JPWO2024225388A1 - - Google Patents

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Publication number
JPWO2024225388A1
JPWO2024225388A1 JP2025516893A JP2025516893A JPWO2024225388A1 JP WO2024225388 A1 JPWO2024225388 A1 JP WO2024225388A1 JP 2025516893 A JP2025516893 A JP 2025516893A JP 2025516893 A JP2025516893 A JP 2025516893A JP WO2024225388 A1 JPWO2024225388 A1 JP WO2024225388A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2025516893A
Other languages
Japanese (ja)
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JP7794361B2 (ja
JPWO2024225388A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2024225388A1 publication Critical patent/JPWO2024225388A1/ja
Publication of JPWO2024225388A5 publication Critical patent/JPWO2024225388A5/ja
Application granted granted Critical
Publication of JP7794361B2 publication Critical patent/JP7794361B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
JP2025516893A 2023-04-26 2024-04-25 伸縮性デバイス Active JP7794361B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023072342 2023-04-26
JP2023072342 2023-04-26
PCT/JP2024/016278 WO2024225388A1 (ja) 2023-04-26 2024-04-25 伸縮性デバイス

Publications (3)

Publication Number Publication Date
JPWO2024225388A1 true JPWO2024225388A1 (https=) 2024-10-31
JPWO2024225388A5 JPWO2024225388A5 (https=) 2025-12-04
JP7794361B2 JP7794361B2 (ja) 2026-01-06

Family

ID=93256529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025516893A Active JP7794361B2 (ja) 2023-04-26 2024-04-25 伸縮性デバイス

Country Status (2)

Country Link
JP (1) JP7794361B2 (https=)
WO (1) WO2024225388A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019093144A1 (ja) * 2017-11-10 2019-05-16 日東電工株式会社 貼付型生体センサ
JP2019075500A (ja) * 2017-10-18 2019-05-16 日本メクトロン株式会社 伸縮性配線基板、伸縮性配線基板の製造方法及び電子部品付伸縮性配線基板
JP2021034387A (ja) * 2019-08-13 2021-03-01 日本メクトロン株式会社 伸縮性配線基板及び電気的筋肉刺激装置
JP2021064681A (ja) * 2019-10-11 2021-04-22 大日本印刷株式会社 配線基板及び配線基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019075500A (ja) * 2017-10-18 2019-05-16 日本メクトロン株式会社 伸縮性配線基板、伸縮性配線基板の製造方法及び電子部品付伸縮性配線基板
WO2019093144A1 (ja) * 2017-11-10 2019-05-16 日東電工株式会社 貼付型生体センサ
JP2021034387A (ja) * 2019-08-13 2021-03-01 日本メクトロン株式会社 伸縮性配線基板及び電気的筋肉刺激装置
JP2021064681A (ja) * 2019-10-11 2021-04-22 大日本印刷株式会社 配線基板及び配線基板の製造方法

Also Published As

Publication number Publication date
JP7794361B2 (ja) 2026-01-06
WO2024225388A1 (ja) 2024-10-31

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