JPWO2024014473A1 - - Google Patents
Info
- Publication number
- JPWO2024014473A1 JPWO2024014473A1 JP2024533732A JP2024533732A JPWO2024014473A1 JP WO2024014473 A1 JPWO2024014473 A1 JP WO2024014473A1 JP 2024533732 A JP2024533732 A JP 2024533732A JP 2024533732 A JP2024533732 A JP 2024533732A JP WO2024014473 A1 JPWO2024014473 A1 JP WO2024014473A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
- H10W20/48—Insulating materials thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022114107 | 2022-07-15 | ||
| PCT/JP2023/025696 WO2024014473A1 (ja) | 2022-07-15 | 2023-07-12 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024014473A1 true JPWO2024014473A1 (https=) | 2024-01-18 |
| JPWO2024014473A5 JPWO2024014473A5 (https=) | 2025-03-26 |
Family
ID=89536746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024533732A Pending JPWO2024014473A1 (https=) | 2022-07-15 | 2023-07-12 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024014473A1 (https=) |
| WO (1) | WO2024014473A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002289609A (ja) * | 2001-03-27 | 2002-10-04 | Toshiba Corp | 半導体装置及びその製造方法 |
| US9502284B2 (en) * | 2013-12-31 | 2016-11-22 | Texas Instruments Incorporated | Metal thin film resistor and process |
| WO2022149371A1 (ja) * | 2021-01-08 | 2022-07-14 | ローム株式会社 | 電子部品 |
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2023
- 2023-07-12 WO PCT/JP2023/025696 patent/WO2024014473A1/ja not_active Ceased
- 2023-07-12 JP JP2024533732A patent/JPWO2024014473A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024014473A1 (ja) | 2024-01-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241217 |