JPWO2024219244A1 - - Google Patents
Info
- Publication number
- JPWO2024219244A1 JPWO2024219244A1 JP2025515156A JP2025515156A JPWO2024219244A1 JP WO2024219244 A1 JPWO2024219244 A1 JP WO2024219244A1 JP 2025515156 A JP2025515156 A JP 2025515156A JP 2025515156 A JP2025515156 A JP 2025515156A JP WO2024219244 A1 JPWO2024219244 A1 JP WO2024219244A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023070164 | 2023-04-21 | ||
| PCT/JP2024/013901 WO2024219244A1 (ja) | 2023-04-21 | 2024-04-04 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024219244A1 true JPWO2024219244A1 (https=) | 2024-10-24 |
| JPWO2024219244A5 JPWO2024219244A5 (https=) | 2026-01-26 |
Family
ID=93152872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025515156A Pending JPWO2024219244A1 (https=) | 2023-04-21 | 2024-04-04 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024219244A1 (https=) |
| WO (1) | WO2024219244A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02290032A (ja) * | 1989-12-14 | 1990-11-29 | Hitachi Ltd | レジンモールド型半導体装置の製造方法 |
| JP2531088B2 (ja) * | 1993-04-30 | 1996-09-04 | 日本電気株式会社 | 半導体装置およびその製造方法 |
| JPH08204099A (ja) * | 1995-01-31 | 1996-08-09 | Rohm Co Ltd | 半導体装置の構造及び形成方法 |
| JP5180722B2 (ja) * | 2008-07-30 | 2013-04-10 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置の製造方法 |
| JP5341473B2 (ja) * | 2008-10-31 | 2013-11-13 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 半導体装置およびその製造方法 |
| JP6228904B2 (ja) * | 2014-10-16 | 2017-11-08 | 新電元工業株式会社 | 半導体装置の製造方法、半導体装置、金型およびリードフレーム |
| US11502014B2 (en) * | 2018-09-19 | 2022-11-15 | Rohm Co., Ltd. | Semiconductor device |
| US20230245954A1 (en) * | 2020-07-13 | 2023-08-03 | Rohm Co., Ltd. | Semiconductor device, and production method for semiconductor device |
-
2024
- 2024-04-04 JP JP2025515156A patent/JPWO2024219244A1/ja active Pending
- 2024-04-04 WO PCT/JP2024/013901 patent/WO2024219244A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024219244A1 (ja) | 2024-10-24 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251015 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251107 |