JPWO2023058504A1 - - Google Patents
Info
- Publication number
- JPWO2023058504A1 JPWO2023058504A1 JP2023552818A JP2023552818A JPWO2023058504A1 JP WO2023058504 A1 JPWO2023058504 A1 JP WO2023058504A1 JP 2023552818 A JP2023552818 A JP 2023552818A JP 2023552818 A JP2023552818 A JP 2023552818A JP WO2023058504 A1 JPWO2023058504 A1 JP WO2023058504A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/02—Simple or compound lenses with non-spherical faces
- G02B3/08—Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Lenses (AREA)
- Optical Head (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021163512 | 2021-10-04 | ||
PCT/JP2022/035965 WO2023058504A1 (ja) | 2021-10-04 | 2022-09-27 | ビーム整形器 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2023058504A1 true JPWO2023058504A1 (ja) | 2023-04-13 |
Family
ID=85804273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023552818A Pending JPWO2023058504A1 (ja) | 2021-10-04 | 2022-09-27 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2023058504A1 (ja) |
CN (1) | CN118176079A (ja) |
WO (1) | WO2023058504A1 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3057110B2 (ja) * | 1991-09-11 | 2000-06-26 | リコー光学株式会社 | レーザー加工用マスク照射装置 |
JP4754703B2 (ja) * | 2001-03-22 | 2011-08-24 | 株式会社Ihi | 照明光学系及びこれを備えるレーザー処理装置 |
DE112016002870T5 (de) * | 2015-06-23 | 2018-03-15 | Bien Chann | Optische Elementanordnungen zum Verändern des Strahlparameterprodukts in Laserabgabesystemen |
CN209417434U (zh) * | 2018-07-01 | 2019-09-20 | 苏州视信威智能系统有限公司 | 一种产生双环聚焦光束的光学系统 |
JP6923570B2 (ja) | 2019-01-23 | 2021-08-18 | 株式会社アマダ | レーザ加工装置及びレーザ加工ヘッド |
JP2021163512A (ja) | 2020-03-31 | 2021-10-11 | キオクシア株式会社 | メモリシステムおよび情報処理システム |
CN213257671U (zh) * | 2020-05-29 | 2021-05-25 | 方笑尘 | 形成点环光斑的光学系统 |
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2022
- 2022-09-27 JP JP2023552818A patent/JPWO2023058504A1/ja active Pending
- 2022-09-27 WO PCT/JP2022/035965 patent/WO2023058504A1/ja active Application Filing
- 2022-09-27 CN CN202280066964.9A patent/CN118176079A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN118176079A (zh) | 2024-06-11 |
TW202316169A (zh) | 2023-04-16 |
WO2023058504A1 (ja) | 2023-04-13 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240328 |