JPWO2024162040A1 - - Google Patents
Info
- Publication number
- JPWO2024162040A1 JPWO2024162040A1 JP2024574434A JP2024574434A JPWO2024162040A1 JP WO2024162040 A1 JPWO2024162040 A1 JP WO2024162040A1 JP 2024574434 A JP2024574434 A JP 2024574434A JP 2024574434 A JP2024574434 A JP 2024574434A JP WO2024162040 A1 JPWO2024162040 A1 JP WO2024162040A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023012812 | 2023-01-31 | ||
| JP2023202215 | 2023-11-29 | ||
| PCT/JP2024/001451 WO2024162040A1 (ja) | 2023-01-31 | 2024-01-19 | 配線基板および実装構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024162040A1 true JPWO2024162040A1 (cg-RX-API-DMAC7.html) | 2024-08-08 |
| JPWO2024162040A5 JPWO2024162040A5 (cg-RX-API-DMAC7.html) | 2025-09-18 |
Family
ID=92146633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024574434A Withdrawn JPWO2024162040A1 (cg-RX-API-DMAC7.html) | 2023-01-31 | 2024-01-19 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024162040A1 (cg-RX-API-DMAC7.html) |
| TW (1) | TW202444155A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2024162040A1 (cg-RX-API-DMAC7.html) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016051834A (ja) * | 2014-09-01 | 2016-04-11 | イビデン株式会社 | プリント配線基板およびその製造方法 |
| JP6346916B2 (ja) * | 2016-06-13 | 2018-06-20 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| JP7567134B2 (ja) * | 2019-10-25 | 2024-10-16 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
-
2024
- 2024-01-19 JP JP2024574434A patent/JPWO2024162040A1/ja not_active Withdrawn
- 2024-01-19 WO PCT/JP2024/001451 patent/WO2024162040A1/ja not_active Ceased
- 2024-01-25 TW TW113102997A patent/TW202444155A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202444155A (zh) | 2024-11-01 |
| WO2024162040A1 (ja) | 2024-08-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250708 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250708 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20250725 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20260105 |