JPWO2023090240A1 - - Google Patents
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- Publication number
- JPWO2023090240A1 JPWO2023090240A1 JP2023512336A JP2023512336A JPWO2023090240A1 JP WO2023090240 A1 JPWO2023090240 A1 JP WO2023090240A1 JP 2023512336 A JP2023512336 A JP 2023512336A JP 2023512336 A JP2023512336 A JP 2023512336A JP WO2023090240 A1 JPWO2023090240 A1 JP WO2023090240A1
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- JP
- Japan
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Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021186954 | 2021-11-17 | ||
JP2021186954 | 2021-11-17 | ||
PCT/JP2022/041845 WO2023090240A1 (ja) | 2021-11-17 | 2022-11-10 | 放熱グリース |
Publications (3)
Publication Number | Publication Date |
---|---|
JP7262699B1 JP7262699B1 (ja) | 2023-04-21 |
JPWO2023090240A1 true JPWO2023090240A1 (ja) | 2023-05-25 |
JPWO2023090240A5 JPWO2023090240A5 (ja) | 2023-10-24 |
Family
ID=86052920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023512336A Active JP7262699B1 (ja) | 2021-11-17 | 2022-11-10 | 放熱グリース |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP7262699B1 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000114438A (ja) * | 1998-09-30 | 2000-04-21 | Shin Etsu Chem Co Ltd | 半導体装置 |
US7445797B2 (en) * | 2005-03-14 | 2008-11-04 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and polymer-based compositions made therewith |
JP2003027080A (ja) * | 2001-07-11 | 2003-01-29 | Hitachi Ltd | 熱伝導性グリース、その実装方法、電子部品の冷却方法、電子装置及び情報処理装置 |
EP1797155B1 (en) * | 2004-08-23 | 2015-10-07 | General Electric Company | Thermally conductive composition and method for preparing the same |
CN104053759A (zh) * | 2011-10-07 | 2014-09-17 | 3M创新有限公司 | 具有低耐热性的热油脂 |
JP2016162929A (ja) * | 2015-03-03 | 2016-09-05 | 株式会社デンソー | 放熱グリス、及びこれを用いた半導体冷却構造 |
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2022
- 2022-11-10 JP JP2023512336A patent/JP7262699B1/ja active Active
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Publication number | Publication date |
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JP7262699B1 (ja) | 2023-04-21 |
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