JPWO2023053182A1 - - Google Patents

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Publication number
JPWO2023053182A1
JPWO2023053182A1 JP2022515042A JP2022515042A JPWO2023053182A1 JP WO2023053182 A1 JPWO2023053182 A1 JP WO2023053182A1 JP 2022515042 A JP2022515042 A JP 2022515042A JP 2022515042 A JP2022515042 A JP 2022515042A JP WO2023053182 A1 JPWO2023053182 A1 JP WO2023053182A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022515042A
Other languages
Japanese (ja)
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JP7090834B1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JP7090834B1 publication Critical patent/JP7090834B1/en
Publication of JPWO2023053182A1 publication Critical patent/JPWO2023053182A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
JP2022515042A 2021-09-28 2021-09-28 Plating equipment Active JP7090834B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/035586 WO2023053182A1 (en) 2021-09-28 2021-09-28 Plating apparatus

Publications (2)

Publication Number Publication Date
JP7090834B1 JP7090834B1 (en) 2022-06-27
JPWO2023053182A1 true JPWO2023053182A1 (en) 2023-04-06

Family

ID=82163662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022515042A Active JP7090834B1 (en) 2021-09-28 2021-09-28 Plating equipment

Country Status (4)

Country Link
JP (1) JP7090834B1 (en)
KR (1) KR102494899B1 (en)
CN (1) CN115135814B (en)
WO (1) WO2023053182A1 (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09279392A (en) * 1996-04-11 1997-10-28 Nippon Steel Corp Continuous electroplating device for metallic strip
US8475636B2 (en) * 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
JP2004047788A (en) * 2002-07-12 2004-02-12 Fujikura Ltd Method of manufacturing semiconductor device and apparatus for manufacturing semiconductor
KR20070041227A (en) * 2005-10-14 2007-04-18 삼성코닝 주식회사 Jig for electroplating and electroplating equipments comprising the same
US7901550B2 (en) * 2007-10-15 2011-03-08 Ebara Corporation Plating apparatus
JP7256708B2 (en) * 2019-07-09 2023-04-12 株式会社荏原製作所 Plating equipment
CN112430842A (en) * 2020-12-02 2021-03-02 北航（四川）西部国际创新港科技有限公司 Electroplating tool and determination method for duplex blade test piece

Also Published As

Publication number Publication date
KR102494899B1 (en) 2023-02-06
CN115135814A (en) 2022-09-30
JP7090834B1 (en) 2022-06-27
WO2023053182A1 (en) 2023-04-06
CN115135814B (en) 2023-06-23

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