JPWO2023127729A1 - - Google Patents
Info
- Publication number
- JPWO2023127729A1 JPWO2023127729A1 JP2023535456A JP2023535456A JPWO2023127729A1 JP WO2023127729 A1 JPWO2023127729 A1 JP WO2023127729A1 JP 2023535456 A JP2023535456 A JP 2023535456A JP 2023535456 A JP2023535456 A JP 2023535456A JP WO2023127729 A1 JPWO2023127729 A1 JP WO2023127729A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021213165 | 2021-12-27 | ||
JP2021213165 | 2021-12-27 | ||
PCT/JP2022/047651 WO2023127729A1 (ja) | 2021-12-27 | 2022-12-23 | 窒化ホウ素粒子及び放熱シート |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2023127729A1 true JPWO2023127729A1 (ja) | 2023-07-06 |
JP7357180B1 JP7357180B1 (ja) | 2023-10-05 |
JPWO2023127729A5 JPWO2023127729A5 (ja) | 2023-11-29 |
Family
ID=86999153
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023535456A Active JP7357180B1 (ja) | 2021-12-27 | 2022-12-23 | 窒化ホウ素粒子及び放熱シート |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7357180B1 (ja) |
WO (1) | WO2023127729A1 (ja) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6135817B1 (ja) * | 2016-03-09 | 2017-05-31 | 東洋インキScホールディングス株式会社 | 熱伝導性絶縁シート、およびその製造方法 |
JP6720014B2 (ja) * | 2016-08-03 | 2020-07-08 | デンカ株式会社 | 六方晶窒化ホウ素一次粒子凝集体及び樹脂組成物とその用途 |
JPWO2018139643A1 (ja) * | 2017-01-30 | 2019-11-14 | 積水化学工業株式会社 | 樹脂材料及び積層体 |
JP7063705B2 (ja) * | 2017-04-28 | 2022-05-09 | 積水化学工業株式会社 | 窒化ホウ素粒子の凝集体及び熱硬化性材料 |
CN112334408B (zh) | 2018-06-29 | 2023-10-10 | 电化株式会社 | 块状氮化硼粒子、氮化硼粉末、氮化硼粉末的制造方法、树脂组合物、及散热构件 |
KR20210114506A (ko) * | 2019-01-29 | 2021-09-23 | 덴카 주식회사 | 질화 붕소 분말 및 수지 조성물 |
JPWO2020175377A1 (ja) * | 2019-02-27 | 2021-12-23 | 三菱ケミカル株式会社 | 窒化ホウ素凝集粉末、放熱シート及び半導体デバイス |
JP7378284B2 (ja) * | 2019-12-11 | 2023-11-13 | デンカ株式会社 | 複合粒子を含有する粉体及びその製造方法、並びに、該粉体を含有する樹脂組成物 |
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2022
- 2022-12-23 JP JP2023535456A patent/JP7357180B1/ja active Active
- 2022-12-23 WO PCT/JP2022/047651 patent/WO2023127729A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2023127729A1 (ja) | 2023-07-06 |
JP7357180B1 (ja) | 2023-10-05 |
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