JPWO2024154354A1 - - Google Patents
Info
- Publication number
- JPWO2024154354A1 JPWO2024154354A1 JP2024571592A JP2024571592A JPWO2024154354A1 JP WO2024154354 A1 JPWO2024154354 A1 JP WO2024154354A1 JP 2024571592 A JP2024571592 A JP 2024571592A JP 2024571592 A JP2024571592 A JP 2024571592A JP WO2024154354 A1 JPWO2024154354 A1 JP WO2024154354A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/80—Constructional details
- H10N60/81—Containers; Mountings
- H10N60/815—Containers; Mountings for Josephson-effect devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
- H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0912—Manufacture or treatment of Josephson-effect devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/80—Constructional details
- H10N60/805—Constructional details for Josephson-effect devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N69/00—Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/63—Vias, e.g. via plugs
- H10W70/635—Through-vias
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/001769 WO2024154354A1 (ja) | 2023-01-20 | 2023-01-20 | デバイスおよびデバイスの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024154354A1 true JPWO2024154354A1 (https=) | 2024-07-25 |
Family
ID=91955781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024571592A Pending JPWO2024154354A1 (https=) | 2023-01-20 | 2023-01-20 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250301921A1 (https=) |
| EP (1) | EP4654808A4 (https=) |
| JP (1) | JPWO2024154354A1 (https=) |
| WO (1) | WO2024154354A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10134972B2 (en) * | 2015-07-23 | 2018-11-20 | Massachusetts Institute Of Technology | Qubit and coupler circuit structures and coupling techniques |
| US10242968B2 (en) * | 2015-11-05 | 2019-03-26 | Massachusetts Institute Of Technology | Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages |
| US11362257B2 (en) | 2017-05-16 | 2022-06-14 | National Institute Of Advanced Industrial Science And Technology | Quantum bit device |
| US10263170B1 (en) * | 2017-11-30 | 2019-04-16 | International Business Machines Corporation | Bumped resonator structure |
| US11088310B2 (en) | 2019-04-29 | 2021-08-10 | International Business Machines Corporation | Through-silicon-via fabrication in planar quantum devices |
| WO2021245949A1 (ja) | 2020-06-05 | 2021-12-09 | 日本電気株式会社 | 量子デバイス及び量子計算機 |
| US20220199507A1 (en) | 2020-12-22 | 2022-06-23 | International Business Machines Corporation | Multi-layered packaging for superconducting quantum circuits |
| JP7806395B2 (ja) * | 2021-04-23 | 2026-01-27 | 日本電気株式会社 | 量子デバイス |
-
2023
- 2023-01-20 EP EP23917567.2A patent/EP4654808A4/en active Pending
- 2023-01-20 JP JP2024571592A patent/JPWO2024154354A1/ja active Pending
- 2023-01-20 WO PCT/JP2023/001769 patent/WO2024154354A1/ja not_active Ceased
-
2025
- 2025-06-04 US US19/227,604 patent/US20250301921A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20250301921A1 (en) | 2025-09-25 |
| WO2024154354A1 (ja) | 2024-07-25 |
| EP4654808A1 (en) | 2025-11-26 |
| EP4654808A4 (en) | 2026-03-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250528 |