JPWO2023079908A1 - - Google Patents
Info
- Publication number
- JPWO2023079908A1 JPWO2023079908A1 JP2023557911A JP2023557911A JPWO2023079908A1 JP WO2023079908 A1 JPWO2023079908 A1 JP WO2023079908A1 JP 2023557911 A JP2023557911 A JP 2023557911A JP 2023557911 A JP2023557911 A JP 2023557911A JP WO2023079908 A1 JPWO2023079908 A1 JP WO2023079908A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021179579 | 2021-11-02 | ||
| PCT/JP2022/037834 WO2023079908A1 (ja) | 2021-11-02 | 2022-10-11 | エッチング液、エッチング方法、半導体デバイスの製造方法及びゲートオールアラウンド型トランジスタの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023079908A1 true JPWO2023079908A1 (ja) | 2023-05-11 |
Family
ID=86241313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023557911A Pending JPWO2023079908A1 (ja) | 2021-11-02 | 2022-10-11 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023079908A1 (ja) |
| TW (1) | TW202336213A (ja) |
| WO (1) | WO2023079908A1 (ja) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7994062B2 (en) * | 2009-10-30 | 2011-08-09 | Sachem, Inc. | Selective silicon etch process |
| US8637405B2 (en) * | 2011-06-21 | 2014-01-28 | International Business Machines Corporation | Silicon surface texturing method for reducing surface reflectance |
| US10934485B2 (en) * | 2017-08-25 | 2021-03-02 | Versum Materials Us, Llc | Etching solution for selectively removing silicon over silicon-germanium alloy from a silicon-germanium/ silicon stack during manufacture of a semiconductor device |
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2022
- 2022-10-11 JP JP2023557911A patent/JPWO2023079908A1/ja active Pending
- 2022-10-11 WO PCT/JP2022/037834 patent/WO2023079908A1/ja active Application Filing
- 2022-10-18 TW TW111139444A patent/TW202336213A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023079908A1 (ja) | 2023-05-11 |
| TW202336213A (zh) | 2023-09-16 |