JPWO2023084878A1 - - Google Patents
Info
- Publication number
- JPWO2023084878A1 JPWO2023084878A1 JP2023559439A JP2023559439A JPWO2023084878A1 JP WO2023084878 A1 JPWO2023084878 A1 JP WO2023084878A1 JP 2023559439 A JP2023559439 A JP 2023559439A JP 2023559439 A JP2023559439 A JP 2023559439A JP WO2023084878 A1 JPWO2023084878 A1 JP WO2023084878A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021182604 | 2021-11-09 | ||
| PCT/JP2022/032712 WO2023084878A1 (ja) | 2021-11-09 | 2022-08-31 | 電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023084878A1 true JPWO2023084878A1 (https=) | 2023-05-19 |
| JPWO2023084878A5 JPWO2023084878A5 (https=) | 2024-07-05 |
Family
ID=86335536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023559439A Pending JPWO2023084878A1 (https=) | 2021-11-09 | 2022-08-31 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023084878A1 (https=) |
| CN (1) | CN117897785A (https=) |
| WO (1) | WO2023084878A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121399708A (zh) * | 2023-11-22 | 2026-01-23 | 株式会社村田制作所 | 层叠陶瓷电容器 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010027804A (ja) * | 2008-07-17 | 2010-02-04 | Tdk Corp | 積層チップバリスタおよびその製造方法 |
| JP2010080703A (ja) * | 2008-09-26 | 2010-04-08 | Tdk Corp | セラミック積層電子部品およびその製造方法 |
| JP2017195309A (ja) * | 2016-04-21 | 2017-10-26 | Tdk株式会社 | 積層コイル部品 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4428852B2 (ja) * | 2000-11-29 | 2010-03-10 | 京セラ株式会社 | 積層型電子部品およびその製法 |
| JP5773726B2 (ja) * | 2011-04-25 | 2015-09-02 | 京セラ株式会社 | 積層セラミックコンデンサ |
| JP6914617B2 (ja) * | 2016-05-11 | 2021-08-04 | Tdk株式会社 | 積層コイル部品 |
-
2022
- 2022-08-31 WO PCT/JP2022/032712 patent/WO2023084878A1/ja not_active Ceased
- 2022-08-31 JP JP2023559439A patent/JPWO2023084878A1/ja active Pending
- 2022-08-31 CN CN202280059582.3A patent/CN117897785A/zh not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010027804A (ja) * | 2008-07-17 | 2010-02-04 | Tdk Corp | 積層チップバリスタおよびその製造方法 |
| JP2010080703A (ja) * | 2008-09-26 | 2010-04-08 | Tdk Corp | セラミック積層電子部品およびその製造方法 |
| JP2017195309A (ja) * | 2016-04-21 | 2017-10-26 | Tdk株式会社 | 積層コイル部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023084878A1 (ja) | 2023-05-19 |
| CN117897785A (zh) | 2024-04-16 |
Similar Documents
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