JPWO2023112187A1 - - Google Patents
Info
- Publication number
- JPWO2023112187A1 JPWO2023112187A1 JP2023567372A JP2023567372A JPWO2023112187A1 JP WO2023112187 A1 JPWO2023112187 A1 JP WO2023112187A1 JP 2023567372 A JP2023567372 A JP 2023567372A JP 2023567372 A JP2023567372 A JP 2023567372A JP WO2023112187 A1 JPWO2023112187 A1 JP WO2023112187A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/046201 WO2023112187A1 (en) | 2021-12-15 | 2021-12-15 | Component mounting system, component mounting device, component mounting method, program, and recording medium |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2023112187A1 true JPWO2023112187A1 (en) | 2023-06-22 |
Family
ID=86773778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023567372A Pending JPWO2023112187A1 (en) | 2021-12-15 | 2021-12-15 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2023112187A1 (en) |
WO (1) | WO2023112187A1 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04348853A (en) * | 1991-05-24 | 1992-12-03 | Fujitsu Ltd | Production control system |
JP5793434B2 (en) * | 2012-01-16 | 2015-10-14 | ヤマハ発動機株式会社 | Component mounting apparatus, component mounting substrate production method, and component mounting system |
WO2018131136A1 (en) * | 2017-01-13 | 2018-07-19 | 株式会社Fuji | Manufacturing management device |
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2021
- 2021-12-15 JP JP2023567372A patent/JPWO2023112187A1/ja active Pending
- 2021-12-15 WO PCT/JP2021/046201 patent/WO2023112187A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2023112187A1 (en) | 2023-06-22 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240219 |