JPWO2025197893A1 - - Google Patents
Info
- Publication number
- JPWO2025197893A1 JPWO2025197893A1 JP2026502986A JP2026502986A JPWO2025197893A1 JP WO2025197893 A1 JPWO2025197893 A1 JP WO2025197893A1 JP 2026502986 A JP2026502986 A JP 2026502986A JP 2026502986 A JP2026502986 A JP 2026502986A JP WO2025197893 A1 JPWO2025197893 A1 JP WO2025197893A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024043360 | 2024-03-19 | ||
| PCT/JP2025/010381 WO2025197893A1 (ja) | 2024-03-19 | 2025-03-18 | 接合方法および接合システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025197893A1 true JPWO2025197893A1 (https=) | 2025-09-25 |
| JPWO2025197893A5 JPWO2025197893A5 (https=) | 2026-04-14 |
Family
ID=97139773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2026502986A Pending JPWO2025197893A1 (https=) | 2024-03-19 | 2025-03-18 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025197893A1 (https=) |
| WO (1) | WO2025197893A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011192663A (ja) * | 2010-03-11 | 2011-09-29 | Tokyo Electron Ltd | 実装方法及び実装装置 |
| WO2012133760A1 (ja) * | 2011-03-30 | 2012-10-04 | ボンドテック株式会社 | 電子部品実装方法、電子部品実装システムおよび基板 |
| WO2014046052A1 (ja) * | 2012-09-23 | 2014-03-27 | 国立大学法人東北大学 | チップ支持基板、チップ支持方法、三次元集積回路、アセンブリ装置及び三次元集積回路の製造方法 |
| WO2019004469A1 (ja) * | 2017-06-29 | 2019-01-03 | 株式会社テンシックス | 半導体素子基板の製造方法 |
| JP2019204832A (ja) * | 2018-05-22 | 2019-11-28 | ボンドテック株式会社 | 部品実装システム、基板接合システム、部品実装方法および基板接合方法 |
| WO2021131081A1 (ja) * | 2019-12-27 | 2021-07-01 | ボンドテック株式会社 | 接合方法、被接合物および接合装置 |
-
2025
- 2025-03-18 JP JP2026502986A patent/JPWO2025197893A1/ja active Pending
- 2025-03-18 WO PCT/JP2025/010381 patent/WO2025197893A1/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011192663A (ja) * | 2010-03-11 | 2011-09-29 | Tokyo Electron Ltd | 実装方法及び実装装置 |
| WO2012133760A1 (ja) * | 2011-03-30 | 2012-10-04 | ボンドテック株式会社 | 電子部品実装方法、電子部品実装システムおよび基板 |
| WO2014046052A1 (ja) * | 2012-09-23 | 2014-03-27 | 国立大学法人東北大学 | チップ支持基板、チップ支持方法、三次元集積回路、アセンブリ装置及び三次元集積回路の製造方法 |
| WO2019004469A1 (ja) * | 2017-06-29 | 2019-01-03 | 株式会社テンシックス | 半導体素子基板の製造方法 |
| JP2019204832A (ja) * | 2018-05-22 | 2019-11-28 | ボンドテック株式会社 | 部品実装システム、基板接合システム、部品実装方法および基板接合方法 |
| WO2021131081A1 (ja) * | 2019-12-27 | 2021-07-01 | ボンドテック株式会社 | 接合方法、被接合物および接合装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025197893A1 (ja) | 2025-09-25 |
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