JPWO2023286142A1 - - Google Patents

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Publication number
JPWO2023286142A1
JPWO2023286142A1 JP2022539010A JP2022539010A JPWO2023286142A1 JP WO2023286142 A1 JPWO2023286142 A1 JP WO2023286142A1 JP 2022539010 A JP2022539010 A JP 2022539010A JP 2022539010 A JP2022539010 A JP 2022539010A JP WO2023286142 A1 JPWO2023286142 A1 JP WO2023286142A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022539010A
Other versions
JP7289992B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023286142A1 publication Critical patent/JPWO2023286142A1/ja
Application granted granted Critical
Publication of JP7289992B1 publication Critical patent/JP7289992B1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3288—Maintenance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
JP2022539010A 2021-07-13 2021-07-13 診断装置及び診断方法並びにプラズマ処理装置及び半導体装置製造システム Active JP7289992B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/026208 WO2023286142A1 (ja) 2021-07-13 2021-07-13 診断装置及び診断方法並びにプラズマ処理装置及び半導体装置製造システム

Publications (2)

Publication Number Publication Date
JPWO2023286142A1 true JPWO2023286142A1 (ja) 2023-01-19
JP7289992B1 JP7289992B1 (ja) 2023-06-12

Family

ID=84919131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022539010A Active JP7289992B1 (ja) 2021-07-13 2021-07-13 診断装置及び診断方法並びにプラズマ処理装置及び半導体装置製造システム

Country Status (5)

Country Link
JP (1) JP7289992B1 (ja)
KR (1) KR20230012453A (ja)
CN (1) CN116057675A (ja)
TW (1) TW202318475A (ja)
WO (1) WO2023286142A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101708077B1 (ko) * 2009-06-30 2017-02-17 램 리써치 코포레이션 프로세싱 챔버의 예측 예방 보전을 위한 방법 및 장치
US10269545B2 (en) * 2016-08-03 2019-04-23 Lam Research Corporation Methods for monitoring plasma processing systems for advanced process and tool control
WO2018061842A1 (ja) 2016-09-27 2018-04-05 東京エレクトロン株式会社 異常検知プログラム、異常検知方法および異常検知装置
JP6990634B2 (ja) 2018-08-21 2022-02-03 株式会社日立ハイテク 状態予測装置及び半導体製造装置
US20220157580A1 (en) * 2019-07-30 2022-05-19 Hitachi High-Tech Corporation Diagnosis apparatus, plasma processing apparatus and diagnosis method

Also Published As

Publication number Publication date
TW202318475A (zh) 2023-05-01
KR20230012453A (ko) 2023-01-26
JP7289992B1 (ja) 2023-06-12
CN116057675A (zh) 2023-05-02
WO2023286142A1 (ja) 2023-01-19

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