JPWO2023095921A1 - - Google Patents
Info
- Publication number
- JPWO2023095921A1 JPWO2023095921A1 JP2023563781A JP2023563781A JPWO2023095921A1 JP WO2023095921 A1 JPWO2023095921 A1 JP WO2023095921A1 JP 2023563781 A JP2023563781 A JP 2023563781A JP 2023563781 A JP2023563781 A JP 2023563781A JP WO2023095921 A1 JPWO2023095921 A1 JP WO2023095921A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021193267 | 2021-11-29 | ||
| PCT/JP2022/043939 WO2023095921A1 (ja) | 2021-11-29 | 2022-11-29 | 配線体、及び表示装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023095921A1 true JPWO2023095921A1 (https=) | 2023-06-01 |
Family
ID=86539748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023563781A Withdrawn JPWO2023095921A1 (https=) | 2021-11-29 | 2022-11-29 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250151197A1 (https=) |
| JP (1) | JPWO2023095921A1 (https=) |
| CN (1) | CN118318503A (https=) |
| WO (1) | WO2023095921A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5479073B2 (ja) * | 2009-12-21 | 2014-04-23 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| KR101656452B1 (ko) * | 2013-09-06 | 2016-09-09 | 주식회사 잉크테크 | 전도성 패턴 형성 방법 및 전도성 패턴 |
| KR102158193B1 (ko) * | 2018-03-06 | 2020-09-22 | 동우 화인켐 주식회사 | 필름 안테나 및 이를 포함하는 디스플레이 장치 |
-
2022
- 2022-11-29 JP JP2023563781A patent/JPWO2023095921A1/ja not_active Withdrawn
- 2022-11-29 CN CN202280078722.1A patent/CN118318503A/zh active Pending
- 2022-11-29 WO PCT/JP2022/043939 patent/WO2023095921A1/ja not_active Ceased
- 2022-11-29 US US18/713,870 patent/US20250151197A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20250151197A1 (en) | 2025-05-08 |
| CN118318503A (zh) | 2024-07-09 |
| WO2023095921A1 (ja) | 2023-06-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250807 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20260310 |