JPWO2024071419A1 - - Google Patents

Info

Publication number
JPWO2024071419A1
JPWO2024071419A1 JP2024550523A JP2024550523A JPWO2024071419A1 JP WO2024071419 A1 JPWO2024071419 A1 JP WO2024071419A1 JP 2024550523 A JP2024550523 A JP 2024550523A JP 2024550523 A JP2024550523 A JP 2024550523A JP WO2024071419 A1 JPWO2024071419 A1 JP WO2024071419A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024550523A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024071419A1 publication Critical patent/JPWO2024071419A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/851Thermoelectric active materials comprising inorganic compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Hall/Mr Elements (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2024550523A 2022-09-29 2023-09-29 Pending JPWO2024071419A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022156711 2022-09-29
PCT/JP2023/035777 WO2024071419A1 (ja) 2022-09-29 2023-09-29 熱電変換素子及びセンサ

Publications (1)

Publication Number Publication Date
JPWO2024071419A1 true JPWO2024071419A1 (https=) 2024-04-04

Family

ID=90478205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024550523A Pending JPWO2024071419A1 (https=) 2022-09-29 2023-09-29

Country Status (4)

Country Link
US (1) US20260107687A1 (https=)
JP (1) JPWO2024071419A1 (https=)
CN (1) CN120694002A (https=)
WO (1) WO2024071419A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6231467B2 (ja) * 2014-11-27 2017-11-15 トヨタ自動車株式会社 熱電体
JP2018078147A (ja) * 2016-11-07 2018-05-17 Tdk株式会社 磁気熱電素子および発電方法
WO2018180800A1 (ja) * 2017-03-31 2018-10-04 日本電気株式会社 温度拡散係数計測装置、それを用いた深部体温計、深部体温計測装置、および深部体温計測方法
JP2019106436A (ja) * 2017-12-12 2019-06-27 日本電気株式会社 磁性熱電変換素子及びそれを含む熱電変換システム
US20200187670A1 (en) * 2018-12-18 2020-06-18 Dreamwell, Ltd. Active comfort controlled bedding systems
CN113728447B (zh) * 2019-04-26 2025-07-08 国立大学法人东京大学 热电转换元件以及热电转换装置
US12352637B2 (en) * 2019-09-25 2025-07-08 Nec Corporation Heat-flow sensor

Also Published As

Publication number Publication date
WO2024071419A1 (ja) 2024-04-04
US20260107687A1 (en) 2026-04-16
CN120694002A (zh) 2025-09-23

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