JPWO2024122576A1 - - Google Patents

Info

Publication number
JPWO2024122576A1
JPWO2024122576A1 JP2024562967A JP2024562967A JPWO2024122576A1 JP WO2024122576 A1 JPWO2024122576 A1 JP WO2024122576A1 JP 2024562967 A JP2024562967 A JP 2024562967A JP 2024562967 A JP2024562967 A JP 2024562967A JP WO2024122576 A1 JPWO2024122576 A1 JP WO2024122576A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024562967A
Other languages
Japanese (ja)
Other versions
JPWO2024122576A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024122576A1 publication Critical patent/JPWO2024122576A1/ja
Publication of JPWO2024122576A5 publication Critical patent/JPWO2024122576A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2024562967A 2022-12-07 2023-12-06 Pending JPWO2024122576A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022195727 2022-12-07
PCT/JP2023/043635 WO2024122576A1 (ja) 2022-12-07 2023-12-06 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Publications (2)

Publication Number Publication Date
JPWO2024122576A1 true JPWO2024122576A1 (https=) 2024-06-13
JPWO2024122576A5 JPWO2024122576A5 (https=) 2025-08-19

Family

ID=91379104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024562967A Pending JPWO2024122576A1 (https=) 2022-12-07 2023-12-06

Country Status (2)

Country Link
JP (1) JPWO2024122576A1 (https=)
WO (1) WO2024122576A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179181A (ja) * 2001-12-11 2003-06-27 Ngk Spark Plug Co Ltd 樹脂製配線基板
WO2020040072A1 (ja) * 2018-08-21 2020-02-27 Ngkエレクトロデバイス株式会社 配線基板、パッケージおよびモジュール

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179181A (ja) * 2001-12-11 2003-06-27 Ngk Spark Plug Co Ltd 樹脂製配線基板
WO2020040072A1 (ja) * 2018-08-21 2020-02-27 Ngkエレクトロデバイス株式会社 配線基板、パッケージおよびモジュール

Also Published As

Publication number Publication date
WO2024122576A1 (ja) 2024-06-13

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