JPWO2023162161A1 - - Google Patents
Info
- Publication number
- JPWO2023162161A1 JPWO2023162161A1 JP2024502392A JP2024502392A JPWO2023162161A1 JP WO2023162161 A1 JPWO2023162161 A1 JP WO2023162161A1 JP 2024502392 A JP2024502392 A JP 2024502392A JP 2024502392 A JP2024502392 A JP 2024502392A JP WO2023162161 A1 JPWO2023162161 A1 JP WO2023162161A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D3/00—Devices using other cold materials; Devices using cold-storage bodies
- F25D3/10—Devices using other cold materials; Devices using cold-storage bodies using liquefied gases, e.g. liquid air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
- H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
- H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/73—Etching of wafers, substrates or parts of devices using masks for insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0418—Apparatus for fluid treatment for etching
- H10P72/0421—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/002—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2001—Maintaining constant desired temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Drying Of Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/007982 WO2023162161A1 (ja) | 2022-02-25 | 2022-02-25 | 温調システム、温調方法、基板処理方法及び基板処理装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023162161A1 true JPWO2023162161A1 (https=) | 2023-08-31 |
Family
ID=87765101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024502392A Pending JPWO2023162161A1 (https=) | 2022-02-25 | 2022-02-25 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240412955A1 (https=) |
| JP (1) | JPWO2023162161A1 (https=) |
| KR (1) | KR20240153992A (https=) |
| TW (1) | TW202414572A (https=) |
| WO (1) | WO2023162161A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202539010A (zh) * | 2024-02-22 | 2025-10-01 | 日商東京威力科創股份有限公司 | 調溫系統及調溫系統之控制方法 |
| CN121359240A (zh) * | 2024-02-22 | 2026-01-16 | 东京毅力科创株式会社 | 温度调节系统以及温度调节系统的控制方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003139423A (ja) * | 2002-08-12 | 2003-05-14 | Sanyo Electric Co Ltd | 冷媒回路 |
| JP2006269944A (ja) * | 2005-03-25 | 2006-10-05 | Tokyo Electron Ltd | 温度調整方法，温度調整装置，プラズマ処理装置 |
| JP2009523859A (ja) * | 2006-01-13 | 2009-06-25 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | パーフルオロポリエーテルを含有する冷媒添加剤組成物 |
| JP2013544135A (ja) * | 2010-10-27 | 2013-12-12 | クライオメディクス、エルエルシー | 改良された熱交換領域を有する冷凍アブレーション装置及び関連方法 |
| JP2019529982A (ja) * | 2016-09-02 | 2019-10-17 | エーエスエムエル ネザーランズ ビー．ブイ． | リソグラフィ装置 |
| JP2021174985A (ja) * | 2020-04-30 | 2021-11-01 | 東京エレクトロン株式会社 | 基板処理方法、プラズマ処理装置、及びエッチングガス組成物 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003347283A (ja) | 2002-05-30 | 2003-12-05 | Tokyo Electron Ltd | 真空処理装置 |
-
2022
- 2022-02-25 KR KR1020247028191A patent/KR20240153992A/ko active Pending
- 2022-02-25 WO PCT/JP2022/007982 patent/WO2023162161A1/ja not_active Ceased
- 2022-02-25 JP JP2024502392A patent/JPWO2023162161A1/ja active Pending
-
2023
- 2023-02-23 TW TW112106708A patent/TW202414572A/zh unknown
-
2024
- 2024-08-21 US US18/810,862 patent/US20240412955A1/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003139423A (ja) * | 2002-08-12 | 2003-05-14 | Sanyo Electric Co Ltd | 冷媒回路 |
| JP2006269944A (ja) * | 2005-03-25 | 2006-10-05 | Tokyo Electron Ltd | 温度調整方法，温度調整装置，プラズマ処理装置 |
| JP2009523859A (ja) * | 2006-01-13 | 2009-06-25 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | パーフルオロポリエーテルを含有する冷媒添加剤組成物 |
| JP2013544135A (ja) * | 2010-10-27 | 2013-12-12 | クライオメディクス、エルエルシー | 改良された熱交換領域を有する冷凍アブレーション装置及び関連方法 |
| JP2019529982A (ja) * | 2016-09-02 | 2019-10-17 | エーエスエムエル ネザーランズ ビー．ブイ． | リソグラフィ装置 |
| JP2021174985A (ja) * | 2020-04-30 | 2021-11-01 | 東京エレクトロン株式会社 | 基板処理方法、プラズマ処理装置、及びエッチングガス組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202414572A (zh) | 2024-04-01 |
| KR20240153992A (ko) | 2024-10-24 |
| US20240412955A1 (en) | 2024-12-12 |
| WO2023162161A1 (ja) | 2023-08-31 |
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