JPWO2023054381A1 - - Google Patents
Info
- Publication number
- JPWO2023054381A1 JPWO2023054381A1 JP2023512116A JP2023512116A JPWO2023054381A1 JP WO2023054381 A1 JPWO2023054381 A1 JP WO2023054381A1 JP 2023512116 A JP2023512116 A JP 2023512116A JP 2023512116 A JP2023512116 A JP 2023512116A JP WO2023054381 A1 JPWO2023054381 A1 JP WO2023054381A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023172515A JP2024012299A (ja) | 2021-09-30 | 2023-10-04 | 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび光デバイス |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021161640 | 2021-09-30 | ||
PCT/JP2022/035981 WO2023054381A1 (ja) | 2021-09-30 | 2022-09-27 | 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび光デバイス |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023172515A Division JP2024012299A (ja) | 2021-09-30 | 2023-10-04 | 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび光デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2023054381A1 true JPWO2023054381A1 (ja) | 2023-04-06 |
JPWO2023054381A5 JPWO2023054381A5 (ja) | 2023-09-06 |
Family
ID=85782748
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023512116A Pending JPWO2023054381A1 (ja) | 2021-09-30 | 2022-09-27 | |
JP2023172515A Pending JP2024012299A (ja) | 2021-09-30 | 2023-10-04 | 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび光デバイス |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023172515A Pending JP2024012299A (ja) | 2021-09-30 | 2023-10-04 | 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび光デバイス |
Country Status (3)
Country | Link |
---|---|
JP (2) | JPWO2023054381A1 (ja) |
TW (1) | TW202330724A (ja) |
WO (1) | WO2023054381A1 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5640864B2 (ja) * | 2011-03-31 | 2014-12-17 | 日本ゼオン株式会社 | ネガ型感光性樹脂組成物および電子部品 |
JP6380723B1 (ja) * | 2017-02-15 | 2018-08-29 | 三菱ケミカル株式会社 | 感光性着色組成物、硬化物、着色スペーサー、画像表示装置 |
JP2018203959A (ja) * | 2017-06-09 | 2018-12-27 | 日鉄ケミカル&マテリアル株式会社 | ポリイミド及び感光性樹脂組成物 |
JP6984322B2 (ja) * | 2017-11-01 | 2021-12-17 | 東レ株式会社 | 光重合性モノマー、それを用いた感光性樹脂組成物および感光性樹脂組成物の硬化膜 |
WO2020203790A1 (ja) * | 2019-03-29 | 2020-10-08 | 太陽インキ製造株式会社 | フォトレジスト組成物およびその硬化物 |
JP2021148891A (ja) * | 2020-03-18 | 2021-09-27 | 東レ株式会社 | 感光性樹脂組成物、硬化膜、表示装置及び硬化膜の製造方法 |
-
2022
- 2022-09-27 JP JP2023512116A patent/JPWO2023054381A1/ja active Pending
- 2022-09-27 WO PCT/JP2022/035981 patent/WO2023054381A1/ja active Application Filing
- 2022-09-29 TW TW111136983A patent/TW202330724A/zh unknown
-
2023
- 2023-10-04 JP JP2023172515A patent/JP2024012299A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2023054381A1 (ja) | 2023-04-06 |
TW202330724A (zh) | 2023-08-01 |
JP2024012299A (ja) | 2024-01-30 |
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