KR0117136Y1 - Communication module - Google Patents
Communication moduleInfo
- Publication number
- KR0117136Y1 KR0117136Y1 KR2019940029336U KR19940029336U KR0117136Y1 KR 0117136 Y1 KR0117136 Y1 KR 0117136Y1 KR 2019940029336 U KR2019940029336 U KR 2019940029336U KR 19940029336 U KR19940029336 U KR 19940029336U KR 0117136 Y1 KR0117136 Y1 KR 0117136Y1
- Authority
- KR
- South Korea
- Prior art keywords
- chassis
- side plate
- communication module
- ground terminal
- grounded
- Prior art date
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
본 고안은 회로기판이 안치되는 샤시와, 샤시를 덮는 상.하 커버의 조립구조 및 샤시 하측면에 형성된 접지단자에 접지되는 하커버의 접지단자편을 개선하여 소형화 및 경량화, 접지의 신뢰성을 향상시킨 통신모듈에 관한 것이다. 이를 구현하기 위한 본 고안의 통신모듈은 회로소자 등이 배설된 회로기판이 안치되는 것으로 측판에 상·하로 통공이 형성되고 하면에는 접속단자가 다수개로 돌기되어 형성된 샤시와, 상기 샤시의 측판에 형성된 상측 통공과 형상맞춤되는 돌기부가 측판에 다수개로 형성된 상커버와, 상기 샤시의 측판에 형성된 하측 통공과 형상맞춤되는 돌기부가 측판에 다수개로 형성되고 상기 샤시의 하면에 형성된 접지단자에 접지되는 편평 구조의 접지단자편이 다수개 하커버를 구비하여 이루어진 것을 특징으로 한다.The present invention improves the miniaturization, light weight, and reliability of grounding by improving the chassis where the circuit board is placed, the assembly structure of the upper and lower covers covering the chassis, and the grounding terminal piece of the lower cover which is grounded to the grounding terminal formed on the lower side of the chassis. It relates to a communication module. The communication module of the present invention for realizing this has a chassis in which a circuit board on which circuit elements, etc. are disposed, is formed in the side plate, through-holes are formed up and down, and a lower surface is formed with a plurality of connection terminals. A flat structure in which a plurality of protrusions are formed on the side plate and a plurality of protrusions are formed in the side plate, and a plurality of protrusions formed in the side plate of the chassis are formed in the side plate and grounded to the ground terminal formed on the lower surface of the chassis It is characterized in that the grounding terminal piece is provided with a plurality of lower covers.
Description
본 고안은 통신모듈에 관한 것으로서, 특히 회로기판이 안치되는 샤시와 샤시를 덮는 상.하 커버와의 조립구조 및 샤시 하측면에 형성된 접지단자에 접지되는 하커버의 접지단자편을 변형시켜 소형화 및 경량화, 접지의 신뢰성을 향상시킨 통신모듈에 관한 것이다.The present invention relates to a communication module, and in particular, by assembling the chassis and the upper and lower covers covering the chassis and the ground terminal piece of the lower cover which is grounded to the ground terminal formed on the lower side of the chassis. The present invention relates to a communication module having a light weight and improved reliability of grounding.
일반적으로 통신모듈은 회로기판이 안치되는 샤시와, 샤시를 덮는 상.하 커버로 대별되는 것으로서, 도 1 내지 도 3에 도시된 바와같이 샤시(1)는 측면 상.하측에 반원형상의 고정돌기(1a)가 둘러 형성되며, 상.하커버(2)(3)의 측판은 내향절곡된 후 단부가 외측으로 벌어져 탄성을 갖는 절곡부(2a)(3a)와 안내돌부(2b)(3b)가 형성된 동일형상의 조립구조가 일정간격으로 복수개 형성된 구성을 갖는 것이다.In general, the communication module is divided into a chassis in which a circuit board is placed, and an upper and lower cover covering the chassis, and as shown in FIGS. 1 to 3, the chassis 1 has semi-circular fixing protrusions at upper and lower sides thereof. 1a) is formed, and the side plates of the upper and lower covers 2 and 3 are bent inwardly, and the ends of the upper and lower covers 2a and 3a and the guide protrusions 2b and 3b have elasticity. The formed assembly of the same shape has a plurality formed at regular intervals.
또한 회로기판이 안치된 샤시(1)와 하커버(3)의 결합시 접지되어 일정한 회로기능을 갖도록 샤시(1) 하면에는 접지단자(1b)가, 하커버(3) 상면에는 상기 접지단자(1b)와 접지되는 대응위치에 접지단자편(3c)이 각각 돌기되어 복수개 형성된 것이다.In addition, the ground terminal 1b is provided on the bottom surface of the chassis 1 so that the chassis 1 and the lower cover 3 are grounded when the circuit board is placed to have a predetermined circuit function. 1b) and a plurality of grounding terminal pieces 3c are respectively formed at corresponding positions to be grounded.
이와같이 구성된 종래의 통신모듈은 측면에 반원형상의 고정돌기(1a)가 둘러 형성된 샤시(1)에 안내돌부(2b)(3b)와 절곡부(2a)(3a)를 갖는 복수개의 조립구조가 측판에 형성된 상.하 커버(2)(3)가 결합되는 것으로서, 상기 안내돌부(2b)(3b)는 조립구조의 단부에 외측으로 벌어져 형성됨으로써 안내돌부(2b)(3b)의 안내에 의해 절곡부(2a)(3a)가 샤시(1)에 형성된 고정돌기(1a)에 쉽게 접근되며, 이후 내향절곡되어 탄성을 갖는 절곡부(2a)(3a)가 고정돌기(1a)를 지나면서 일순 벌어진 후 복원되어 절곡부(2a)(3a)의 탄성과 고정돌기(1a)의 걸림기능에 의해 상.하 커버(2)(3)가 샤시(1)에 결합되는 것이다.In the conventional communication module configured as described above, a plurality of assembling structures having guide protrusions 2b, 3b and bent parts 2a, 3a on the chassis 1 having semi-circular fixing protrusions 1a formed on the side thereof are provided on the side plate. The formed upper and lower covers 2 and 3 are coupled to each other, and the guide protrusions 2b and 3b are formed by being spread outward at the end of the assembly structure, and thus bent by guides of the guide protrusions 2b and 3b. (2a) (3a) is easily accessible to the fixing projection (1a) formed in the chassis 1, and then bent inwardly to the elastic bending portion (2a) (3a) after passing through the fixing projection (1a) The upper and lower covers 2 and 3 are coupled to the chassis 1 by the elasticity of the bent portions 2a and 3a and the locking function of the fixing protrusion 1a.
한편, 샤시(1)에 하커버(3)의 결합시 샤시(1) 하면에 돌기되어 복수개 형성된 접지단자(1b)에 하커버(3) 상면에 돌기되어 복수개 형성된 접지단자편(3c)이 접지되어 샤시(1) 상면에 안치되는 회로기판에 배설된 회로소자 등의 기능이 연결되는 것이다.On the other hand, when the lower cover 3 is coupled to the chassis 1, a plurality of grounding terminal pieces 3c protruded on the lower surface of the chassis 1 and protruded on the upper surface of the lower cover 3 on the lower surface 3 are grounded. Thus, functions such as circuit elements disposed on the circuit board placed on the upper surface of the chassis 1 are connected.
그런데, 이와같이 구성된 종래의 통신모듈에 있어서, 샤시(1)와 상.하 커버(2)(3)의 결합시 상.하 커버(2)(3) 측판에 형성된 안내돌부(2b)(3b)와 절곡부(2a)(3a)를 갖는 조립구조는 샤시(1) 측면에 둘러 형성된 반원형상의 고정돌기(1a)의 영향에 의해 샤시(1) 측면에 밀착되지 못하여 도 2에 도시된 바와같이 샤시(1)와 상.하 커버(2)(3) 측판의 사이에 공간(1)이 형성되며, 이러한 공간(1)은 통신모듈의 부피를 증가시켜 통신모듈이 한정된 세트내에서 차지하는 점유면적율의 증대요인으로 작용되어 세트내에서 타부품의 조립 및 활용공간의 장해요인이 되며, 통신모듈을 사용하는 제품의 소형화를 저해하는 문제점이 되었다.However, in the conventional communication module configured as described above, the guide protrusions 2b and 3b formed on the side plates of the upper and lower covers 2 and 3 when the chassis 1 and the upper and lower covers 2 and 3 are coupled to each other. And the bent portion (2a) (3a) has an assembly structure does not adhere to the side of the chassis 1 under the influence of the semi-circular fixing projection (1a) formed around the side of the chassis 1, as shown in Figure 2 Space (1) is formed between (1) and the upper and lower cover (2) (3) side plate, this space (1) increases the volume of the communication module of the occupied area ratio occupied by the communication module in a limited set It acts as an increasing factor, and it becomes a obstacle of assembling and utilizing space of other parts in the set, and it becomes a problem of inhibiting the miniaturization of a product using a communication module.
한편, 샤시(1) 하면과 하커버(3) 상면에 복수개 형성된 접지단자(1b)와 접지단자편(3c)이 샤시(1)에 하커버(3) 결합시 각각 접지되어 샤시(1) 상면에 안치되는 회로기판에 배설된 회로소자등이 접지단자(1b)를 통해 접지단자편(3c)으로 연결되는 것이나, 도 3에 도시된 바와같이 접지단자(1b)와 접지단자편(3c)이 돌기되어 형성됨으로써 접지부위가 선접지 및 점접지가 되어 접지단자(1b)와 접지단자편(3c)의 성형불량 및 외부충격에 의해서 접지부위가 탈락 가능이 높아 통신모듈의 회로적기능등의 작용불능을 초래하는 치명적인 문제점이 있었다.On the other hand, the ground terminal (1b) and the ground terminal piece (3c) formed in plural on the lower surface of the chassis (1) and the lower cover (3) are grounded when the lower cover (3) is coupled to the chassis (1) and the upper surface of the chassis (1), respectively. The circuit elements and the like disposed on the circuit board placed on the ground are connected to the ground terminal piece 3c through the ground terminal 1b, but as shown in FIG. 3, the ground terminal 1b and the ground terminal piece 3c are connected to each other. As it is formed by protrusions, the ground part becomes a pre-grounding and a point grounding, and the grounding part is likely to drop due to poor molding and external impact of the grounding terminal 1b and the grounding terminal piece 3c. There was a fatal problem that caused incapacity.
따라서, 본 고안은 상기한 바와같은 종래의 통신모듈의 제반문제점들을 해결하기 위하여 안출한 것으로서, 본 고안의 목적은 회로기판이 안치되는 샤시와, 샤시를 덮은 상.하 커버의 조립구조 및 샤시 하측면에 형성된 접지단자에 접지되는 하커버의 접지단자편을 개선하여 소형화 및 경량화와 접지의 신뢰성이 향상된 통신모듈을 제공하는데 있다.Accordingly, the present invention has been made to solve the problems of the conventional communication module as described above, the object of the present invention is the assembly structure of the chassis, the upper and lower cover covering the chassis and the chassis lower The present invention provides a communication module having a smaller size, lighter weight, and improved grounding reliability by improving the grounding terminal piece of the lower cover grounded to the grounding terminal formed on the side surface.
도1은 종래의 통신모듈 결합상태 사시도.1 is a perspective view of a conventional communication module coupled state.
도2는 도1의 A-A선 단면도.2 is a cross-sectional view taken along the line A-A of FIG.
도3은 종래의 통신모듈의 샤시와 하커버에 각각 돌기되어 형성된 접지단자와 접지단자편의 접지된 상태의 일부사시도.Figure 3 is a partial perspective view of the grounded state of the ground terminal and the ground terminal piece formed by projecting to the chassis and the lower cover of the conventional communication module, respectively.
도4는 본 고안이 적용된 통신모듈 결합상태 사시도.Figure 4 is a perspective view of the communication module coupled state to which the present invention is applied.
도5는 도4의 B-B선 단면도.5 is a sectional view taken along the line B-B in FIG.
도6은 본 고안의 통신모듈의 샤시와 하커버에 각각 형성된 돌기된 접지단자와 평평구조의 접지단자편이 접지된 상태의 일부사시도.Figure 6 is a partial perspective view of the grounded ground terminal piece of the flat structure and the projected ground terminal formed on the chassis and the lower cover of the present invention, respectively.
도7은 본 고안의 다른 실시예.7 is another embodiment of the present invention.
*도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1,10:샤시1a,12b,18,22:고정돌기1,10: Chassis 1a, 12b, 18, 22: Fixed protrusion
1b,14:접지단자2,16:상커버1b, 14: Ground terminal 2, 16: Top cover
2a,3a:절곡부2b,3b:안내돌부2a, 3a: bends 2b, 3b: guide protrusions
3,20:하커버3c,24:접지단자편3, 20: Lower cover 3c, 24: Ground terminal
12,12a,18a,22a:통공24a:접지면12, 12a, 18a, 22a: Through 24a: Ground
이와 같은 목적을 실현하기 위한 본 고안에 따른 통신모듈은 회로소자 등이 배설된 회로기판이 안치되는 것으로 측판에 상·하로 통공이 형성되고 하면에는 접속단자가 다수개로 돌기되어 형성된 샤시와, 상기 샤시의 측판에 형성된 상측 통공과 형상맞춤되는 돌기부가 측판에 다수개로 형성된 상커버와, 상기 샤시의 측판에 형성된 하측 통공과 형상맞춤되는 돌기부가 측판에 다수개로 형성되고 상기 샤시의 하면에 형성된 접지단자에 접지되는 편평 구조의 접지단자편이 다수개의 형성된 하커버를 구비하여 이루어진 것을 특징으로 한다.The communication module according to the present invention for achieving the above object is a chassis in which circuit elements, such as circuit elements, are disposed. A top cover formed of a plurality of protrusions formed on the side plate and formed of a plurality of protrusions formed on the side plate of the chassis, and a plurality of protrusions formed on the side plate of the chassis formed on the bottom plate of the chassis. A grounding terminal piece having a flat structure to be grounded is provided with a plurality of formed lower covers.
그리고, 상기 상.하커버의 측판은 모서리부가 일정범위 제거된 것을 특징으로 하며, 상기 접지단자편은 접지면이 엠보싱 또는 드로잉된 것을 특징으로 한다.And, the upper and lower side plates are characterized in that the corner portion is removed to a certain range, the ground terminal piece is characterized in that the ground plane is embossed or drawn.
또한, 본 고안의 다른 통신모듈은 회로소자 등이 배설된 회로기판이 안치되는 것으로 측판에 상·하로 돌기부가 형성되고 하면에는 접속단자가 다수개로 돌기되어 형성된 샤시와, 상기 샤시의 측판에 형성된 상측 돌기부와 형상맞춤되는 통공이 측판에 다수개로 형성된 상커버와, 상기 샤시의 측판에 형성된 하측 돌기부와 형상맞춤되는 통공이 측판에 다수개로 형성되고 상기 샤시의 하면에 형성된 접지단자에 접지되는 편평 구조의 접지단자편이 다수개 형성된 하커버를 구비하여 이루어진 것을 특징으로 한다.In addition, another communication module of the present invention has a chassis in which a circuit board on which circuit elements, etc., are disposed, is placed on the side plate, and the upper and lower protrusions are formed on the lower side of the chassis, and the upper side is formed on the side plate of the chassis. The top cover is formed with a plurality of through holes formed in the side plate and a plurality of through holes formed in the side plate formed in the side plate of the chassis, and the plurality of through holes formed in the side plate formed in the side plate of the flat structure that is grounded to the ground terminal formed on the lower surface of the chassis Characterized in that it comprises a lower cover formed with a plurality of ground terminal pieces.
이하, 본 고안의 일실시예에 관하여 첨부도면을 참조하면서 상세히 설명한다.Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
도 4는 본 고안이 적용된 통신모듈 결합상태 사시도이고, 도 5는 도 4의 B-B선 단면도이고, 도 6은 본 고안인 통신모듈의 샤시와 하커버에 각각 형성된 돌기된 접지단자와 편평구조의 접지단자편이 접지된 상태의 일부사시도이다.4 is a perspective view of a communication module coupled state to which the present invention is applied, and FIG. 5 is a cross-sectional view taken along line BB of FIG. 4, and FIG. 6 is a protruding ground terminal and a flat ground structure formed on the chassis and the lower cover of the present invention, respectively. Partial perspective view of the state in which the terminal piece is grounded.
도면중 도시된 부호 10은 회로소자등이 배설된 회로기판이 안치되며 하면에는 접속단자(14)가 돌기되어 복수개 형성된 샤시(10)로서, 상시 샤시(10)는 상.하 측면에 각각 복수개의 통공(12)(12a)이 형성되어 상기 통공(12)(12a)과 형상맞춤되는 곡률된 돌기부(18)(22)가 측판에 복수개 형성된 상.하 커버(16)(20)가 삽입고정되는 구성을 갖는 것이다.In the drawing, reference numeral 10 denotes a chassis 10 in which a circuit board on which circuit elements, etc. are disposed, is formed and a plurality of connection terminals 14 are protruded on the lower surface thereof, and the chassis 10 is provided on the upper and lower sides, respectively. The upper and lower covers 16 and 20 having a plurality of curved projections 18 and 22 formed on the side plates are inserted into and fixed with holes 12 and 12a formed therein. It has a configuration.
상기에 있어 돌기부(18)(22)가 복수개 형성된 상.하 커버(16)(20)의 측판은 모서리부(α)가 일정범위 제거된 것이며, 하커버(20) 상면에는 접지면(24a)이 엠보싱 또는 드로잉된 편평구조의 접지단자편(24)이 복수개 형성된 것이다.In the above, the side plates of the upper and lower covers 16 and 20 in which a plurality of protrusions 18 and 22 are formed are edge portions α removed from each other, and the upper surface of the lower cover 20 is provided with a ground plane 24a. The ground terminal piece 24 of this embossed or drawn flat structure is formed in multiple numbers.
이와같이 구성된 본 고안의 통신모듈은 회로기판이 안치되는 샤시(1)의 상하측에 상.하 커버(16)(20)가 각각 삽입고정되는데 있어서, 도 4와 도 5에 도시된 바와같이 상.하 커버(16)(20)의 측판에 형성된 돌기부(18)(22)가 샤시(10)의 상.하측면에서 형성된 통공(12)(12a)에 각각 형성맞춤되어 밀착고정됨으로써 견고한 결합은 물론, 상.하 커버(16)(20)의 측판과 샤시(10) 사이의 공간이 배제되어 통신모듈이 소형화되며, 또한 상.하 커버(16)(20)의 측판 모서리부(α)가 일정범위 제거됨으로써 또한 경량화 되는 것이다.In the communication module of the present invention configured as described above, the upper and lower covers 16 and 20 are respectively inserted and fixed on the upper and lower sides of the chassis 1 on which the circuit board is placed, as shown in FIGS. 4 and 5. The projections 18 and 22 formed on the side plates of the lower cover 16 and 20 are formed and fitted into the through holes 12 and 12a respectively formed on the upper and lower sides of the chassis 10 so as to be closely fixed to each other. The space between the side plates of the upper and lower covers 16 and 20 and the chassis 10 is eliminated, thereby miniaturizing the communication module, and the side plates edges of the upper and lower covers 16 and 20 are constant. By eliminating the range, the weight is also reduced.
한편, 회로기판이 안치되는 샤시(10)의 하면에 돌기되어 형성된 복수개의 접지단자(14)에 하커버(20)에 복수개 형성된 접지면(24a)이 엠보싱 또는 드로잉된 편평형구조의 접지단자편(24)이 접지되어 회로기판에 배설되는 회로소자등의 기능이 연결되는 것으로서, 상기 접지단자편(24)이 편평형구조로 형성됨으로써 접지단자(24)와의 접지면(24a)이 엠보싱 또는 드로잉 가공됨으로써 접지신뢰성이 더한층 증대되는 것이다.Meanwhile, a ground terminal piece having a flat structure in which a plurality of ground planes 24a formed on the lower cover 20 are embossed or drawn on a plurality of ground terminals 14 protruding from the lower surface of the chassis 10 on which the circuit board is placed. 24 is grounded, and functions such as a circuit element disposed on the circuit board are connected, and the ground terminal piece 24 is formed in a flat structure so that the ground plane 24a with the ground terminal 24 is embossed or drawn. Ground reliability is further increased.
도 7은 본 고안의 다른 실시예로써, 도시한 바와같이 샤시(10) 상하측면에 복수개의 돌기부(12b)가 형성되고, 상기 돌기부(12b)에 형상맞춤되는 통공(18a)(22a)이 상.하 커버(16)(20)에 형성되는 것으로서, 본 고안의 실시예와는 역구조의 형상을 갖는 것이나, 그 작용효과는 본 고안의 실시예와 동일하다.FIG. 7 illustrates another embodiment of the present invention, in which a plurality of protrusions 12b are formed on upper and lower sides of the chassis 10, and through-holes 18a and 22a shaped to the protrusions 12b are upwards. It is formed in the lower cover 16, 20, and has an inverse structure shape with the embodiment of the present invention, the effect is the same as the embodiment of the present invention.
상술한 바와 같이 본 고안에 따른 통신모듈은 샤시와 상.하커버의 조립구조를 형상맞춤식으로 개선함으로써 견고한 결합은 물론, 경량화 및 소형화되는 것이며, 또한 하커버의 접지단자편을 편평구조로 개선함으로써 접지의 신뢰성을 증대되는 유용한 고안이다.As described above, the communication module according to the present invention improves the assembling structure of the chassis and the upper and lower covers in a shape-fitting manner so that the rigid coupling is lighter and smaller, and the ground terminal piece of the lower cover is improved by the flat structure. It is a useful design to increase the reliability of the ground.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940029336U KR0117136Y1 (en) | 1994-11-05 | 1994-11-05 | Communication module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940029336U KR0117136Y1 (en) | 1994-11-05 | 1994-11-05 | Communication module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960019537U KR960019537U (en) | 1996-06-19 |
| KR0117136Y1 true KR0117136Y1 (en) | 1998-07-01 |
Family
ID=60846821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940029336U KR0117136Y1 (en) | 1994-11-05 | 1994-11-05 | Communication module |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0117136Y1 (en) |
-
1994
- 1994-11-05 KR KR2019940029336U patent/KR0117136Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR960019537U (en) | 1996-06-19 |
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