JPWO2024004750A1 - - Google Patents
Info
- Publication number
- JPWO2024004750A1 JPWO2024004750A1 JP2023571422A JP2023571422A JPWO2024004750A1 JP WO2024004750 A1 JPWO2024004750 A1 JP WO2024004750A1 JP 2023571422 A JP2023571422 A JP 2023571422A JP 2023571422 A JP2023571422 A JP 2023571422A JP WO2024004750 A1 JPWO2024004750 A1 JP WO2024004750A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022102366 | 2022-06-27 | ||
| PCT/JP2023/022707 WO2024004750A1 (ja) | 2022-06-27 | 2023-06-20 | 研磨材スラリー及びその研磨方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024004750A1 true JPWO2024004750A1 (ja) | 2024-01-04 |
Family
ID=89382201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023571422A Pending JPWO2024004750A1 (ja) | 2022-06-27 | 2023-06-20 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024004750A1 (ja) |
| TW (1) | TW202401559A (ja) |
| WO (1) | WO2024004750A1 (ja) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2767568B1 (en) * | 2011-10-13 | 2018-12-05 | Mitsui Mining and Smelting Co., Ltd. | Polishing slurry, and polishing method |
| KR20140106528A (ko) * | 2011-12-14 | 2014-09-03 | 아사히 가라스 가부시키가이샤 | 세정제, 및 탄화규소 단결정 기판의 제조 방법 |
| WO2018116521A1 (ja) * | 2016-12-22 | 2018-06-28 | 三井金属鉱業株式会社 | 研摩液及び研摩方法 |
| KR20220024518A (ko) * | 2019-06-17 | 2022-03-03 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 |
-
2023
- 2023-06-20 WO PCT/JP2023/022707 patent/WO2024004750A1/ja unknown
- 2023-06-20 JP JP2023571422A patent/JPWO2024004750A1/ja active Pending
- 2023-06-21 TW TW112123480A patent/TW202401559A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202401559A (zh) | 2024-01-01 |
| WO2024004750A1 (ja) | 2024-01-04 |
Similar Documents
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