KR0117816Y1 - Lead frame of hybrid ic type - Google Patents

Lead frame of hybrid ic type Download PDF

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Publication number
KR0117816Y1
KR0117816Y1 KR2019910020546U KR910020546U KR0117816Y1 KR 0117816 Y1 KR0117816 Y1 KR 0117816Y1 KR 2019910020546 U KR2019910020546 U KR 2019910020546U KR 910020546 U KR910020546 U KR 910020546U KR 0117816 Y1 KR0117816 Y1 KR 0117816Y1
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KR
South Korea
Prior art keywords
lead
hybrid
lead frame
pad
type
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Application number
KR2019910020546U
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Korean (ko)
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KR930012130U (en
Inventor
이환규
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정몽헌
현대전자산업 주식회사
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Priority to KR2019910020546U priority Critical patent/KR0117816Y1/en
Publication of KR930012130U publication Critical patent/KR930012130U/en
Application granted granted Critical
Publication of KR0117816Y1 publication Critical patent/KR0117816Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

본 고안은 하이브리드 IC용 리드프레임에 관한 것으로, 터미널부, 리드부 및 사이드레일로 이루어지는 하이브리드 IC용 리드프레임을 구성함에 있어서, 리드부의 임의개소에 패드부를 형성하여 표면실장과 되도록 하여 시스템의 경박단소화를 시킬 수 있다.The present invention relates to a lead frame for a hybrid IC, wherein in forming a hybrid IC lead frame including a terminal portion, a lead portion, and a side rail, a pad portion is formed at an arbitrary portion of the lead portion so as to be surface-mounted so that the system is light and thin. Can digest.

Description

하이브리드 IC용 리드프레임Leadframe for Hybrid IC

도1a는 종래의 SIP형 리드프레임의 사시도Figure 1a is a perspective view of a conventional SIP type lead frame

도1b는 종래의 SIP형 리드프레임의 사시도.Figure 1b is a perspective view of a conventional SIP lead frame.

도2a는 본 고안의 SIP형 하이브리드 IC용 리드프레임의 사시도Figure 2a is a perspective view of a lead frame for the SIP type hybrid IC of the present invention

도2b는 본 고안의 DIP형 하이브리드 IC용 리드프레임의 사시도Figure 2b is a perspective view of a lead frame for a DIP type hybrid IC of the present invention

제3도는 본 고안의 사용상태 사시도3 is a perspective view of the state of use of the present invention

* 도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings

2 : 리드부 10 : 패드부2: lead portion 10: pad portion

본 고안은 하이브리드 IC용 리드프레임에 관한 것으로, 리드부의 임의 부위에 일정형상의 패드부를 형성하고, 나머지 리드부 및 사이드레일은 절단시켜 표면실장화 시킬 수 있도록 한 하이브리드 IC용 리드프레임에 관한 것이다.The present invention relates to a lead frame for a hybrid IC, and relates to a lead frame for a hybrid IC in which a pad portion having a predetermined shape is formed at an arbitrary portion of the lead portion, and the remaining lead portions and side rails are cut and surface mounted.

일반적으로 하이브리드 IC는 전도패드가 인쇄된 서브스트레이트와 전도패드에 삽입고정되는 터미널부와, PCB기판에 끼워지는 리드부와, 리드부를 일정간격으로 고정시키는 사이드레일을 포함하는 리드프레임이 결합되어 제조된다.In general, a hybrid IC is manufactured by combining a substrate on which a conductive pad is printed and a terminal portion fixed to a conductive pad, a lead portion inserted into a PCB substrate, and a lead frame including side rails fixing lead portions at predetermined intervals. do.

이 경우 리드프레임은 전도패드에 그 터미널을 삽입시킨 다음 리드부와 사이드레일을 절단시켜 하이브리드 IC이 리드를 이루도록 한다.In this case, the lead frame inserts the terminal into the conductive pad and then cuts the lead portion and the side rails so that the hybrid IC forms a lead.

이와 같이 이루어지는 리드프레임은 제1도와 같이 예시할 수 있다.The lead frame made in this way can be illustrated as in FIG.

즉, 다수의 터미널부(1)가 각각의 리드부(2)에 일체로 형성되고, 각 리드부(2)는 사이드레일(3)에 일정간격을 두고 연결고정된다.That is, a plurality of terminal portions 1 are integrally formed in each lead portion 2, and each lead portion 2 is fixed to the side rails 3 at fixed intervals.

이때 도1a는 터미널부(1)에 벌려진 부위가 리드부(2)의 연장선상을 향하므로 SIP 하이브리드 IC에 사용되며, 도1b는 터미널부(1)의 벌려진 부위가 리드부(2)의 연장선상과 직각을 이루므로 DIP형 하이브리드 IC에 사용되는 것이다. 이를 사용시에는 터미널부(1)를 하이브리드 IC에 삽입고정 시킨 다음, 사이드레일(3)과 리드부(2)이 사이를 절단하여 하이브리드 IC를 제조완성하고, 사용시에는 리드부(2)를 PCB기판의 관통공에 삽입하여 납땜으로 고정시킨다. 따라서 이러한 리드프레임을 이용할 경우 PCB기판의 관통공에 삽입고정 시켜야하므로 공수가 증가하고, 리드부(2)의 높이만큼 부피를 많이 차지하여 집적화에 한계가 있었다.In this case, Figure 1a is used in the SIP hybrid IC because the portion open to the terminal portion 1 toward the extension line of the lead portion 2, Figure 1b is the open portion of the terminal portion 1 is the extension of the lead portion 2 Since it is perpendicular to the ship, it is used in DIP type hybrid ICs. When using this, the terminal part 1 is inserted into the hybrid IC, and then the side rail 3 and the lead part 2 are cut off to manufacture and complete the hybrid IC. In use, the lead part 2 is connected to the PCB substrate. Insert it into the through hole and fix it by soldering. Therefore, when using such a lead frame should be inserted into the through hole of the PCB substrate, the number of times increases, occupy a large volume as the height of the lead portion 2, there was a limit to integration.

본 고안은 이를 해결코자 하는 것으로, 하이브리드 IC등을 표면실장화 시킬 수 있도록 리드부의 중간에 패드부를 형성함을 특징으로 한다. 즉, 터미널부, 리드부 및 사이드레일로 이루어지는 하이브리드 IC용 리드프레임을 구성함에 있어서, 리드부의 임의개소에 패드부를 형성하여 표면실장화 되도록 한 것이다.The present invention is to solve this, it characterized in that the pad portion is formed in the middle of the lead portion to enable the surface mount of the hybrid IC. In other words, in forming a lead frame for a hybrid IC composed of a terminal portion, a lead portion, and a side rail, a pad portion is formed at an arbitrary portion of the lead portion so as to be surface mounted.

이하 제2도 및 3도 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to FIGS. 2 and 3.

도2a는 SIP형으로, SIP형 리드프레임의 리드부(2)의 임의개소에 패드부(10)를 형성한 것이다.Fig. 2A is a SIP type in which pad portions 10 are formed at arbitrary portions of the lead portion 2 of the SIP type lead frame.

도2b는 DIP형으로 DIP형 리드프레임의 리드부(2)의 임의개소에 패드부(10)를 형성한 것이다.Fig. 2B is a DIP type in which pad portions 10 are formed at arbitrary portions of the lead portion 2 of the DIP type lead frame.

이 경우 패드부(10)와 터미널부(1) 사이의 리드부(2)에는 절곡부(11)를 형성함이 바람직하다.In this case, the bent portion 11 is preferably formed in the lead portion 2 between the pad portion 10 and the terminal portion 1.

이때 이를 이용하여 하이브리드 IC(12)를 제조 및 사용할때에는, 제 2 도(가)와 같은 SIP형일 때 터미널 부(1)를 하이브리드 IC(12)의 전도패드부에 삽입고정시키고, 패드부(10)와 사이드레일(3)측의 리드부(2)를 절단하여 (도2a)의 일점쇄선 부위) 하이브리드 IC(12)를 완성하고, 이를 기판(13)위에 납땜고정시킨다(제3도).At this time, when manufacturing and using the hybrid IC 12 using this, when the SIP type as shown in FIG. 2 (a), the terminal portion 1 is inserted into the conductive pad portion of the hybrid IC 12, and the pad portion 10 ) And the lead portion 2 on the side rail 3 side are cut to complete the hybrid IC 12 (one dashed line region in FIG. 2A), and the solder IC is fixed on the substrate 13 (FIG. 3).

이때 필요에 따라 패드부(10)와 리드부(2)의 각 도등을 조정하여 기판(13)에 패드부(10)가 밀착되도록 함이 바람직하다.At this time, it is preferable that the pad part 10 is in close contact with the substrate 13 by adjusting the lamps of the pad part 10 and the lead part 2 as necessary.

물론 DIP형의 경우도 마찬가지로 제조 및 절단(제2도 (나)의 일점쇄선 위치)하여 사용된다.Of course, in the case of DIP type, it is similarly manufactured and cut (used by the dashed-dotted line in FIG. 2B).

따라서 리드부(2)의 중간에 패드부(10)를 형성하여 하이브리드 IC를 완성하고, 패드부(10)를 기판(13)위에 바로 설치가능하므로 표면실장화에 유리하다.Therefore, the pad portion 10 is formed in the middle of the lead portion 2 to complete the hybrid IC, and the pad portion 10 can be directly installed on the substrate 13, which is advantageous for surface mounting.

이상과 같이 본원 고안은 리드프레임의 리드부 중간에 패드부를 형성하여, 패드부가 기판위에서 바로 납땜고정 가능하므로, 설치가 용이하고 제품의 경박단소화를 용이하게 할 수 있다.As described above, the present invention forms a pad part in the middle of a lead part of the lead frame, so that the pad part can be fixed and soldered directly on the substrate, so that the installation is easy and the light and thin shortening of the product can be facilitated.

Claims (1)

터미널부, 리드부 및 사이드레일로 이루어지는 하이브리드 IC용 리드프레임을 구성함에 있어서, 리드부(2)의 임의개소에 패드부(10)를 형성하여 표면실장화 됨을 특징으로 하는 하이브리드 IC용 리드프레임.A hybrid IC lead frame comprising a terminal portion, a lead portion, and a side rail, wherein the pad portion (10) is formed on an arbitrary portion of the lead portion (2) to be surface mounted.
KR2019910020546U 1991-11-27 1991-11-27 Lead frame of hybrid ic type KR0117816Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910020546U KR0117816Y1 (en) 1991-11-27 1991-11-27 Lead frame of hybrid ic type

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910020546U KR0117816Y1 (en) 1991-11-27 1991-11-27 Lead frame of hybrid ic type

Publications (2)

Publication Number Publication Date
KR930012130U KR930012130U (en) 1993-06-25
KR0117816Y1 true KR0117816Y1 (en) 1998-04-24

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KR2019910020546U KR0117816Y1 (en) 1991-11-27 1991-11-27 Lead frame of hybrid ic type

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KR930012130U (en) 1993-06-25

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