JPWO2023171553A1 - - Google Patents
Info
- Publication number
- JPWO2023171553A1 JPWO2023171553A1 JP2024506131A JP2024506131A JPWO2023171553A1 JP WO2023171553 A1 JPWO2023171553 A1 JP WO2023171553A1 JP 2024506131 A JP2024506131 A JP 2024506131A JP 2024506131 A JP2024506131 A JP 2024506131A JP WO2023171553 A1 JPWO2023171553 A1 JP WO2023171553A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/36—Amides or imides
- C08F222/40—Imides, e.g. cyclic imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022038645 | 2022-03-11 | ||
| PCT/JP2023/007985 WO2023171553A1 (ja) | 2022-03-11 | 2023-03-03 | 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023171553A1 true JPWO2023171553A1 (https=) | 2023-09-14 |
Family
ID=87935004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024506131A Pending JPWO2023171553A1 (https=) | 2022-03-11 | 2023-03-03 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023171553A1 (https=) |
| KR (1) | KR20240157733A (https=) |
| CN (1) | CN118843649A (https=) |
| TW (1) | TW202342605A (https=) |
| WO (1) | WO2023171553A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024090408A1 (ja) * | 2022-10-26 | 2024-05-02 | 三菱瓦斯化学株式会社 | 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板 |
| KR20250107837A (ko) * | 2022-10-26 | 2025-07-14 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판 |
| WO2025187617A1 (ja) * | 2024-03-08 | 2025-09-12 | 三菱瓦斯化学株式会社 | 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020054601A1 (ja) | 2018-09-12 | 2020-03-19 | 日本化薬株式会社 | マレイミド樹脂、硬化性樹脂組成物およびその硬化物 |
| CN113490596A (zh) * | 2019-02-28 | 2021-10-08 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片及印刷电路板 |
| EP4094940A1 (en) * | 2020-01-24 | 2022-11-30 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, resin sheet, prepreg, and printed wiring board |
| KR102727867B1 (ko) | 2020-03-11 | 2024-11-07 | 닛뽄 가야쿠 가부시키가이샤 | 말레이미드 수지 및 그의 제조 방법, 말레이미드 용액, 그리고, 경화성 수지 조성물 및 그의 경화물 |
| WO2022054867A1 (ja) * | 2020-09-11 | 2022-03-17 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
| TW202233705A (zh) * | 2020-11-12 | 2022-09-01 | 日商味之素股份有限公司 | 樹脂組成物 |
-
2023
- 2023-03-02 TW TW112107454A patent/TW202342605A/zh unknown
- 2023-03-03 KR KR1020247033052A patent/KR20240157733A/ko active Pending
- 2023-03-03 CN CN202380025888.1A patent/CN118843649A/zh active Pending
- 2023-03-03 JP JP2024506131A patent/JPWO2023171553A1/ja active Pending
- 2023-03-03 WO PCT/JP2023/007985 patent/WO2023171553A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN118843649A (zh) | 2024-10-25 |
| WO2023171553A1 (ja) | 2023-09-14 |
| KR20240157733A (ko) | 2024-11-01 |
| TW202342605A (zh) | 2023-11-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260108 |