JPWO2023054523A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2023054523A5 JPWO2023054523A5 JP2023551806A JP2023551806A JPWO2023054523A5 JP WO2023054523 A5 JPWO2023054523 A5 JP WO2023054523A5 JP 2023551806 A JP2023551806 A JP 2023551806A JP 2023551806 A JP2023551806 A JP 2023551806A JP WO2023054523 A5 JPWO2023054523 A5 JP WO2023054523A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- photosensitive resin
- composition according
- epoxy resin
- type epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims 9
- 239000003822 epoxy resin Substances 0.000 claims 7
- 229920000647 polyepoxide Polymers 0.000 claims 7
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 235000010290 biphenyl Nutrition 0.000 claims 3
- 239000004305 biphenyl Substances 0.000 claims 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 3
- 239000000178 monomer Substances 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 239000000454 talc Substances 0.000 claims 2
- 229910052623 talc Inorganic materials 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- WBODDOZXDKQEFS-UHFFFAOYSA-N 1,2,3,4-tetramethyl-5-phenylbenzene Chemical group CC1=C(C)C(C)=CC(C=2C=CC=CC=2)=C1C WBODDOZXDKQEFS-UHFFFAOYSA-N 0.000 claims 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- VYGUBTIWNBFFMQ-UHFFFAOYSA-N [N+](#[C-])N1C(=O)NC=2NC(=O)NC2C1=O Chemical group [N+](#[C-])N1C(=O)NC=2NC(=O)NC2C1=O VYGUBTIWNBFFMQ-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229930003836 cresol Natural products 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 229920003986 novolac Polymers 0.000 claims 1
Claims (9)
前記光重合性モノマーが、イソシアヌル環を有する（メタ）アクリレートを含み、
前記熱硬化性成分が、ビフェニル型エポキシ樹脂、および、重量平均分子量が５００以下のビスフェノールＡ型エポキシ樹脂を含む、
ことを特徴とする、感光性樹脂組成物。 A photosensitive resin composition comprising a carboxyl group-containing resin, a photopolymerizable monomer, and a thermosetting component,
The photopolymerizable monomer includes a (meth)acrylate having an isocyanuric ring,
The thermosetting component includes a biphenyl type epoxy resin and a bisphenol A type epoxy resin having a weight average molecular weight of 500 or less .
A photosensitive resin composition characterized by:
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021159246 | 2021-09-29 | ||
| JP2021159246 | 2021-09-29 | ||
| PCT/JP2022/036285 WO2023054523A1 (en) | 2021-09-29 | 2022-09-28 | Photosensitive resin composition, dry film, cured product and printed wiring board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023054523A1 JPWO2023054523A1 (en) | 2023-04-06 |
| JPWO2023054523A5 true JPWO2023054523A5 (en) | 2024-01-19 |
| JP7445095B2 JP7445095B2 (en) | 2024-03-06 |
Family
ID=85780707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023551806A Active JP7445095B2 (en) | 2021-09-29 | 2022-09-28 | Photosensitive resin compositions, dry films, cured products, and printed wiring boards |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7445095B2 (en) |
| CN (1) | CN117999516A (en) |
| WO (1) | WO2023054523A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3876709B2 (en) | 2001-12-25 | 2007-02-07 | 三菱電機株式会社 | Liquid thermosetting resin composition, liquid thermosetting resin composition manufacturing method, and insulating coil manufacturing method |
| JP4562761B2 (en) | 2007-09-21 | 2010-10-13 | 日本化薬株式会社 | Novel unsaturated group-containing polycarboxylic acid resin, resin composition and cured product thereof |
| WO2009147938A1 (en) | 2008-06-02 | 2009-12-10 | 株式会社カネカ | Novel resin composition and use thereof |
| KR20180042841A (en) | 2015-08-17 | 2018-04-26 | 히타치가세이가부시끼가이샤 | Composite material, photosensitive resin composition for solder resist and photosensitive element |
| JP6759323B2 (en) | 2018-03-28 | 2020-09-23 | 太陽インキ製造株式会社 | Photosensitive resin composition, two-component photosensitive resin composition, dry film and printed wiring board |
-
2022
- 2022-09-28 JP JP2023551806A patent/JP7445095B2/en active Active
- 2022-09-28 CN CN202280064998.4A patent/CN117999516A/en active Pending
- 2022-09-28 WO PCT/JP2022/036285 patent/WO2023054523A1/en active Application Filing
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6210060B2 (en) | Photosensitive resin composition, photosensitive film, permanent mask resist and method for producing permanent mask resist | |
| JP2004508965A5 (en) | ||
| JP2008111092A5 (en) | ||
| CN109073969A (en) | Hardening resin composition, dry film, solidfied material and printed circuit board | |
| JP6811416B2 (en) | Resin composition for solder resist, film for solder resist, circuit board with solder resist layer, and package | |
| JP2023118726A5 (en) | ||
| JP2021001337A5 (en) | ||
| US20030064305A1 (en) | Photosensitive resin composition and printed wiring board | |
| JP6851009B2 (en) | Resin composition for solder resist, film for solder resist, circuit board and package with solder resist layer | |
| JPH09136931A (en) | Polymer fine particle dispersion type radical-polymerizable resin composition | |
| JPWO2023054523A5 (en) | ||
| TWI305868B (en) | ||
| JP3673967B2 (en) | Photosensitive resin composition and printed wiring board | |
| JP2013251369A (en) | Semiconductor device manufacturing method, thermosetting resin composition used therefor and semiconductor device obtained thereby | |
| JP2000104033A (en) | Inter layer insulation adhesive for multi-layer printed wiring board and preparation of multi-layer printed- wiring board | |
| JPWO2022202427A5 (en) | ||
| JP2019185026A5 (en) | ||
| JP4715877B2 (en) | Photosensitive organic / inorganic composite material and semiconductor device using the same | |
| JP4026036B2 (en) | Resin composition curable by heat or light, and film and laminate using the same | |
| JP4202171B2 (en) | Low dielectric photocurable resin composition | |
| JP7019900B2 (en) | Insulation resin sheet and printed circuit board equipped with it | |
| JP4189699B2 (en) | Additive adhesive for printed wiring board and printed wiring board using the same | |
| JP2540846B2 (en) | Solder resistant protection material | |
| JP2024039899A5 (en) | ||
| WO2023190811A1 (en) | Photosensitive multilayer resin film, printed wiring board, semiconductor package, and printed wiring board manufacturing method |