JPWO2023073840A1 - - Google Patents

Info

Publication number
JPWO2023073840A1
JPWO2023073840A1 JP2023555960A JP2023555960A JPWO2023073840A1 JP WO2023073840 A1 JPWO2023073840 A1 JP WO2023073840A1 JP 2023555960 A JP2023555960 A JP 2023555960A JP 2023555960 A JP2023555960 A JP 2023555960A JP WO2023073840 A1 JPWO2023073840 A1 JP WO2023073840A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023555960A
Other languages
Japanese (ja)
Other versions
JP7571311B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023073840A1 publication Critical patent/JPWO2023073840A1/ja
Application granted granted Critical
Publication of JP7571311B2 publication Critical patent/JP7571311B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2023555960A 2021-10-27 2021-10-27 電気特性測定装置、部品実装装置および電気特性測定方法 Active JP7571311B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/039706 WO2023073840A1 (ja) 2021-10-27 2021-10-27 電気特性測定装置、部品実装装置および電気特性測定方法

Publications (2)

Publication Number Publication Date
JPWO2023073840A1 true JPWO2023073840A1 (de) 2023-05-04
JP7571311B2 JP7571311B2 (ja) 2024-10-22

Family

ID=86159242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023555960A Active JP7571311B2 (ja) 2021-10-27 2021-10-27 電気特性測定装置、部品実装装置および電気特性測定方法

Country Status (3)

Country Link
JP (1) JP7571311B2 (de)
CN (1) CN118120347A (de)
WO (1) WO2023073840A1 (de)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105075422B (zh) 2013-03-29 2018-03-27 富士机械制造株式会社 电子元件安装机及计测方法
JP6774902B2 (ja) * 2017-03-31 2020-10-28 ヤマハ発動機株式会社 部品実装装置
JP7084713B2 (ja) * 2017-11-28 2022-06-15 株式会社Fuji 部品廃棄ボックス自動交換システム。
JP7142209B2 (ja) * 2018-10-15 2022-09-27 パナソニックＩｐマネジメント株式会社 特性計測装置、部品実装装置、特性計測方法および部品実装方法

Also Published As

Publication number Publication date
WO2023073840A1 (ja) 2023-05-04
JP7571311B2 (ja) 2024-10-22
CN118120347A (zh) 2024-05-31

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