JPWO2023167302A1 - - Google Patents
Info
- Publication number
- JPWO2023167302A1 JPWO2023167302A1 JP2023548575A JP2023548575A JPWO2023167302A1 JP WO2023167302 A1 JPWO2023167302 A1 JP WO2023167302A1 JP 2023548575 A JP2023548575 A JP 2023548575A JP 2023548575 A JP2023548575 A JP 2023548575A JP WO2023167302 A1 JPWO2023167302 A1 JP WO2023167302A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022033732 | 2022-03-04 | ||
PCT/JP2023/007914 WO2023167302A1 (en) | 2022-03-04 | 2023-03-02 | Method for manufacturing phosphorus-containing-silver-coated copper particles, and phosphorus-containing-silver-coated copper particles |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2023167302A1 true JPWO2023167302A1 (en) | 2023-09-07 |
Family
ID=87883795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023548575A Pending JPWO2023167302A1 (en) | 2022-03-04 | 2023-03-02 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2023167302A1 (en) |
CN (1) | CN118055817A (en) |
TW (1) | TW202402424A (en) |
WO (1) | WO2023167302A1 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06240463A (en) * | 1993-02-22 | 1994-08-30 | Mitsubishi Paper Mills Ltd | Method for electroless-plating fine metal powder with silver |
JP4864195B2 (en) * | 2000-08-30 | 2012-02-01 | 三井金属鉱業株式会社 | Coated copper powder |
CN104321464A (en) * | 2011-12-15 | 2015-01-28 | 汉高知识产权控股有限责任公司 | Selective coating of exposed copper on silver-plated copper |
JP6389091B2 (en) * | 2013-10-01 | 2018-09-12 | Dowaエレクトロニクス株式会社 | Silver-coated copper powder, method for producing the same, and conductive paste |
-
2023
- 2023-03-02 JP JP2023548575A patent/JPWO2023167302A1/ja active Pending
- 2023-03-02 CN CN202380013869.7A patent/CN118055817A/en active Pending
- 2023-03-02 WO PCT/JP2023/007914 patent/WO2023167302A1/en active Application Filing
- 2023-03-03 TW TW112107892A patent/TW202402424A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN118055817A (en) | 2024-05-17 |
TW202402424A (en) | 2024-01-16 |
WO2023167302A1 (en) | 2023-09-07 |
Similar Documents
Legal Events
Date | Code | Title | Description |
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A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230815 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240806 |
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A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240904 |