JPWO2023054381A1 - - Google Patents

Info

Publication number
JPWO2023054381A1
JPWO2023054381A1 JP2023512116A JP2023512116A JPWO2023054381A1 JP WO2023054381 A1 JPWO2023054381 A1 JP WO2023054381A1 JP 2023512116 A JP2023512116 A JP 2023512116A JP 2023512116 A JP2023512116 A JP 2023512116A JP WO2023054381 A1 JPWO2023054381 A1 JP WO2023054381A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023512116A
Other versions
JPWO2023054381A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023054381A1 publication Critical patent/JPWO2023054381A1/ja
Publication of JPWO2023054381A5 publication Critical patent/JPWO2023054381A5/ja
Priority to JP2023172515A priority Critical patent/JP2024012299A/ja
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
JP2023512116A 2021-09-30 2022-09-27 Pending JPWO2023054381A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023172515A JP2024012299A (ja) 2021-09-30 2023-10-04 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび光デバイス

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021161640 2021-09-30
PCT/JP2022/035981 WO2023054381A1 (ja) 2021-09-30 2022-09-27 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび光デバイス

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023172515A Division JP2024012299A (ja) 2021-09-30 2023-10-04 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび光デバイス

Publications (2)

Publication Number Publication Date
JPWO2023054381A1 true JPWO2023054381A1 (ja) 2023-04-06
JPWO2023054381A5 JPWO2023054381A5 (ja) 2023-09-06

Family

ID=85782748

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023512116A Pending JPWO2023054381A1 (ja) 2021-09-30 2022-09-27
JP2023172515A Pending JP2024012299A (ja) 2021-09-30 2023-10-04 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび光デバイス

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023172515A Pending JP2024012299A (ja) 2021-09-30 2023-10-04 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび光デバイス

Country Status (3)

Country Link
JP (2) JPWO2023054381A1 (ja)
TW (1) TW202330724A (ja)
WO (1) WO2023054381A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5640864B2 (ja) * 2011-03-31 2014-12-17 日本ゼオン株式会社 ネガ型感光性樹脂組成物および電子部品
JP6380723B1 (ja) * 2017-02-15 2018-08-29 三菱ケミカル株式会社 感光性着色組成物、硬化物、着色スペーサー、画像表示装置
JP2018203959A (ja) * 2017-06-09 2018-12-27 日鉄ケミカル&マテリアル株式会社 ポリイミド及び感光性樹脂組成物
JP6984322B2 (ja) * 2017-11-01 2021-12-17 東レ株式会社 光重合性モノマー、それを用いた感光性樹脂組成物および感光性樹脂組成物の硬化膜
WO2020203790A1 (ja) * 2019-03-29 2020-10-08 太陽インキ製造株式会社 フォトレジスト組成物およびその硬化物
JP2021148891A (ja) * 2020-03-18 2021-09-27 東レ株式会社 感光性樹脂組成物、硬化膜、表示装置及び硬化膜の製造方法

Also Published As

Publication number Publication date
WO2023054381A1 (ja) 2023-04-06
TW202330724A (zh) 2023-08-01
JP2024012299A (ja) 2024-01-30

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