JPWO2023218876A1 - - Google Patents
Info
- Publication number
- JPWO2023218876A1 JPWO2023218876A1 JP2024520328A JP2024520328A JPWO2023218876A1 JP WO2023218876 A1 JPWO2023218876 A1 JP WO2023218876A1 JP 2024520328 A JP2024520328 A JP 2024520328A JP 2024520328 A JP2024520328 A JP 2024520328A JP WO2023218876 A1 JPWO2023218876 A1 JP WO2023218876A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022079629 | 2022-05-13 | ||
| PCT/JP2023/015488 WO2023218876A1 (ja) | 2022-05-13 | 2023-04-18 | アルカリ可溶性樹脂、感光性樹脂組成物及びその硬化物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023218876A1 true JPWO2023218876A1 (https=) | 2023-11-16 |
| JPWO2023218876A5 JPWO2023218876A5 (https=) | 2025-01-10 |
Family
ID=88730271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024520328A Pending JPWO2023218876A1 (https=) | 2022-05-13 | 2023-04-18 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023218876A1 (https=) |
| WO (1) | WO2023218876A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118440295B (zh) * | 2024-05-28 | 2025-05-27 | 广东三求光固材料股份有限公司 | 不饱和二元酸改性的碱溶性环氧丙烯酸树脂及其制备方法和应用 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001053890A1 (fr) * | 2000-01-17 | 2001-07-26 | Showa Highpolymer Co., Ltd. | Composition de resine photosensible |
| WO2009025190A1 (ja) * | 2007-08-21 | 2009-02-26 | Nippon Kayaku Kabushiki Kaisha | 反応性カルボキシレート化合物、それを用いた活性エネルギー線硬化型樹脂組成物、およびその用途 |
| JP2009116110A (ja) * | 2007-11-07 | 2009-05-28 | Taiyo Ink Mfg Ltd | 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板 |
| JP2012159657A (ja) * | 2011-01-31 | 2012-08-23 | Asahi Kasei E-Materials Corp | 光硬化型樹脂組成物及びそれを用いたパターン形成された基材の製造方法、並びに該基材を備える電子部品 |
| WO2022107508A1 (ja) * | 2020-11-19 | 2022-05-27 | Dic株式会社 | 酸基を有する（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材 |
-
2023
- 2023-04-18 JP JP2024520328A patent/JPWO2023218876A1/ja active Pending
- 2023-04-18 WO PCT/JP2023/015488 patent/WO2023218876A1/ja not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001053890A1 (fr) * | 2000-01-17 | 2001-07-26 | Showa Highpolymer Co., Ltd. | Composition de resine photosensible |
| WO2009025190A1 (ja) * | 2007-08-21 | 2009-02-26 | Nippon Kayaku Kabushiki Kaisha | 反応性カルボキシレート化合物、それを用いた活性エネルギー線硬化型樹脂組成物、およびその用途 |
| JP2009116110A (ja) * | 2007-11-07 | 2009-05-28 | Taiyo Ink Mfg Ltd | 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板 |
| JP2012159657A (ja) * | 2011-01-31 | 2012-08-23 | Asahi Kasei E-Materials Corp | 光硬化型樹脂組成物及びそれを用いたパターン形成された基材の製造方法、並びに該基材を備える電子部品 |
| WO2022107508A1 (ja) * | 2020-11-19 | 2022-05-27 | Dic株式会社 | 酸基を有する（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023218876A1 (ja) | 2023-11-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
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| A521 | Request for written amendment filed |
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| A621 | Written request for application examination |
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| A131 | Notification of reasons for refusal |
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| A521 | Request for written amendment filed |
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