JPWO2023276510A1 - - Google Patents

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Publication number
JPWO2023276510A1
JPWO2023276510A1 JP2023531714A JP2023531714A JPWO2023276510A1 JP WO2023276510 A1 JPWO2023276510 A1 JP WO2023276510A1 JP 2023531714 A JP2023531714 A JP 2023531714A JP 2023531714 A JP2023531714 A JP 2023531714A JP WO2023276510 A1 JPWO2023276510 A1 JP WO2023276510A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023531714A
Other languages
Japanese (ja)
Other versions
JP7476430B2 (ja
JPWO2023276510A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023276510A1 publication Critical patent/JPWO2023276510A1/ja
Publication of JPWO2023276510A5 publication Critical patent/JPWO2023276510A5/ja
Application granted granted Critical
Publication of JP7476430B2 publication Critical patent/JP7476430B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2023531714A 2021-07-02 2022-05-27 フレキシブルプリント回路基板及びフレキシブルプリント回路基板の製造方法 Active JP7476430B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021110599 2021-07-02
JP2021110599 2021-07-02
PCT/JP2022/021763 WO2023276510A1 (ja) 2021-07-02 2022-05-27 フレキシブルプリント回路基板及びフレキシブルプリント回路基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023276510A1 true JPWO2023276510A1 (https=) 2023-01-05
JPWO2023276510A5 JPWO2023276510A5 (https=) 2023-09-28
JP7476430B2 JP7476430B2 (ja) 2024-04-30

Family

ID=84691214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023531714A Active JP7476430B2 (ja) 2021-07-02 2022-05-27 フレキシブルプリント回路基板及びフレキシブルプリント回路基板の製造方法

Country Status (4)

Country Link
US (1) US20240121898A1 (https=)
JP (1) JP7476430B2 (https=)
CN (1) CN116941333A (https=)
WO (1) WO2023276510A1 (https=)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004259774A (ja) * 2003-02-24 2004-09-16 Sumitomo Metal Mining Co Ltd Ｉｃパッケージ用回路基板の製造方法
JP2005191525A (ja) * 2003-12-05 2005-07-14 Mitsui Mining & Smelting Co Ltd プリント配線基板、その製造法および回路装置
JP2005210058A (ja) * 2003-12-26 2005-08-04 Mitsui Mining & Smelting Co Ltd プリント配線基板、その製造方法および回路装置
JP2006066812A (ja) * 2004-08-30 2006-03-09 Nitto Denko Corp 配線回路基板
JP2007165634A (ja) * 2005-12-14 2007-06-28 Fujitsu Ltd 配線基板の製造方法
JP2012080078A (ja) * 2010-10-01 2012-04-19 Lg Innotek Co Ltd タブテープおよびその製造方法
JP2014075163A (ja) * 2012-10-03 2014-04-24 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法
JP2017224642A (ja) * 2016-06-13 2017-12-21 新光電気工業株式会社 配線基板及びその製造方法
JP2018116973A (ja) * 2017-01-16 2018-07-26 富士通株式会社 配線構造、電子装置、及び、配線構造の製造方法
JP2020047773A (ja) * 2018-09-19 2020-03-26 株式会社フジクラ プリント配線板及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090113074A (ko) * 2008-04-25 2009-10-29 삼성테크윈 주식회사 연성 회로 기판 및 그의 미세 피치 형성 방법
JP2016051834A (ja) * 2014-09-01 2016-04-11 イビデン株式会社 プリント配線基板およびその製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004259774A (ja) * 2003-02-24 2004-09-16 Sumitomo Metal Mining Co Ltd Ｉｃパッケージ用回路基板の製造方法
JP2005191525A (ja) * 2003-12-05 2005-07-14 Mitsui Mining & Smelting Co Ltd プリント配線基板、その製造法および回路装置
JP2005210058A (ja) * 2003-12-26 2005-08-04 Mitsui Mining & Smelting Co Ltd プリント配線基板、その製造方法および回路装置
JP2006066812A (ja) * 2004-08-30 2006-03-09 Nitto Denko Corp 配線回路基板
JP2007165634A (ja) * 2005-12-14 2007-06-28 Fujitsu Ltd 配線基板の製造方法
JP2012080078A (ja) * 2010-10-01 2012-04-19 Lg Innotek Co Ltd タブテープおよびその製造方法
JP2014075163A (ja) * 2012-10-03 2014-04-24 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法
JP2017224642A (ja) * 2016-06-13 2017-12-21 新光電気工業株式会社 配線基板及びその製造方法
JP2018116973A (ja) * 2017-01-16 2018-07-26 富士通株式会社 配線構造、電子装置、及び、配線構造の製造方法
JP2020047773A (ja) * 2018-09-19 2020-03-26 株式会社フジクラ プリント配線板及びその製造方法

Also Published As

Publication number Publication date
CN116941333A (zh) 2023-10-24
US20240121898A1 (en) 2024-04-11
WO2023276510A1 (ja) 2023-01-05
JP7476430B2 (ja) 2024-04-30

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