JPWO2023080007A1 - - Google Patents
Info
- Publication number
- JPWO2023080007A1 JPWO2023080007A1 JP2022567495A JP2022567495A JPWO2023080007A1 JP WO2023080007 A1 JPWO2023080007 A1 JP WO2023080007A1 JP 2022567495 A JP2022567495 A JP 2022567495A JP 2022567495 A JP2022567495 A JP 2022567495A JP WO2023080007 A1 JPWO2023080007 A1 JP WO2023080007A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
- C08G73/1017—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)amine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021179173 | 2021-11-02 | ||
| JP2022119326 | 2022-07-27 | ||
| PCT/JP2022/039608 WO2023080007A1 (ja) | 2021-11-02 | 2022-10-25 | ポリイミドの製造方法、ポリイミド、ポリイミド樹脂組成物およびその硬化物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023080007A1 true JPWO2023080007A1 (https=) | 2023-05-11 |
| JPWO2023080007A5 JPWO2023080007A5 (https=) | 2025-10-10 |
Family
ID=86240986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022567495A Pending JPWO2023080007A1 (https=) | 2021-11-02 | 2022-10-25 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2023080007A1 (https=) |
| KR (1) | KR20240095156A (https=) |
| TW (1) | TW202336091A (https=) |
| WO (1) | WO2023080007A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117806123B (zh) * | 2024-02-29 | 2024-05-31 | 明士(北京)新材料开发有限公司 | 一种化学增幅型负性光敏聚酰亚胺组合物及其应用 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4617144B1 (https=) * | 1968-08-11 | 1971-05-12 | ||
| AUPO830697A0 (en) | 1997-07-30 | 1997-08-21 | Commonwealth Scientific And Industrial Research Organisation | Aqueous polyimide process |
| JP2001181389A (ja) * | 1999-12-28 | 2001-07-03 | Mitsui Chemicals Inc | 熱可塑性ポリイミドの製造方法 |
| JP2001270945A (ja) * | 2000-03-24 | 2001-10-02 | Mitsui Chemicals Inc | ポリイミドの製造方法 |
| KR101299651B1 (ko) * | 2010-07-14 | 2013-08-23 | 주식회사 엘지화학 | 저온 경화가 가능한 폴리이미드 수지 및 이의 제조 방법 |
| US9695284B2 (en) | 2013-05-17 | 2017-07-04 | Fujifilm Electronic Materials U.S.A., Inc. | Polymer and thermosetting composition containing same |
| JP2015098573A (ja) | 2013-10-18 | 2015-05-28 | 株式会社Kri | 高結晶ポリイミド微粒子およびその製造方法 |
| AT517146A2 (de) | 2015-05-13 | 2016-11-15 | Univ Wien Tech | Verfahren zur Herstellung von kristallinen Polyimiden |
| AT519038B1 (de) * | 2016-08-19 | 2018-11-15 | Univ Wien Tech | Herstellungsverfahren für Polyimide |
| CN108948352A (zh) * | 2018-07-18 | 2018-12-07 | 上海三普水相材料科技有限公司 | 一种制备聚酰亚胺的方法 |
-
2022
- 2022-10-25 KR KR1020247005059A patent/KR20240095156A/ko active Pending
- 2022-10-25 WO PCT/JP2022/039608 patent/WO2023080007A1/ja not_active Ceased
- 2022-10-25 JP JP2022567495A patent/JPWO2023080007A1/ja active Pending
- 2022-10-27 TW TW111140769A patent/TW202336091A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023080007A1 (ja) | 2023-05-11 |
| KR20240095156A (ko) | 2024-06-25 |
| TW202336091A (zh) | 2023-09-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251002 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251002 |