록 한 반도체 디바이스 소켓에 관한 것이다.The present invention relates to a semiconductor device socket, and more particularly to a semiconductor device socket to prevent the breakage of the device handler socket of the semiconductor device QFP type.
QFP 타입의 반도체 디바이스를 이동하거나 검사하기 위하여 반도체 디바이스 소자 핸들러에서 소켓을 사용하는데, 종래의 소자 핸들러 소켓의 소켓은 제1도 내지 제3도에 나타낸 바와같이, 소켓몸체(1)의 상부에 덮개(2)를 형성시켜 구성하였다.A socket is used in a semiconductor device element handler to move or inspect a QFP type semiconductor device. The socket of a conventional element handler socket is covered with an upper portion of the socket body 1, as shown in FIGS. (2) was formed and comprised.
이러한 종래의 소켓은 소켓몸체(1)에 디바이스를 삽입한 다음 덮개(2)를 덮개 Z축 핸들아암(3)으로 상기 덮개(2)를 덮개(2)를 눌러 삽입된 디바이스(5)가 접촉상태를 유지시킨 다음 디바이스를 테스트하였다.Such a conventional socket is inserted into the socket body (1) and then the cover (2) by the cover Z-axis handle arm (3) the cover (2) by pressing the cover (2) contact the inserted device (5) The device was tested after maintaining state.
그러나, 이러한 종래의 기술은 핸들아암(3)의 Z축 이동거리가 클 경우, 디바이스의 결합 또는 분리 시간이 오래 걸리는 단점이 발생되었으며, 이동거리가 짧을 경우, 소켓몸체(1)의 상부에 형성된 덮개(2)를 충분히 눌러주지 못하게 되고, 특히 핸들아암(3)이 소켓몸체의 상부에 형성된 덮개를 수직으로 눌러주지 못하여 소켓이 훼손되는 문제점이 발생되었다.However, such a conventional technique has a disadvantage in that the engagement or disconnection time of the device is long when the Z-axis movement distance of the handle arm 3 is large, and when the movement distance is short, the upper portion of the socket body 1 The cover 2 could not be sufficiently pressed, and in particular, the handle arm 3 could not press the cover formed vertically on the upper portion of the socket body.
따라서, 본 고안은 상기한 문제점을 해소하기 위한 것으로, 그 목적은 소켓의 덮개상부에 마운트 커버를 결합하여 Z축의 이동거리를 단축시켜 작업성을 향상시키고, 상기 마운트 커버를 경질의 물질로 형성하여 핸들아암의 작동시 소켓의 훼손을 방지하도록 한 소켓의 마운트커버를 제공하는 데 있다.Accordingly, the present invention is to solve the above problems, the purpose is to combine the mount cover on the cover of the socket to shorten the movement distance of the Z-axis to improve workability, and to form the mount cover with a hard material A socket cover is provided to prevent damage to the socket during operation of the handle arm.
위와같은 목적을 달성하기 위하여 본 고안은 소켓의 덮개 상부에 스테인레스로 된 마운트커버를 결합하여 구성함을 그 기술적 구성상의 기본특징으로 한다.In order to achieve the above object, the present invention is made by combining the mount cover made of stainless steel on the cover of the socket as a basic feature of the technical configuration.
본 고안은 반도체 디바이스 핸들러 소켓에 마운트 커버를 부착한 것으로, 소켓몸체의 상부에 형성된 덮개의 상면에 마운트커버를 덮개의 상면 모서리 부분에 형성된 결합홈에 마운트커버의 저면에 돌출된 결합돌기가 끼워져 견고하게 결합시킨다. 또한, 소켓몸체에 디바이스를 삽입하고, 마운트커버가 결합된 덮개를 닫은 다음 핸들아암을 이동시켜 마운트 커버를 눌러 디바이스를 고정시키므로서 소켓의 훼손을 방지하며, Z축의 이동거리가 짧아 작업시간을 절약할 수 있다.The present invention attaches the mount cover to the semiconductor device handler socket, the mounting projection protruding from the bottom of the mount cover into a coupling groove formed in the upper edge of the cover to the upper surface of the cover formed on the socket body firmly To be combined. Also, insert the device into the socket body, close the cover with the mount cover, and then move the handle arm to press the mount cover to fix the device to prevent the socket from being damaged and save the working time because the movement distance of the Z axis is short. can do.
본 고안을 참조하면서 상세히 설명하면 다음과 같다.Referring to the present invention in detail as follows.
제4도 내지 제6도에 나타낸 바와같이, 소켓은 소켓몸체(11)의 상부에 덮개(12)를 형성하고, 상기 덮개(12)의 상면 모서리부분에 결합홈(13)을 다수개 형성시킨다. 또한, 상기 결합홈(13)과 대응되는 다수개의 결합돌기(15)를 저면에 하향으로 돌출시켜 마운트커버(14)를 형성한다.As shown in Figures 4 to 6, the socket forms a cover 12 on the upper portion of the socket body 11, and forms a plurality of coupling grooves 13 in the upper edge portion of the cover (12). . In addition, the plurality of coupling protrusions 15 corresponding to the coupling grooves 13 protrude downward on the bottom to form a mount cover 14.
이러한 본 고안은 소켓몸체(11)의 상부에 형성된 덮개(12)의 상면에 마운트커버(14)를 결합한다. 이때, 덮개(12)의 상면 모서리 부분에 형성된 결합홈(13)에 마운트커버(14)의 저면에 돌출된 결합돌기(15)가 끼워져 견고하게 결합시킨다.The present invention is coupled to the mount cover 14 on the upper surface of the cover 12 formed on the upper portion of the socket body (11). At this time, the coupling protrusion 15 protruding from the bottom of the mount cover 14 is fitted into the coupling groove 13 formed in the upper edge portion of the cover 12 to be firmly coupled.
한편, 소켓몸체(11)에 디바이스를 삽입하고, 마운트커버(14)가 결합된 덮개(12)를 닫은 다음 핸들아암을 이동시켜 마운트커버(14)를 누러 디바이스를 고정시키므로서 소켓(10)의 훼손을 방지하며, Z축의 이동거리가 짧아 작업시간을 절약할 수 있다.Meanwhile, the device is inserted into the socket body 11, the cover 12 to which the mount cover 14 is coupled is closed, and then the handle arm is moved to press the mount cover 14 to fix the device to secure the device. It prevents damage and saves working time because the movement distance of Z axis is short.
이상에서 살펴본 바와같이, 본 고안은 소켓의 훼손을 방지하면서 안전하게 덮개를 개폐할 수 있고, Z축의 이동거리가 짧아 작업성을 향상시킬 수 있다.As discussed above, the present invention can safely open and close the cover while preventing the socket from being damaged, and can improve workability due to a short moving distance of the Z axis.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940027683U KR0123386Y1 (en) | 1994-10-24 | 1994-10-24 | Semiconductor device socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940027683U KR0123386Y1 (en) | 1994-10-24 | 1994-10-24 | Semiconductor device socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960015579U KR960015579U (en) | 1996-05-17 |
| KR0123386Y1 true KR0123386Y1 (en) | 1999-02-01 |
Family
ID=19396159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940027683U KR0123386Y1 (en) | 1994-10-24 | 1994-10-24 | Semiconductor device socket |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0123386Y1 (en) |
-
1994
- 1994-10-24 KR KR2019940027683U patent/KR0123386Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR960015579U (en) | 1996-05-17 |
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