JPWO2023162077A1 - - Google Patents

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Publication number
JPWO2023162077A1
JPWO2023162077A1 JP2023500379A JP2023500379A JPWO2023162077A1 JP WO2023162077 A1 JPWO2023162077 A1 JP WO2023162077A1 JP 2023500379 A JP2023500379 A JP 2023500379A JP 2023500379 A JP2023500379 A JP 2023500379A JP WO2023162077 A1 JPWO2023162077 A1 JP WO2023162077A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023500379A
Other versions
JP7358679B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023162077A1 publication Critical patent/JPWO2023162077A1/ja
Application granted granted Critical
Publication of JP7358679B1 publication Critical patent/JP7358679B1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0221—Preprocessing measurements, e.g. data collection rate adjustment; Standardization of measurements; Time series or signal analysis, e.g. frequency analysis or wavelets; Trustworthiness of measurements; Indexes therefor; Measurements using easily measured parameters to estimate parameters difficult to measure; Virtual sensor creation; De-noising; Sensor fusion; Unconventional preprocessing inherently present in specific fault detection methods like PCA-based methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/24—Pc safety
    • G05B2219/24069—Diagnostic

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing And Monitoring For Control Systems (AREA)
JP2023500379A 2022-02-24 2022-02-24 診断装置及び診断方法並びに半導体製造装置システム及び半導体装置製造システム Active JP7358679B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/007541 WO2023162077A1 (ja) 2022-02-24 2022-02-24 診断装置及び診断方法並びに半導体製造装置システム及び半導体装置製造システム

Publications (2)

Publication Number Publication Date
JPWO2023162077A1 true JPWO2023162077A1 (ja) 2023-08-31
JP7358679B1 JP7358679B1 (ja) 2023-10-10

Family

ID=87764978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023500379A Active JP7358679B1 (ja) 2022-02-24 2022-02-24 診断装置及び診断方法並びに半導体製造装置システム及び半導体装置製造システム

Country Status (4)

Country Link
JP (1) JP7358679B1 (ja)
KR (1) KR20230129001A (ja)
CN (1) CN116941010A (ja)
WO (1) WO2023162077A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186445A (ja) * 2002-12-03 2004-07-02 Omron Corp モデル化装置及びモデル解析方法並びにプロセス異常検出・分類システム及びプロセス異常検出・分類方法並びにモデル化システム及びモデル化方法並びに故障予知システム及びモデル化装置の更新方法
JP5427107B2 (ja) * 2010-05-20 2014-02-26 株式会社日立製作所 監視診断装置および監視診断方法
JP5501903B2 (ja) * 2010-09-07 2014-05-28 株式会社日立製作所 異常検知方法及びそのシステム
JP6105141B1 (ja) * 2016-09-30 2017-03-29 株式会社日立パワーソリューションズ プリプロセッサおよび診断装置
JP7204584B2 (ja) * 2019-06-14 2023-01-16 ルネサスエレクトロニクス株式会社 異常検知システム、異常検知装置および異常検知方法

Also Published As

Publication number Publication date
TW202334772A (zh) 2023-09-01
CN116941010A (zh) 2023-10-24
JP7358679B1 (ja) 2023-10-10
WO2023162077A1 (ja) 2023-08-31
KR20230129001A (ko) 2023-09-05

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