JPWO2024029336A1 - - Google Patents
Info
- Publication number
- JPWO2024029336A1 JPWO2024029336A1 JP2024538914A JP2024538914A JPWO2024029336A1 JP WO2024029336 A1 JPWO2024029336 A1 JP WO2024029336A1 JP 2024538914 A JP2024538914 A JP 2024538914A JP 2024538914 A JP2024538914 A JP 2024538914A JP WO2024029336 A1 JPWO2024029336 A1 JP WO2024029336A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022123430 | 2022-08-02 | ||
| PCT/JP2023/026441 WO2024029336A1 (ja) | 2022-08-02 | 2023-07-19 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024029336A1 true JPWO2024029336A1 (https=) | 2024-02-08 |
| JPWO2024029336A5 JPWO2024029336A5 (https=) | 2025-04-11 |
Family
ID=89848848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024538914A Pending JPWO2024029336A1 (https=) | 2022-08-02 | 2023-07-19 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024029336A1 (https=) |
| WO (1) | WO2024029336A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026018726A1 (ja) * | 2024-07-18 | 2026-01-22 | ローム株式会社 | 半導体装置、半導体モジュール、および半導体装置の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3780230B2 (ja) * | 2002-07-03 | 2006-05-31 | 株式会社日立製作所 | 半導体モジュール及び電力変換装置 |
| JP6003624B2 (ja) * | 2012-12-26 | 2016-10-05 | 株式会社明電舎 | 半導体モジュール |
| US10404186B2 (en) * | 2016-10-27 | 2019-09-03 | General Electric Company | Power module systems and methods having reduced common mode capacitive currents and reduced electromagnetic interference |
| JP7196761B2 (ja) * | 2019-05-15 | 2022-12-27 | 株式会社デンソー | 半導体装置 |
| JP2022107077A (ja) * | 2019-05-31 | 2022-07-21 | 日立Astemo株式会社 | 半導体装置、および半導体装置の製造方法 |
| JP7363587B2 (ja) * | 2020-03-04 | 2023-10-18 | 株式会社デンソー | 半導体装置 |
-
2023
- 2023-07-19 WO PCT/JP2023/026441 patent/WO2024029336A1/ja not_active Ceased
- 2023-07-19 JP JP2024538914A patent/JPWO2024029336A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024029336A1 (ja) | 2024-02-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241223 |