JPWO2023190107A1 - - Google Patents
Info
- Publication number
- JPWO2023190107A1 JPWO2023190107A1 JP2024512317A JP2024512317A JPWO2023190107A1 JP WO2023190107 A1 JPWO2023190107 A1 JP WO2023190107A1 JP 2024512317 A JP2024512317 A JP 2024512317A JP 2024512317 A JP2024512317 A JP 2024512317A JP WO2023190107 A1 JPWO2023190107 A1 JP WO2023190107A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022060827 | 2022-03-31 | ||
| PCT/JP2023/011708 WO2023190107A1 (ja) | 2022-03-31 | 2023-03-24 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023190107A1 true JPWO2023190107A1 (enrdf_load_stackoverflow) | 2023-10-05 |
Family
ID=88202178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024512317A Pending JPWO2023190107A1 (enrdf_load_stackoverflow) | 2022-03-31 | 2023-03-24 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023190107A1 (enrdf_load_stackoverflow) |
| WO (1) | WO2023190107A1 (enrdf_load_stackoverflow) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9299630B2 (en) * | 2012-07-30 | 2016-03-29 | General Electric Company | Diffusion barrier for surface mount modules |
| US10269688B2 (en) * | 2013-03-14 | 2019-04-23 | General Electric Company | Power overlay structure and method of making same |
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2023
- 2023-03-24 JP JP2024512317A patent/JPWO2023190107A1/ja active Pending
- 2023-03-24 WO PCT/JP2023/011708 patent/WO2023190107A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023190107A1 (ja) | 2023-10-05 |