JPWO2024070337A5 - - Google Patents

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Publication number
JPWO2024070337A5
JPWO2024070337A5 JP2024549873A JP2024549873A JPWO2024070337A5 JP WO2024070337 A5 JPWO2024070337 A5 JP WO2024070337A5 JP 2024549873 A JP2024549873 A JP 2024549873A JP 2024549873 A JP2024549873 A JP 2024549873A JP WO2024070337 A5 JPWO2024070337 A5 JP WO2024070337A5
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JP
Japan
Prior art keywords
internal electrode
layer
electrode layer
stacking direction
width direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024549873A
Other languages
English (en)
Japanese (ja)
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JP7838661B2 (ja
JPWO2024070337A1 (cg-RX-API-DMAC7.html
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Application filed filed Critical
Priority claimed from PCT/JP2023/030103 external-priority patent/WO2024070337A1/ja
Publication of JPWO2024070337A1 publication Critical patent/JPWO2024070337A1/ja
Publication of JPWO2024070337A5 publication Critical patent/JPWO2024070337A5/ja
Application granted granted Critical
Publication of JP7838661B2 publication Critical patent/JP7838661B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024549873A 2022-09-27 2023-08-22 積層セラミックコンデンサ Active JP7838661B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022153369 2022-09-27
JP2022153369 2022-09-27
PCT/JP2023/030103 WO2024070337A1 (ja) 2022-09-27 2023-08-22 積層セラミックコンデンサ

Publications (3)

Publication Number Publication Date
JPWO2024070337A1 JPWO2024070337A1 (cg-RX-API-DMAC7.html) 2024-04-04
JPWO2024070337A5 true JPWO2024070337A5 (cg-RX-API-DMAC7.html) 2025-05-14
JP7838661B2 JP7838661B2 (ja) 2026-04-01

Family

ID=90477034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024549873A Active JP7838661B2 (ja) 2022-09-27 2023-08-22 積層セラミックコンデンサ

Country Status (3)

Country Link
JP (1) JP7838661B2 (cg-RX-API-DMAC7.html)
CN (1) CN119816908A (cg-RX-API-DMAC7.html)
WO (1) WO2024070337A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119764291B (zh) * 2025-03-06 2025-06-17 嘉善复旦研究院 半导体器件、半导体封装和半导体封装方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001126951A (ja) * 1999-10-29 2001-05-11 Tdk Corp 積層セラミック電子部品の製造方法
JP2001237140A (ja) * 1999-12-13 2001-08-31 Murata Mfg Co Ltd 積層型セラミック電子部品およびその製造方法ならびにセラミックペーストおよびその製造方法
JP4135443B2 (ja) 2002-09-03 2008-08-20 株式会社村田製作所 積層型セラミック電子部品の製造方法
JP2006128350A (ja) 2004-10-28 2006-05-18 Taiyo Yuden Co Ltd 積層セラミックコンデンサ及びその製造方法
WO2010109562A1 (ja) 2009-03-27 2010-09-30 株式会社村田製作所 積層セラミック電子部品の製造方法
JP7241943B2 (ja) 2018-05-09 2023-03-17 太陽誘電株式会社 積層セラミックコンデンサ及びその製造方法

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