JPWO2024202761A1 - - Google Patents
Info
- Publication number
- JPWO2024202761A1 JPWO2024202761A1 JP2025509970A JP2025509970A JPWO2024202761A1 JP WO2024202761 A1 JPWO2024202761 A1 JP WO2024202761A1 JP 2025509970 A JP2025509970 A JP 2025509970A JP 2025509970 A JP2025509970 A JP 2025509970A JP WO2024202761 A1 JPWO2024202761 A1 JP WO2024202761A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023054529 | 2023-03-30 | ||
| PCT/JP2024/006522 WO2024202761A1 (ja) | 2023-03-30 | 2024-02-22 | 樹脂配線基板および伸縮性デバイス |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024202761A1 true JPWO2024202761A1 (https=) | 2024-10-03 |
Family
ID=92905130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025509970A Pending JPWO2024202761A1 (https=) | 2023-03-30 | 2024-02-22 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024202761A1 (https=) |
| WO (1) | WO2024202761A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003273611A (ja) * | 2002-03-18 | 2003-09-26 | Kyocera Corp | 配線基板 |
| JP6405334B2 (ja) * | 2016-04-18 | 2018-10-17 | 日本メクトロン株式会社 | 伸縮性配線基板、及び、伸縮性配線基板の製造方法 |
| WO2019045108A1 (ja) * | 2017-09-04 | 2019-03-07 | パナソニックＩｐマネジメント株式会社 | 伸縮性回路基板、及び、それを用いたパッチデバイス |
-
2024
- 2024-02-22 WO PCT/JP2024/006522 patent/WO2024202761A1/ja not_active Ceased
- 2024-02-22 JP JP2025509970A patent/JPWO2024202761A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024202761A1 (ja) | 2024-10-03 |