JP4375862B2 - Socket for land grid array package - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a socket for an LGA package in which terminals are arranged in a grid array state corresponding to lands of a land grid array (hereinafter also referred to as LGA) package.
[0002]
[Prior art]
Conventionally, a socket for an LGA package having the above configuration is known. The terminal usually extends substantially linearly in the thickness direction of the housing so that the front end engages with the land of the package with a predetermined contact pressure (for example, an electronic component disclosed in Japanese Utility Model Laid-Open No. 6-17175). Package socket, see the socket of FIG. 4B of JP-A-10-107187). Also known is a connector called a pin grid array having a structure in which a large number of openings are formed in a grid array in a plate-shaped housing, and a contact module having a terminal built in a cylindrical module body is attached to each opening. (JP-A-6-325810).
[0003]
[Problems to be solved by the invention]
In the conventional LGA package socket as described above, the terminal is made relatively large in the thickness direction of the housing so as to obtain the necessary spring performance in order to ensure the contact pressure between the terminal and the land. There was a problem that the height of. Since the terminal is relatively large, the inductance is increased, and there is a problem in terms of high-speed signal transmission. The connector called the pin grid array has a unique terminal shape in order to reduce inductance, and it is difficult to reduce the height of the socket.
[0004]
The present invention has been made in view of such problems, and an object of the present invention is to provide a socket for an LGA package that can be reduced in height and that can reduce the inductance of a terminal.
[0005]
[Means for Solving the Problems]
The present invention based on the above object is characterized by the structure of the terminal, has a bent spring piece so as to ensure the contact pressure with the land of the LGA package, and has a short signal transmission path in the terminal. Can be formed.
[0006]
That is, the present invention relates to a land grid array package socket in which terminals are arranged in a grid array state in a plate-shaped housing corresponding to the land of the land grid array package, and the terminals extend and contract in the thickness direction of the housing. is possible, and the bent spring piece portion upper engaging portion is configured to protrude from the surface of the recess of the housing at the time of expansion, the side piece portions extending in the thickness direction of the housing to face the side edges of the bent spring piece portion A contact protrusion that engages with the opposing surface of the side piece portion is provided at a side edge of the bending spring piece portion, and the terminal has a lower end portion of the bending spring piece portion that is continuous with the side piece portion. The land grid array package socket includes a tail extending from the lower end to the outside of the bottom surface of the housing .
[0007]
[Action]
In the LGA package socket of the present invention configured as described above, when the LGA package is placed on the concave surface of the housing and pressed, the bent spring piece of the terminal is pressed into the housing and exhibits elasticity. The upper end engaging portion and the land can be engaged under a necessary contact pressure. Since the necessary contact pressure is ensured by the bent spring piece, the height of the terminal is lowered, and the overall height of the socket can be reduced. Since the contact protrusion provided on the side edge of the bending spring piece engages the opposing surface of the side piece, a short signal transmission path is formed through the side piece, and the inductance of the signal transmission path is reduced. Figured.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the accompanying drawings.
[0009]
FIG. 1 shows a terminal 2 constituting the LGA package socket 1 (FIG. 2) of the embodiment. A thin metal plate is stamped and formed. The side piece 4 is continuous with both side edges of the lower end 3a of the bending spring piece 3, and the side piece 4 is formed along the side edge of the bending spring piece 3 in the vertical direction in FIG. Yes. The total length of the side piece 4 is slightly shorter than the bending spring piece 3, and the upper end engaging portion 3 b of the bending spring piece 3 protrudes above the upper end 4 a of the side piece 4. The upper end engaging portion 3 b is curved, and the apex thereof is the contact portion 5.
[0010]
A contact protrusion 6 is formed on the side edge of the bending spring piece 3 at a portion close to the upper end engaging portion 3b (see also FIG. 3). Can be engaged with each other. As shown in FIG. 3, in this embodiment, the contact protrusions 6 are formed on one side edge of the portion adjacent to the base of the upper end engaging portion 3b and on the other side edge of the lower end portion 3a. It is.
[0011]
A tail 7 further extends to the lower end 3 a of the bending spring piece 3. The tail 7 according to the embodiment has a shape that can be soldered to the surface of a conductive pad provided on the surface of the printed circuit board 8, but can also have a pin shape that is inserted into a through hole and soldered.
[0012]
As shown in FIG. 2, the LGA package socket 1 is formed of insulating plastics and has a box-shaped housing 9 having a concave portion 9 a at the center and a peripheral portion 9 b thereof, and a peripheral portion 9 b of the housing 9. And a rectangular frame-shaped metal cover 11 which is mounted on the upper surface of the metal frame and assembled with the fixing screw 10. The metal cover 11 is provided with a T-shaped pressure spring 12 from each side toward the central opening window 13. The metal cover 11 has an LGA package 14 sandwiched between the recess 9 a of the housing 9 and the metal cover 11. Is assembled to the housing 9, the LGA package 14 is pressed against the surface of the recess 9 a by the pressure spring 12.
[0013]
The terminal 2 is mounted on a terminal receiving hole 15 formed in the concave portion 9a of the housing 9 in the plate thickness direction (vertical direction in FIG. 3) from the lower surface side. The terminal receiving holes 15 are provided in correspondence with lands (not shown) provided in the grid array state on the bottom surface of the LGA package 14. Therefore, the terminals 2 are also arranged in the grid array state in the housing 9. Yes.
[0014]
3 and 4 are enlarged views of the terminal 2 mounting portion. FIG. 3 is an enlarged cross-sectional view in the direction along the side piece portion 4 of the terminal 2, and FIG. 4 is an enlarged cross-sectional view in a direction perpendicular to the side piece portion 4 and perpendicular to the side piece portion 4. A side edge of the side piece portion 4 of the terminal 2 bites into and locks the inner wall of the terminal receiving hole 15. The side piece 4 has a length substantially equal to the thickness of the recess 9 a of the housing 9. Therefore, the upper end engaging portion 3b of the bending spring piece portion 3 provided in the terminal 2 protrudes upward from the surface of the recess 9a of the housing 9 in an extended state.
[0015]
When the LGA package 14 is set on the upper surface of the peripheral portion 9b of the housing 9 and the metal cover 11 is assembled, each land is associated with the contact portion 5 formed on the upper end engaging portion 3b of the bending spring piece portion 3 of the terminal 2 corresponding thereto. The bent spring piece 3 is retracted into the concave portion 9a of the housing 9, and an appropriate contact pressure is obtained between the land of the LGA package 14 and the contact portion 5 by the elasticity, and an electrically reliable engagement is achieved. A combination is formed. Since an appropriate contact pressure is obtained by the bent spring piece 3, the overall height of the terminal 2 can be lowered, and the height of the terminal 9 can be reduced.
[0016]
On the other hand, since the contact protrusion 6 formed on the side edge of the bending spring piece 3 is engaged with the opposing surface of the side piece 4, the signal transmission path from the land of the LGA package 14 to the tail 7 of the terminal 2 is In addition, a short path from the upper end engaging portion 3b to the tail 7 through the side piece portion 4 can be obtained. Therefore, the inductance of the signal transmission path can be made as small as possible to avoid transmission delay of high-frequency signals.
[0017]
FIG. 5 shows another embodiment of the terminal 2. One of the contact protrusions 6 provided on the side edge of the bending spring piece 3 is provided on the side edge of the upper end engaging portion 3b. In this terminal 2, when the bending spring piece 3 is retracted into the recess 9 a of the housing 9, the contact protrusion 6 formed on the side edge of the upper end engaging portion 3 b is engaged with the inner wall surface of the side piece 4. become. Therefore, it can be said that the signal transmission path can be formed to be the shortest.
[0018]
【The invention's effect】
As described above, according to the present invention, the upper end engaging portion of the bending spring piece portion of the terminal is brought into contact with the land of the land grid array package so that the land and the terminal can be engaged with an appropriate contact pressure. It is possible to reduce the height of the housing and to achieve a low socket height. Also, since the contact protrusion is formed on the side edge of the bending spring piece and engaged with the opposing surface of the side piece of the terminal, a short signal transmission path is formed through the side piece to reduce the inductance of the terminal. Can be reduced.
[Brief description of the drawings]
FIG. 1 is a perspective view of a terminal according to an embodiment of the present invention.
FIG. 2 is an exploded perspective view of the LGA package socket according to the embodiment.
FIG. 3 is an enlarged cross-sectional view taken along a side piece of the terminal mounting portion of the embodiment.
FIG. 4 is an enlarged cross-sectional view as viewed in a direction perpendicular to the side piece of the terminal mounting portion of the embodiment.
FIG. 5 is a perspective view of another embodiment of a terminal.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Land grid array (LGA) package socket 2 Terminal 3 Bending spring piece part 3a Lower end part 3b Upper end engaging part 4 Side piece part 5 Contact part 6 Contact protrusion 7 Tail 9 Housing 14 LGA package 15 Terminal receiving hole

Claims (5)

Oite the socket land grid array package land grid array package over land in correspondence Terminal di they are arranged in a grid array state in the surface of the concave portion of the plate-like Haujin grayed,
The Terminal is configured to be stretchable in the thickness direction of Haujin grayed, a bent spring piece portion upper engaging portion is configured to protrude from the surface of the concave portion of Haujin grayed during elongation, the side of the bent spring piece portion opposite the edges possess a side piece extending in the thickness direction of the Haujin grayed,
Contact collision portion is provided with a facing surface engaging said side sections to the side edges of the bent spring piece portion,
The terminal for a land grid array package is characterized in that the lower end of the bent spring piece is continuous with the side piece and includes a tail extending from the lower end to the outside of the bottom surface of the housing . Contact collision portion provided on the side edges of the bent spring piece portion, a land grid array package socket according to claim 1 which is provided with a plurality in the portion near the upper end engagement portion. At least one land grid array package socket according to claim 2 which is provided on the side edges of the upper engaging portion of the plurality of contact collision portion. Side piece portion, a land grid array package socket according to claim 1 which is provided respectively to face the respective side edges of the bent spring piece portion. Side piece portion, a land grid array package socket according to claim 1 or 4 is engaged with the inner wall of the terminal receiving hole of the recessed portion of Haujin grayed.

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