JPWO2023079876A1 - - Google Patents
Info
- Publication number
- JPWO2023079876A1 JPWO2023079876A1 JP2023557897A JP2023557897A JPWO2023079876A1 JP WO2023079876 A1 JPWO2023079876 A1 JP WO2023079876A1 JP 2023557897 A JP2023557897 A JP 2023557897A JP 2023557897 A JP2023557897 A JP 2023557897A JP WO2023079876 A1 JPWO2023079876 A1 JP WO2023079876A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/032—Housing; Enclosing; Embedding; Filling the housing or enclosure plural layers surrounding the resistive element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
- H01C1/142—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
- H01C1/148—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/23—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by opening or closing resistor geometric tracks of predetermined resistive values, e.g. snapistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Non-Adjustable Resistors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021179474 | 2021-11-02 | ||
| JP2021179473 | 2021-11-02 | ||
| JP2021188124 | 2021-11-18 | ||
| PCT/JP2022/036708 WO2023079876A1 (ja) | 2021-11-02 | 2022-09-30 | チップ抵抗器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023079876A1 true JPWO2023079876A1 (https=) | 2023-05-11 |
| JPWO2023079876A5 JPWO2023079876A5 (https=) | 2025-10-01 |
Family
ID=86241446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023557897A Pending JPWO2023079876A1 (https=) | 2021-11-02 | 2022-09-30 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20240257998A1 (https=) |
| JP (1) | JPWO2023079876A1 (https=) |
| WO (1) | WO2023079876A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119943512B (zh) * | 2023-11-02 | 2025-11-28 | 国巨股份有限公司 | 高功率薄膜电阻及其制造方法 |
| CN119943514A (zh) * | 2023-11-02 | 2025-05-06 | 国巨股份有限公司 | 高功率晶片电阻及其制造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4699311B2 (ja) * | 2006-08-22 | 2011-06-08 | 太陽社電気株式会社 | チップ抵抗器 |
| JP2015079872A (ja) * | 2013-10-17 | 2015-04-23 | コーア株式会社 | チップ抵抗器 |
| DE112018005181B4 (de) * | 2017-11-02 | 2025-04-10 | Rohm Co., Ltd. | Chip-widerstand |
| JP7336636B2 (ja) * | 2017-12-11 | 2023-09-01 | パナソニックIpマネジメント株式会社 | チップ抵抗器 |
-
2022
- 2022-09-30 WO PCT/JP2022/036708 patent/WO2023079876A1/ja not_active Ceased
- 2022-09-30 JP JP2023557897A patent/JPWO2023079876A1/ja active Pending
-
2024
- 2024-04-08 US US18/629,453 patent/US20240257998A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023079876A1 (ja) | 2023-05-11 |
| US20240257998A1 (en) | 2024-08-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240409 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250922 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250922 |