JPWO2024252805A1 - - Google Patents
Info
- Publication number
- JPWO2024252805A1 JPWO2024252805A1 JP2025525978A JP2025525978A JPWO2024252805A1 JP WO2024252805 A1 JPWO2024252805 A1 JP WO2024252805A1 JP 2025525978 A JP2025525978 A JP 2025525978A JP 2025525978 A JP2025525978 A JP 2025525978A JP WO2024252805 A1 JPWO2024252805 A1 JP WO2024252805A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023092419 | 2023-06-05 | ||
| PCT/JP2024/015712 WO2024252805A1 (ja) | 2023-06-05 | 2024-04-22 | 伸縮性デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024252805A1 true JPWO2024252805A1 (https=) | 2024-12-12 |
| JPWO2024252805A5 JPWO2024252805A5 (https=) | 2025-10-15 |
Family
ID=93795371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025525978A Pending JPWO2024252805A1 (https=) | 2023-06-05 | 2024-04-22 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024252805A1 (https=) |
| WO (1) | WO2024252805A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200132520A1 (en) * | 2017-07-14 | 2020-04-30 | Sony Corporation | Sensor and method of manufacturing sensor |
| CN111343915A (zh) * | 2017-11-17 | 2020-06-26 | 东洋纺株式会社 | 生理信息测定用衣物以及伸缩性层叠片 |
| EP3821800A4 (en) * | 2018-07-13 | 2022-04-06 | Toyobo Co., Ltd. | ELECTRONIC CLOTHING TYPE DEVICE AND METHOD OF MANUFACTURE THEREOF |
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2024
- 2024-04-22 JP JP2025525978A patent/JPWO2024252805A1/ja active Pending
- 2024-04-22 WO PCT/JP2024/015712 patent/WO2024252805A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024252805A1 (ja) | 2024-12-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250731 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250731 |