JPWO2024010022A1 - - Google Patents
Info
- Publication number
- JPWO2024010022A1 JPWO2024010022A1 JP2024532602A JP2024532602A JPWO2024010022A1 JP WO2024010022 A1 JPWO2024010022 A1 JP WO2024010022A1 JP 2024532602 A JP2024532602 A JP 2024532602A JP 2024532602 A JP2024532602 A JP 2024532602A JP WO2024010022 A1 JPWO2024010022 A1 JP WO2024010022A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
- H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/77—Auxiliary members characterised by their shape
- H10W40/778—Auxiliary members characterised by their shape in encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022108631 | 2022-07-05 | ||
| PCT/JP2023/024868 WO2024010022A1 (ja) | 2022-07-05 | 2023-07-05 | 基板、電子装置、電子モジュールおよびモジュール装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024010022A1 true JPWO2024010022A1 (https=) | 2024-01-11 |
| JPWO2024010022A5 JPWO2024010022A5 (https=) | 2025-03-07 |
Family
ID=89453447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024532602A Pending JPWO2024010022A1 (https=) | 2022-07-05 | 2023-07-05 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250392096A1 (https=) |
| JP (1) | JPWO2024010022A1 (https=) |
| CN (1) | CN119487977A (https=) |
| DE (1) | DE112023002939T5 (https=) |
| WO (1) | WO2024010022A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0736468U (ja) * | 1993-12-06 | 1995-07-04 | 株式会社東海理化電機製作所 | 電子部品の放熱構造 |
| JPH10335571A (ja) * | 1997-05-30 | 1998-12-18 | T I F:Kk | メモリモジュールおよびメモリシステム |
| US20070284711A1 (en) * | 2006-06-09 | 2007-12-13 | Lee Tien Yu T | Methods and apparatus for thermal management in a multi-layer embedded chip structure |
| JP2022015483A (ja) * | 2020-07-09 | 2022-01-21 | Tdk株式会社 | 回路基板及びこれを用いた回路モジュール |
-
2023
- 2023-07-05 WO PCT/JP2023/024868 patent/WO2024010022A1/ja not_active Ceased
- 2023-07-05 CN CN202380049764.7A patent/CN119487977A/zh active Pending
- 2023-07-05 JP JP2024532602A patent/JPWO2024010022A1/ja active Pending
- 2023-07-05 DE DE112023002939.3T patent/DE112023002939T5/de active Pending
- 2023-07-05 US US18/879,110 patent/US20250392096A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0736468U (ja) * | 1993-12-06 | 1995-07-04 | 株式会社東海理化電機製作所 | 電子部品の放熱構造 |
| JPH10335571A (ja) * | 1997-05-30 | 1998-12-18 | T I F:Kk | メモリモジュールおよびメモリシステム |
| US20070284711A1 (en) * | 2006-06-09 | 2007-12-13 | Lee Tien Yu T | Methods and apparatus for thermal management in a multi-layer embedded chip structure |
| JP2022015483A (ja) * | 2020-07-09 | 2022-01-21 | Tdk株式会社 | 回路基板及びこれを用いた回路モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| CN119487977A (zh) | 2025-02-18 |
| DE112023002939T5 (de) | 2025-05-08 |
| WO2024010022A1 (ja) | 2024-01-11 |
| US20250392096A1 (en) | 2025-12-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
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|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20241225 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260224 |
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| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20260416 |