JPWO2023218899A5 - - Google Patents

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Publication number
JPWO2023218899A5
JPWO2023218899A5 JP2024520344A JP2024520344A JPWO2023218899A5 JP WO2023218899 A5 JPWO2023218899 A5 JP WO2023218899A5 JP 2024520344 A JP2024520344 A JP 2024520344A JP 2024520344 A JP2024520344 A JP 2024520344A JP WO2023218899 A5 JPWO2023218899 A5 JP WO2023218899A5
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JP
Japan
Prior art keywords
evaluation area
processing circuit
light
measurement system
measurement
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Pending
Application number
JP2024520344A
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English (en)
Japanese (ja)
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JPWO2023218899A1 (https=
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Priority claimed from PCT/JP2023/015843 external-priority patent/WO2023218899A1/ja
Publication of JPWO2023218899A1 publication Critical patent/JPWO2023218899A1/ja
Publication of JPWO2023218899A5 publication Critical patent/JPWO2023218899A5/ja
Pending legal-status Critical Current

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JP2024520344A 2022-05-13 2023-04-21 Pending JPWO2023218899A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022079310 2022-05-13
JP2023035884 2023-03-08
PCT/JP2023/015843 WO2023218899A1 (ja) 2022-05-13 2023-04-21 計測システムおよび計測方法

Publications (2)

Publication Number Publication Date
JPWO2023218899A1 JPWO2023218899A1 (https=) 2023-11-16
JPWO2023218899A5 true JPWO2023218899A5 (https=) 2025-01-24

Family

ID=88730282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024520344A Pending JPWO2023218899A1 (https=) 2022-05-13 2023-04-21

Country Status (3)

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US (1) US20250035434A1 (https=)
JP (1) JPWO2023218899A1 (https=)
WO (1) WO2023218899A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026053403A1 (ja) * 2024-09-09 2026-03-12 Ｎｔｔ株式会社 汚染度評価方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7714995B2 (en) * 1997-09-22 2010-05-11 Kla-Tencor Corporation Material independent profiler
EP1400802A1 (en) * 2002-09-23 2004-03-24 Ford Global Technologies, Inc. Method and arrangement for detecting and evaluating surface irregularities
JP4012798B2 (ja) * 2002-10-03 2007-11-21 株式会社東洋精機製作所 レーザ反射光による表面粗さ測定方法及びその装置
US7742168B2 (en) * 2003-04-29 2010-06-22 Surfoptic Limited Measuring a surface characteristic
US20070146685A1 (en) * 2005-11-30 2007-06-28 Yoo Woo S Dynamic wafer stress management system
DE102007010588B3 (de) * 2007-03-05 2008-06-12 Carl Zeiss Smt Ag Verfahren und Vorrichtung zum Vermessen einer Oberfläche eines Objekts und Verfahren zur Herstellung eines Objekts
JP2012078144A (ja) * 2010-09-30 2012-04-19 Kaneka Corp 透明体シート状物の表面欠陥検査装置
JP2016024060A (ja) * 2014-07-22 2016-02-08 キヤノン株式会社 計測条件の決定方法および計測装置
KR102044196B1 (ko) * 2016-07-19 2019-11-13 닛폰세이테츠 가부시키가이샤 조도 측정 장치 및 조도 측정 방법
JP7215568B2 (ja) * 2019-04-03 2023-01-31 日本電気株式会社 表面異常検知装置、及びシステム
FR3109626B1 (fr) * 2020-04-27 2022-06-03 Michelin & Cie Procede d’obtention du profil d’une surface en mouvement par rapport au systeme
DE102021105946A1 (de) * 2021-03-11 2022-09-15 Asml Netherlands B.V. Messvorrichtung und Verfahren zur Rauheits- und/oder Defektmessung an einer Oberfläche

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