JPWO2025046663A1 - - Google Patents

Info

Publication number
JPWO2025046663A1
JPWO2025046663A1 JP2025542269A JP2025542269A JPWO2025046663A1 JP WO2025046663 A1 JPWO2025046663 A1 JP WO2025046663A1 JP 2025542269 A JP2025542269 A JP 2025542269A JP 2025542269 A JP2025542269 A JP 2025542269A JP WO2025046663 A1 JPWO2025046663 A1 JP WO2025046663A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025542269A
Other languages
Japanese (ja)
Other versions
JPWO2025046663A5 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025046663A1 publication Critical patent/JPWO2025046663A1/ja
Publication of JPWO2025046663A5 publication Critical patent/JPWO2025046663A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2025542269A 2023-08-25 2023-08-25 Pending JPWO2025046663A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/030764 WO2025046663A1 (ja) 2023-08-25 2023-08-25 電子機器

Publications (2)

Publication Number Publication Date
JPWO2025046663A1 true JPWO2025046663A1 (enrdf_load_stackoverflow) 2025-03-06
JPWO2025046663A5 JPWO2025046663A5 (enrdf_load_stackoverflow) 2025-09-18

Family

ID=94818366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025542269A Pending JPWO2025046663A1 (enrdf_load_stackoverflow) 2023-08-25 2023-08-25

Country Status (2)

Country Link
JP (1) JPWO2025046663A1 (enrdf_load_stackoverflow)
WO (1) WO2025046663A1 (enrdf_load_stackoverflow)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62120398U (enrdf_load_stackoverflow) * 1986-01-23 1987-07-30
US20050150634A1 (en) * 2004-01-14 2005-07-14 Howard Scott D. System for cooling environmentally sealed enclosures
JP2012099784A (ja) * 2010-08-02 2012-05-24 Fuji Electric Co Ltd 電子機器
WO2019111755A1 (ja) * 2017-12-07 2019-06-13 三菱電機株式会社 半導体装置
JP2020120033A (ja) * 2019-01-25 2020-08-06 株式会社Ｊｖｃケンウッド 排熱構造および電子機器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005110428A (ja) * 2003-09-30 2005-04-21 Toshiba Elevator Co Ltd 電力変換素子冷却装置
JP2009231701A (ja) * 2008-03-25 2009-10-08 Fujikura Ltd 電子機器用冷却装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62120398U (enrdf_load_stackoverflow) * 1986-01-23 1987-07-30
US20050150634A1 (en) * 2004-01-14 2005-07-14 Howard Scott D. System for cooling environmentally sealed enclosures
JP2012099784A (ja) * 2010-08-02 2012-05-24 Fuji Electric Co Ltd 電子機器
WO2019111755A1 (ja) * 2017-12-07 2019-06-13 三菱電機株式会社 半導体装置
JP2020120033A (ja) * 2019-01-25 2020-08-06 株式会社Ｊｖｃケンウッド 排熱構造および電子機器

Also Published As

Publication number Publication date
WO2025046663A1 (ja) 2025-03-06

Similar Documents

Publication Publication Date Title
JPWO2025046663A1 (enrdf_load_stackoverflow)
BR102023001877A2 (enrdf_load_stackoverflow)
BR102023000289A2 (enrdf_load_stackoverflow)
BR202022001779U2 (enrdf_load_stackoverflow)
BR202022000931U2 (enrdf_load_stackoverflow)
BY13164U (enrdf_load_stackoverflow)
BY13168U (enrdf_load_stackoverflow)
CN307045319S (enrdf_load_stackoverflow)
CN307044998S (enrdf_load_stackoverflow)
CN307044914S (enrdf_load_stackoverflow)
CN307044366S (enrdf_load_stackoverflow)
CN307044361S (enrdf_load_stackoverflow)
CN306840088S8 (enrdf_load_stackoverflow)
BY13176U (enrdf_load_stackoverflow)
BY13175U (enrdf_load_stackoverflow)
BY13174U (enrdf_load_stackoverflow)
BY13172U (enrdf_load_stackoverflow)
BY13171U (enrdf_load_stackoverflow)
BY13159U (enrdf_load_stackoverflow)
BY13169U (enrdf_load_stackoverflow)
BY13160U (enrdf_load_stackoverflow)
BY13167U (enrdf_load_stackoverflow)
BY13166U (enrdf_load_stackoverflow)
BY13156U (enrdf_load_stackoverflow)
BY13163U (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250722

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250722

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20250722

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250924